JPH0482182A - Connector - Google Patents

Connector

Info

Publication number
JPH0482182A
JPH0482182A JP2197242A JP19724290A JPH0482182A JP H0482182 A JPH0482182 A JP H0482182A JP 2197242 A JP2197242 A JP 2197242A JP 19724290 A JP19724290 A JP 19724290A JP H0482182 A JPH0482182 A JP H0482182A
Authority
JP
Japan
Prior art keywords
terminal
soldering
ceramic substrate
connector device
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2197242A
Other languages
Japanese (ja)
Other versions
JP3019374B2 (en
Inventor
Hiroshi Matsui
博 松井
Fuminori Umemura
梅村 文則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2197242A priority Critical patent/JP3019374B2/en
Publication of JPH0482182A publication Critical patent/JPH0482182A/en
Application granted granted Critical
Publication of JP3019374B2 publication Critical patent/JP3019374B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PURPOSE:To provide an inexpensive connector in which no bad effect is applied to a condensor even if force is exerted to a terminal from the outside by using a condensor formed by printing and baking processes, on a ceramic substrate. CONSTITUTION:A T-shaped metal contact 21 comprises a linear part composed of a plag 22 and a first terminal 23, and a second terminal 24 bent form the intermediate part vertically. The second terminal 24 is elongated in a specified direction in parallel to a bottom wall 26 to serve as a connection terminal. A ceramic base 28 is fixed in parallel to a bottom wall 26 so that the first terminals 23 penetrate therethrough, on which base 28 a thick film condensor 30 is formed by pinting and baking processes. The ceramic base can be set only by soldering it to the first terminals 23 at the rear of connector and even if a large stress is applied to the terminals, no direct influence thereof is exerted to the condensor.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、通信機器・自動車用電装品等の高感度機器に
用いられ、外部からの障害電波の侵入および機器内で発
生した不要電波の輻射を除去するフィルターとしてのコ
ンデンサを内蔵するコネクタ装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is used in highly sensitive equipment such as communication equipment and automotive electrical equipment, and is used to prevent the intrusion of interference radio waves from the outside and the radiation of unnecessary radio waves generated within the equipment. The present invention relates to a connector device containing a built-in capacitor as a filter for removal.

従来の技術 従来の技術を第9図(A) 、  (B)〜第12図(
A)。
Conventional technology The conventional technology is shown in Figures 9 (A), (B) to Figure 12 (
A).

(B)のコネクタ装置により説明する。This will be explained using the connector device in (B).

図において、1は箱形の絶縁ハウシングで、その底面壁
2には一端にプラグ部3と他端に端子部4を有する複数
個の直線状接触子5が一定のピッチで貫通植設され、こ
の底面壁2の外側には、直接状接触子と接触しない様に
小孔6をあけた金属板7が重ねられ、更に各上記直線状
接触子5とこの金属板7との間にフィルターとしての円
環状コンデンサ8が、その上・下面9・10をそれぞれ
半田付けすることによって導通固定されている。
In the figure, 1 is a box-shaped insulating housing, and a plurality of linear contacts 5 having a plug part 3 at one end and a terminal part 4 at the other end are implanted through the bottom wall 2 at a constant pitch. A metal plate 7 with small holes 6 is stacked on the outside of the bottom wall 2 so as not to come into contact with the direct contacts, and a filter is further placed between each of the linear contacts 5 and this metal plate 7. An annular capacitor 8 is electrically connected and fixed by soldering its upper and lower surfaces 9 and 10, respectively.

また11は、このコネクタ装置全体をシールドするため
の金属ケースであり、上記金属板7と、この金属ケース
11とは上記金属板7の端部12を半田付けすることに
より導通している。
Reference numeral 11 denotes a metal case for shielding the entire connector device, and the metal plate 7 and the metal case 11 are electrically connected by soldering the ends 12 of the metal plate 7.

更に、各直線状接触子5の上記端子部4は、定の位置で
垂直方向に折曲げられて、使用機器のプリント基板に対
する接続端子となっている。
Further, the terminal portion 4 of each linear contact 5 is bent vertically at a predetermined position to serve as a connection terminal for a printed circuit board of the equipment used.

発明が解決しようとする課題 しかし、上記の構成のコネクタ装置においては、多数の
円環状コンデンサ8を半田付けするために、第12図(
A) 、 (B )の半田メツキ13を厚くつけた金属
板7の上に、第10図のように上・下面9・10に半田
付けの可能な処理をした円環状コンデンサ8をのせ、更
にその上にリング状の半田14をのせた状態で高温コン
ヘア類の中を通して、半田メツキ13およびリング状半
田14を溶融させて半田付けする方式がとられている。
Problems to be Solved by the Invention However, in the connector device having the above configuration, in order to solder a large number of annular capacitors 8, it is necessary to
On the metal plate 7 with thick solder plating 13 in A) and (B), place the annular capacitor 8 whose upper and lower surfaces 9 and 10 are treated to be solderable as shown in Fig. 10, and then A method is adopted in which a ring-shaped solder 14 is placed on top of the solder plate 13 and the ring-shaped solder 14 is melted and soldered by passing it through a high-temperature container.

しかしながら上記構成では、コンデンサ8をシールドケ
ース11に接続するために、半田メツキを厚くつけた金
属板7およびリング状半田14を必要とするためにコス
ト高となり、また半田付は用の装置として、高温コンヘ
ア類を必要とする。
However, in the above configuration, in order to connect the capacitor 8 to the shield case 11, the metal plate 7 with thick solder plating and the ring-shaped solder 14 are required, which increases the cost. Requires high temperature conditioner.

また、端子部4に大きな外力が加わって変形したり、変
形した端子を元に戻したりすると、端子根元部のコンデ
ンサ上・下の半田付は部9・10に応力が加わり、極端
な場合には、この半田付は部9・10やコンデンサ8自
体に損傷が生じる危険性があった。
In addition, if a large external force is applied to the terminal part 4 and it becomes deformed, or if the deformed terminal is returned to its original state, stress will be applied to the soldering parts 9 and 10 above and below the capacitor at the base of the terminal, and in extreme cases, However, this soldering risked damaging parts 9 and 10 and the capacitor 8 itself.

本発明は、この様な従来の課題を解決するものであり、
使用部品点数が少なく、−船釣な装置を使用してフィル
ター用コンデンサ部の半田付けができるので、組立てコ
ストが安くなり、また端子部に外力が加わってもコンデ
ンサ部に影響しないコネクタ装置の提供を目的とするも
のである。
The present invention solves these conventional problems,
To provide a connector device that uses a small number of parts, allows the soldering of the filter capacitor part using a boat fishing device, reduces assembly costs, and does not affect the capacitor part even if an external force is applied to the terminal part. The purpose is to

課題を解決するための手段 本発明は、上記課題を解決するために、接触子の形状を
丁字形として端子部を二虻所に分割し、一方の端子部を
絶縁ハウジングの後方に伸ばして、ここにフィルター用
の厚膜コンデンサを印刷形成したセラミック基板を取り
付けようとするものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention makes the shape of the contactor T-shaped, divides the terminal part into two parts, extends one terminal part to the rear of the insulating housing, The idea is to attach a ceramic substrate on which a thick film capacitor for a filter is printed.

作用 したがって、本発明によれば、フィルター用の厚膜コン
デンサをあらかじめセラミック基板上に印刷焼成して形
成しておくので、コネクタへの取り付けは、このセラミ
ック基板をコネクタ後方の第1の端子部に組合わせて半
田付けするだけてよく、また端子部に大きな応力が加わ
っても、コンデンサの部分には直接その影響を受けない
ものである。
Therefore, according to the present invention, a thick film capacitor for a filter is formed by printing and firing on a ceramic substrate in advance, so that attachment to the connector is done by attaching this ceramic substrate to the first terminal section at the rear of the connector. All that is required is to combine and solder them together, and even if a large stress is applied to the terminal portion, the capacitor portion will not be directly affected by it.

実施例 本発明の一実施例のコネクタ装置を第1図〜第8図によ
り説明する。
Embodiment A connector device according to an embodiment of the present invention will be explained with reference to FIGS. 1 to 8.

同図において、21は金属製丁字形接触子で、第3図に
示す様に、プラグ部22と第1端子部23から成る直線
部と、その中間から垂直方向に曲げられた第2端子部2
4とで構成されており、複数個の丁字形接触子21のプ
ラグ部22が絶縁ハウジング25の底面壁26に対して
、外側から垂直に開口部27に向って一定のピッチで貫
通植設され、複数個の第2端子部24が底面壁26に平
行な一定方向に伸ばされて、このコネクタ装置の装着機
器への接続端子となっている。
In the figure, reference numeral 21 denotes a metal T-shaped contact, which, as shown in FIG. 2
4, the plug portions 22 of the plurality of T-shaped contacts 21 are inserted through the bottom wall 26 of the insulating housing 25 vertically from the outside toward the opening 27 at a constant pitch. , a plurality of second terminal portions 24 extend in a certain direction parallel to the bottom wall 26, and serve as connection terminals for connecting the connector device to a mounting device.

そして、絶縁ハウジング25の底面壁26から後方へ突
出した複数個の第1端子部23には、セラミック基板2
8が底面壁26と平行に導通固定され、このセラミック
基板28には、上記第1端子部23のそれぞれと共通導
出部29七の間に接続される厚膜コンデンサ30が印刷
焼成法により形成されている。
A plurality of first terminal portions 23 protruding rearward from the bottom wall 26 of the insulating housing 25 are provided with a ceramic substrate 2.
A thick film capacitor 30 connected between each of the first terminal portions 23 and the common lead-out portion 297 is formed on this ceramic substrate 28 by a printing and firing method. ing.

ここで、このセラミック基板28の構成は、第4図(A
)、(B)に示すごと(、絶縁ハウシング25の底面壁
26よりも少し小さな長方形で、その一端に共通導出部
29用凸部29Aを有すると共に、前記複数個の接触子
21の各第1端子部23を通ずための貫通孔31が所定
の位置に設けられている。そして、各貫通孔の周囲に設
けられた半田付は用円形導体電極32と一体に印刷され
た各コンデンサ用主電極33に対して各誘電体層34が
重ねて印刷され、更にその上から共通導出部29の半田
付は用導体電極35と一体の各コンデンサ用グランド電
極36が印刷され、焼成することによって厚膜コンデン
サ30が形成されている。
Here, the configuration of this ceramic substrate 28 is shown in FIG.
), as shown in (B), it has a rectangular shape slightly smaller than the bottom wall 26 of the insulating housing 25, has a convex portion 29A for the common lead-out portion 29 at one end, and has a convex portion 29A for the common lead-out portion 29, and a convex portion 29A for each of the plurality of contacts 21. Through-holes 31 are provided at predetermined positions for passing through the terminal portions 23.The soldering provided around each through-hole is connected to the circular conductor electrodes 32 for each capacitor printed integrally. Each dielectric layer 34 is printed on top of the electrode 33, and each capacitor ground electrode 36, which is integrated with the conductor electrode 35 for soldering the common lead-out portion 29, is printed on top of that, and the thickness is increased by baking. A membrane capacitor 30 is formed.

なお、印刷電極33.36は互いに短絡しないように誘
電体34を間に挟み、その大きさは所要のコンデンサ容
量に合わせて設定されている。
Note that the dielectric material 34 is sandwiched between the printed electrodes 33 and 36 so as not to short-circuit each other, and the size of the printed electrodes 33 and 36 is set according to the required capacitance.

また、各コンデンサ用主電極33とグランド電極36と
の印刷順序を逆にして、第5図に示す様に、グランド電
極36を先に印刷し、その上に誘電体34および主電極
33を重ねて印刷してもよいことは勿論である。
Also, the printing order of the main electrode 33 for each capacitor and the ground electrode 36 is reversed, as shown in FIG. Of course, it may also be printed.

上記丁字形接触子21のセラミック基板28への取付け
は、セラミック基板28の所定の孔31に、接触子21
の第1端子部23の先端をセラミック基板28の裏面側
から挿入し、半田付は用導体電極32側へ突出した第1
端子部23のうち数個の先端を第7図のように折り曲げ
て抜けない様にし、そして、第8図のようにデイツプ半
田装置39にて、セラミック基板28の半田付は用電極
32側へ出ている全部の第1端子部23の先端とセラミ
ック基板28の半田付は用導体電極32に半田付けして
行う。
To attach the T-shaped contact 21 to the ceramic substrate 28, the contact 21 is inserted into a predetermined hole 31 of the ceramic substrate 28.
The tip of the first terminal portion 23 is inserted from the back side of the ceramic substrate 28, and the soldering is performed using the first terminal portion 23 protruding toward the conductor electrode 32 side.
Bend the tips of several of the terminal parts 23 as shown in FIG. 7 to prevent them from coming off, and solder the ceramic substrate 28 to the electrode 32 side using a dip soldering device 39 as shown in FIG. 8. The tips of all the exposed first terminal portions 23 and the ceramic substrate 28 are soldered to the conductive electrode 32.

この後に、絶縁ハウシング25の開口部27および複数
個の第2端子24の導出部を除いた絶縁ハウジング25
の外周およびセラミック基板28の後部を、金属製シー
ルドケース37で覆うと共に、プリント基板28の共通
導出部29七このシールドケースとを半田付は等により
導通させることによって、このコネクタ装置は完成され
るものである。
After this, the insulating housing 25 excluding the opening 27 of the insulating housing 25 and the lead-out portion of the plurality of second terminals 24 is
This connector device is completed by covering the outer periphery of the printed circuit board 28 and the rear part of the ceramic board 28 with a metal shield case 37, and connecting the common lead-out portion 297 of the printed circuit board 28 to this shield case by soldering or the like. It is something.

発明の効果 本発明は、上記実施例より明らかなように、(1)  
複数個のフィルター用厚膜コンデンサをあらかじめセラ
ミック基板上に印刷焼成して形成しておき、このセラミ
ック基板をコネクタの第1端子部に組合わせることによ
り、−度に総てのフィルターの取付けができる。
Effects of the Invention As is clear from the above examples, the present invention has (1)
By printing and firing multiple thick film capacitors for filters in advance on a ceramic substrate and assembling this ceramic substrate to the first terminal of the connector, all filters can be attached at once. .

(2)  前述の如く、フィルター用コンデンサの端子
部への半田取付けは、一般のデイツプ半田装置で簡単に
行なえるとともに、 (3)  第2の端子部と第1の端子部を接触子に設け
、第1の端子部にコンデンサを接続したので、第2の端
子部に大きな応力が加わってもその影響はコンデンサに
は及ばない。
(2) As mentioned above, the filter capacitor can be easily soldered to the terminal using a general dip soldering device, and (3) the second terminal and the first terminal can be attached to the contact. Since the capacitor is connected to the first terminal, even if a large stress is applied to the second terminal, the effect will not be on the capacitor.

などの効果を有するものである。It has the following effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のコネクタ装置の一実施例の斜視図、第
2図は同側断面図、第3図は同要部である丁字形接触子
の斜視図、第4図は同要部である厚膜コンデンサを形成
したセラミック基板であり、(A)は斜視図、(B)は
セラミック基板に形成された厚膜コンデンサの側断面図
、第5図は同地のセラミック基板の斜視図、第6図は同
主要部である絶縁ハウジング、丁字形接触子、セラミッ
ク基板の組込み状態を説明する斜視図、第7図は同第6
図の側断面図、第8図は同第6図の状態まで組込んだコ
ネクタ装置を半田付けする状態を示す説明図、第9図(
A)は従来のコネクタ装置の正面部分断面図、第9図(
B)は同側断面図、第10図は同分解斜視図、第11図
(A) 、 (B) 、 (C)は同コネクタ装置に使
用される円環状コンデンサの形状説明図、第12図(A
) 、 (B)は同円環状コンデンサのコネクタ装置へ
の取付状態を示す説明図である。 21・・・・・・丁字形接触子、22・・・・・・プラ
グ部、23・・・・・・第1端子部、24・・・・・・
第2端子部、25・・・・・・絶縁ハウシング、26・
・・・・・底面壁、27・・・・・・開口部、28・・
・・・・セラミック基板、30・・・・・・厚膜コンデ
ンサ。 代理人の氏名 弁理士 粟野重孝 はか1名第 図 寸 第3rI!J U〕 憾 怖 怖 第 図 第 図 第 図 第 図 (A) 第11図 第 図 (A) (B)
Fig. 1 is a perspective view of one embodiment of the connector device of the present invention, Fig. 2 is a sectional view of the same side, Fig. 3 is a perspective view of a T-shaped contact which is the main part, and Fig. 4 is the main part of the same. This is a ceramic substrate on which a thick film capacitor is formed. (A) is a perspective view, (B) is a side sectional view of the thick film capacitor formed on the ceramic substrate, and FIG. 5 is a perspective view of the same ceramic substrate. , FIG. 6 is a perspective view illustrating the assembled state of the main parts of the insulating housing, T-shaped contact, and ceramic board, and FIG.
Fig. 8 is an explanatory view showing a state in which the connector device assembled to the state shown in Fig. 6 is soldered, and Fig. 9 (
A) is a front partial sectional view of a conventional connector device, and FIG.
B) is a sectional view of the same side, Fig. 10 is an exploded perspective view of the same, Figs. (A
) and (B) are explanatory diagrams showing how the annular capacitor is attached to the connector device. 21... T-shaped contact, 22... Plug part, 23... First terminal part, 24...
Second terminal portion, 25... Insulation housing, 26.
...Bottom wall, 27...Opening, 28...
... Ceramic substrate, 30 ... Thick film capacitor. Name of agent: Patent attorney Shigetaka Awano Haka 1 person, size 3rI! J U] Fear, fear, fear (A) (A) (A) (B)

Claims (4)

【特許請求の範囲】[Claims] (1)一端にプラグ部、他端に第1の端子部、その中間
に第2の端子部を設けた接触子と、上記プラグ部を底面
壁の外側から開口部に向って垂直に貫通植設した絶縁ハ
ウジングと、一端が共通導出部に連接され他端が上記第
1の端子部に導通固定された上記共通導出部とともにセ
ラミック基板上に印刷・焼成により形成されたコンデン
サより構成されるコネクタ装置。
(1) A contact with a plug part at one end, a first terminal part at the other end, and a second terminal part in between, and the plug part is installed vertically from the outside of the bottom wall toward the opening. A connector consisting of a capacitor formed by printing and firing on a ceramic substrate, together with an insulating housing provided with an insulated housing, the common lead-out part having one end connected to the common lead-out part and the other end electrically fixed to the first terminal part. Device.
(2)厚膜コンデンサが印刷形成されたセラミック基板
上の複数個の半田付け用電極部それぞれに設けられた貫
通孔を複数個の第1の端子が貫通し、その電極部側に突
出した先端部と電極部を半田付け接合する構成とした請
求項1記載のコネクタ装置。
(2) A plurality of first terminals pass through through holes provided in each of a plurality of soldering electrode parts on a ceramic substrate on which a thick film capacitor is printed, and the tips protrude toward the electrode part side. 2. The connector device according to claim 1, wherein the part and the electrode part are joined by soldering.
(3)セラミック基板の半田付け用電極部と第1端子先
端部との半田付け接合部が、コネクタ装置の最後端に位
置する構成とした請求項1または2記載のコネクタ装置
(3) The connector device according to claim 1 or 2, wherein the soldering joint portion between the soldering electrode portion of the ceramic substrate and the first terminal tip portion is located at the rearmost end of the connector device.
(4)絶縁ハウジング開口部および第2端子導出側を除
いた絶縁ハウジング外周およびセラミック基板の後部を
金属製シールドケースで覆うと共に、セラミック基板か
らの共通導出部をこのシールドケースに導通させる構成
とした請求項1または2または3記載のコネクタ装置。
(4) The outer periphery of the insulating housing, excluding the insulating housing opening and the second terminal lead-out side, and the rear part of the ceramic board are covered with a metal shield case, and the common lead-out part from the ceramic board is electrically connected to this shield case. 4. A connector device according to claim 1, 2 or 3.
JP2197242A 1990-07-25 1990-07-25 Connector device Expired - Fee Related JP3019374B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2197242A JP3019374B2 (en) 1990-07-25 1990-07-25 Connector device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2197242A JP3019374B2 (en) 1990-07-25 1990-07-25 Connector device

Publications (2)

Publication Number Publication Date
JPH0482182A true JPH0482182A (en) 1992-03-16
JP3019374B2 JP3019374B2 (en) 2000-03-13

Family

ID=16371214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2197242A Expired - Fee Related JP3019374B2 (en) 1990-07-25 1990-07-25 Connector device

Country Status (1)

Country Link
JP (1) JP3019374B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017143249A (en) * 2016-01-07 2017-08-17 ヤザキ・ノース・アメリカ・インコーポレイテッドYazaki North America, Inc. Terminal-thermistor assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017143249A (en) * 2016-01-07 2017-08-17 ヤザキ・ノース・アメリカ・インコーポレイテッドYazaki North America, Inc. Terminal-thermistor assembly
US10115503B2 (en) 2016-01-07 2018-10-30 Yazaki North America, Inc. Terminal-thermistor assembly

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