JPH0482887U - - Google Patents
Info
- Publication number
- JPH0482887U JPH0482887U JP12533090U JP12533090U JPH0482887U JP H0482887 U JPH0482887 U JP H0482887U JP 12533090 U JP12533090 U JP 12533090U JP 12533090 U JP12533090 U JP 12533090U JP H0482887 U JPH0482887 U JP H0482887U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- assembly structure
- area formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims 3
- 238000003780 insertion Methods 0.000 claims 3
- 238000010397 one-hybrid screening Methods 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12533090U JPH0482887U (h) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12533090U JPH0482887U (h) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482887U true JPH0482887U (h) | 1992-07-20 |
Family
ID=31872931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12533090U Pending JPH0482887U (h) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482887U (h) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003022024A1 (en) * | 2001-08-30 | 2003-03-13 | Fujitsu Limited | Printed board unit and electronic apparatus |
| JP2007173668A (ja) * | 2005-12-26 | 2007-07-05 | Kyocera Corp | 電子部品搭載用絶縁基体および電子装置 |
| JPWO2006082620A1 (ja) * | 2005-01-31 | 2008-08-07 | スパンション エルエルシー | 積層型半導体装置及び積層型半導体装置の製造方法 |
-
1990
- 1990-11-28 JP JP12533090U patent/JPH0482887U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003022024A1 (en) * | 2001-08-30 | 2003-03-13 | Fujitsu Limited | Printed board unit and electronic apparatus |
| JPWO2006082620A1 (ja) * | 2005-01-31 | 2008-08-07 | スパンション エルエルシー | 積層型半導体装置及び積層型半導体装置の製造方法 |
| JP4991518B2 (ja) * | 2005-01-31 | 2012-08-01 | スパンション エルエルシー | 積層型半導体装置及び積層型半導体装置の製造方法 |
| JP2007173668A (ja) * | 2005-12-26 | 2007-07-05 | Kyocera Corp | 電子部品搭載用絶縁基体および電子装置 |