JPH0864310A - Filter-built-in connector - Google Patents

Filter-built-in connector

Info

Publication number
JPH0864310A
JPH0864310A JP6201991A JP20199194A JPH0864310A JP H0864310 A JPH0864310 A JP H0864310A JP 6201991 A JP6201991 A JP 6201991A JP 20199194 A JP20199194 A JP 20199194A JP H0864310 A JPH0864310 A JP H0864310A
Authority
JP
Japan
Prior art keywords
terminal
insulating housing
hole
chip capacitor
side electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6201991A
Other languages
Japanese (ja)
Inventor
Tatsuyuki Fujii
樹之 藤井
Takayoshi Kishimoto
孝義 岸本
Nagatsune Yamagami
修凡 山上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6201991A priority Critical patent/JPH0864310A/en
Publication of JPH0864310A publication Critical patent/JPH0864310A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a filter-built-in connector which is not damaged by thermal stress and lower the assembly cost, regarding the filter-built-in connector which has a chip capacitor in the inside and is used for electronic apparatus, e.g. communication equipments, automotive electronic apparatuses, etc. CONSTITUTION: A pair of recessed parts 4a, 4b which can hold a chip capacitor 3 in an insulating housing 2 are formed in the vicinity of a terminal through hole 6 and its outer circumference and electrode parts 7 in the both ends of the chip capacitor 3 are press-inserted into the recessed parts 4a, 4b by plated metals 5a, 5b. Then, the chip capacitor 3 and a terminal 1 are press inserted to the insulating housing 2 respectively, so that the assembly cost can be lowered and thermal stress due to the difference between thermal expansion and contract coefficients can be prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、通信機器、自動車用電
装品等の高感度機器に用いられ、外部からの障害電波の
侵入および機器内で発生した不要電波の輻射を除去する
フィルタとしてのチップコンデンサを内蔵したフィルタ
内蔵コネクタに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in high-sensitivity equipment such as communication equipment and electrical equipment for automobiles, and is used as a filter for removing interference radio waves from the outside and unnecessary radio waves generated in the equipment. The present invention relates to a filter built-in connector having a built-in chip capacitor.

【0002】[0002]

【従来の技術】近年、フィルタ内蔵コネクタは通信機
器、自動車用電装品等の高感度機器のノイズ対策部品と
して使用されつつある。
2. Description of the Related Art In recent years, connectors with a built-in filter have been used as noise countermeasure parts for high-sensitivity equipment such as communication equipment and automobile electrical equipment.

【0003】図7(a),(b)により従来のフィルタ
内蔵コネクタについて説明する。同図によると、10は
絶縁ハウジングでその底面壁14には複数の端子9が一
定のピッチで貫通保持され、この底面壁14の外側には
直接端子9と接触しないように小孔15をあけた金属板
11が重ねられ、さらに各前記端子9とこの金属板11
との間にフィルタとしての円環状コンデンサ13がその
上・下面の電極をそれぞれ半田17により半田付けする
ことにより導通固着されている。
A conventional connector with a built-in filter will be described with reference to FIGS. 7 (a) and 7 (b). As shown in the figure, 10 is an insulating housing, and a plurality of terminals 9 are held through a bottom wall 14 of the housing at a constant pitch. A small hole 15 is formed on the outside of the bottom wall 14 so as not to directly contact the terminals 9. Metal plates 11 are stacked, and each of the terminals 9 and the metal plate 11 are stacked.
An annular capacitor 13 as a filter is electrically connected and fixed between and by soldering the electrodes on the upper and lower surfaces thereof with solder 17, respectively.

【0004】また、12はこのフィルタ内蔵コネクタ全
体をシールドするための金属ケースであり、上記金属板
11とこの金属ケース12とは半田18によって半田付
けすることにより導通固着されている。
Reference numeral 12 denotes a metal case for shielding the entire connector with a built-in filter. The metal plate 11 and the metal case 12 are electrically connected and fixed by soldering with a solder 18.

【0005】さらに、各端子9は一定の位置で垂直方向
に折りまげられ、使用機器のプリント基板に対する接続
端子となっており、16はプリント基板上のアースパタ
ーンへ接続するアース部である。
Further, each terminal 9 is bent at a fixed position in the vertical direction to serve as a connection terminal for a printed circuit board of a device used, and 16 is a grounding portion for connecting to a ground pattern on the printed circuit board.

【0006】以上のように構成されたフィルタ内蔵コネ
クタについて、以下その動作について説明する。まず、
各端子9を流れる伝導ノイズは円環状コンデンサ13に
よって除去され、除去された伝導ノイズは金属板11、
金属ケース12、アース部16を通り、プリント基板上
のアースパターンへと流れる。また、金属板11と金属
ケース12によってフィルタ内蔵コネクタはシールドさ
れ、輻射ノイズは遮蔽される。
The operation of the filter built-in connector configured as described above will be described below. First,
The conduction noise flowing through each terminal 9 is removed by the annular capacitor 13, and the removed conduction noise is removed by the metal plate 11,
It flows through the metal case 12 and the earth portion 16 to the earth pattern on the printed circuit board. Further, the metal plate 11 and the metal case 12 shield the connector with a built-in filter to shield radiation noise.

【0007】[0007]

【発明が解決しようとする課題】しかしながら上記の従
来の構成では、多数の円環状コンデンサ13を半田付け
するために、半田メッキを厚くつけた金属板11の上
に、半田付けの可能な処理をした円環状コンデンサ13
をのせ、さらにその上にリング状半田をのせた状態で高
温コンベア炉の中を通して、半田メッキおよびリング状
半田を溶融させて、各端子9と円環状コンデンサ13、
および円環状コンデンサ13と金属板11とを半田付け
し、その後、金属板11と金属ケース12を半田18に
よって半田付けしている。
However, in the above-mentioned conventional configuration, in order to solder a large number of annular capacitors 13, a process capable of soldering is performed on the metal plate 11 with thick solder plating. Ring-shaped capacitor 13
, The ring-shaped solder is further passed through the high-temperature conveyor furnace to melt the solder plating and the ring-shaped solder, and each terminal 9 and the annular capacitor 13,
The annular capacitor 13 and the metal plate 11 are soldered together, and then the metal plate 11 and the metal case 12 are soldered together with the solder 18.

【0008】そのため、半田メッキを厚くつけた金属板
11およびリング状半田を必要とするためにコスト高と
なり、半田付け用の装置として高温コンベア炉を必要と
していた。また、絶縁ハウジング10と金属板11の熱
膨脹収縮率の差により、熱応力が円環状コンデンサ13
に加わり、極端な場合には、円環状コンデンサ13に損
傷が生じるという課題を有していた。
Therefore, the metal plate 11 thickly solder-plated and the ring-shaped solder are required, resulting in high cost, and a high-temperature conveyor furnace is required as a soldering device. Further, due to the difference in thermal expansion and contraction rates of the insulating housing 10 and the metal plate 11, thermal stress is generated in the annular capacitor 13.
In addition, there is a problem that the annular capacitor 13 is damaged in an extreme case.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に本発明のフィルタ内蔵コネクタは、複数の端子を貫通
保持してなる絶縁ハウジングと複数のチップコンデンサ
とからなり、前記絶縁ハウジングにチップコンデンサを
保持し得る一対の凹部を端子貫通穴近傍と外周部に設
け、端子貫通穴と端子貫通穴近傍側に設けた一方の凹部
とがそれぞれ導通するように、ホット側電極として金属
メッキを施し、前記外周部の凹部側にはアース側電極と
して、前記ホット側電極とは一定の距離をもって金属メ
ッキを施してなり、金属メッキされた端子貫通穴に端子
を圧入し、ホット側電極である金属メッキと接触導通
し、かつチップコンデンサ両端の電極部をそれぞれ前記
絶縁ハウジングの端子貫通穴近傍と外周部の凹部に圧入
し、ホット側電極とアース側電極それぞれの金属メッキ
と接触導通させた構成としている。
In order to solve the above-mentioned problems, a filter built-in connector of the present invention comprises an insulating housing having a plurality of terminals penetratingly held and a plurality of chip capacitors, and the insulating housing has a chip capacitor. A pair of recesses that can hold the terminal through hole and the outer peripheral portion are provided, and one of the recesses provided near the terminal through hole and the terminal through hole is electrically connected, and metal plating is performed as the hot side electrode, As a ground-side electrode, a metal plating is applied to the recess side of the outer peripheral portion with a certain distance from the hot-side electrode, and the terminal is press-fitted into a metal-plated terminal through hole to form a metal-plated hot-side electrode. And the electrodes on both ends of the chip capacitor are press-fitted in the vicinity of the terminal through hole of the insulating housing and in the recesses of the outer periphery, respectively. Scan side electrodes respectively of the metal plating to be contact conduction is allowed configuration.

【0010】[0010]

【作用】この構成によって、使用部品は金属メッキされ
た絶縁ハウジングとチップコンデンサと端子だけでよ
く、組立方法はチップコンデンサと端子をそれぞれ絶縁
ハウジングへ圧入により行えるため、組み立てコストが
安く、またチップコンデンサと端子を同じ絶縁ハウジン
グに圧入することにより、熱膨脹収縮率の差より発生す
る熱応力を防止することができるものである。
With this configuration, the parts to be used are only the metal-plated insulating housing, the chip capacitor and the terminal, and the assembling method can be performed by press-fitting the chip capacitor and the terminal into the insulating housing, so that the assembling cost is low and the chip capacitor is low. By press-fitting the terminal and the terminal into the same insulating housing, it is possible to prevent the thermal stress generated due to the difference in thermal expansion and contraction rates.

【0011】[0011]

【実施例】以下本発明のフィルタ内蔵コネクタを図1,
図2の一実施例により説明する。同図において、2は複
数の端子1を貫通保持してなる絶縁ハウジングであり、
前記絶縁ハウジング2にチップコンデンサ3を保持し得
る一対の凹部4a,4bを端子貫通穴6近傍と外周部に
設け、端子貫通穴6と端子貫通穴6近傍側に設けた一方
の凹部4aとがそれぞれ導通するように、ホット側電極
として絶縁ハウジング2の突出部のみに金属メッキ5a
を施し、前記外周部の凹部4b側にはアース側電極とし
て、前記ホット側電極とは一定の距離をもって金属メッ
キ5bを施してなり、金属メッキされた端子貫通穴6に
端子1を圧入し、ホット側電極である金属メッキ5aと
接触導通し、かつチップコンデンサ3両端の電極部7を
それぞれ前記絶縁ハウジング2の端子貫通穴6近傍と外
周部の凹部4a,4bに圧入・保持し、ホット側電極と
アース側電極それぞれの金属メッキ5a,5bと接触導
通させた構成を有している(金属メッキ5aは絶縁ハウ
ジング2の突出部に行なわれているので各端子1間は電
気的に非導通となっている。)。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A filter built-in connector of the present invention is shown in FIG.
This will be described with reference to the embodiment shown in FIG. In the figure, 2 is an insulating housing that holds a plurality of terminals 1 through,
A pair of recesses 4a and 4b capable of holding the chip capacitor 3 in the insulating housing 2 are provided in the vicinity of the terminal through hole 6 and the outer peripheral portion, and the terminal through hole 6 and one recess 4a provided near the terminal through hole 6 are formed. As a hot-side electrode, metal plating 5a is provided only on the protruding portion of the insulating housing 2 so as to conduct electricity.
Then, metal plating 5b is applied to the recess 4b side of the outer peripheral portion as an earth side electrode with a certain distance from the hot side electrode, and the terminal 1 is press-fitted into the metal plated terminal through hole 6, The electrode portion 7 at both ends of the chip capacitor 3 is brought into contact with the metal plating 5a which is the hot side electrode, and is pressed and held in the vicinity of the terminal through hole 6 of the insulating housing 2 and the concave portions 4a and 4b of the outer peripheral portion, respectively. It has a structure in which the electrodes and the ground-side electrodes are brought into contact with the metal platings 5a and 5b respectively. (Since the metal plating 5a is formed on the protruding portion of the insulating housing 2, the terminals 1 are not electrically connected to each other. It is.).

【0012】さらに、各端子1は一定の位置で垂直方向
に折りまげられ、使用機器のプリント基板に対する接続
端子となっており、絶縁ハウジング2の突起部8はプリ
ント基板上のアースパターンへ接続する接続部である。
Further, each terminal 1 is vertically folded at a fixed position to serve as a connection terminal for a printed circuit board of a device used, and the protrusion 8 of the insulating housing 2 is connected to a ground pattern on the printed circuit board. It is a connection part.

【0013】以上のように構成されたフィルタ内部コネ
クタの動作について説明すると、まず、各端子1を流れ
る伝導ノイズは金属メッキ5aを通じチップコンデンサ
3によって除去され、除去された伝導ノイズは金属メッ
キ5bを通り、絶縁ハウジング2の突起部8がプリント
基板(図示せず)上のアースパターンへ接続されること
により外部へ流れる。また、金属メッキ5bによってフ
ィルタ内蔵コネクタはシールドされ、輻射ノイズは遮蔽
される。このとき、金属メッキ5bは可能なかぎり厚
く、かつ面積を大きくすることにより輻射ノイズの遮蔽
効果は向上する。
The operation of the filter internal connector constructed as above will be described. First, the conduction noise flowing through each terminal 1 is removed by the chip capacitor 3 through the metal plating 5a, and the removed conduction noise is removed by the metal plating 5b. As described above, the protrusion 8 of the insulating housing 2 is connected to the ground pattern on the printed circuit board (not shown) to flow to the outside. Further, the metal plating 5b shields the filter built-in connector and shields the radiation noise. At this time, the metal plating 5b is as thick as possible and has a large area to improve the radiation noise shielding effect.

【0014】以上のように本実施例によれば、金属メッ
キ5a,5bを施し、チップコンデンサ3を保持し得る
一対の凹部4a,4bを絶縁ハウジング2に設けること
により、フィルタ内蔵コネクタとしての基本機能を発揮
する使用部品は金属メッキされた前記絶縁ハウジング2
とチップコンデンサ3と端子1だけでよく、組立方法は
チップコンデンサ3と端子1を、それぞれ絶縁ハウジン
グ2の凹部4a,4bと端子貫通穴6へ圧入により行え
るため、半田付けを必要とせず、組立工数が少なく組み
立てコストが安くなり、コストダウンが可能となる。
As described above, according to the present embodiment, the metal plating 5a, 5b is applied, and the pair of recesses 4a, 4b capable of holding the chip capacitor 3 are provided in the insulating housing 2. The parts used to perform the function are the metal-plated insulating housing 2
The chip capacitor 3 and the terminal 1 can be assembled by pressing the chip capacitor 3 and the terminal 1 into the recesses 4a and 4b of the insulating housing 2 and the terminal through hole 6, respectively. The number of man-hours is small, the assembly cost is low, and the cost can be reduced.

【0015】また、チップコンデンサ3と端子1を同じ
絶縁ハウジング2に圧入することにより、熱膨脹収縮率
の差より発生する熱応力を防止するとともに、熱膨脹収
縮が発生したとしても、絶縁ハウジング2の凹部4a,
4bと、チップコンデンサ3の両端の電極部7の圧入部
の若干の変更で機械的応力を緩和し、チップコンデンサ
3の損傷を防止することも可能となる。
Further, by press-fitting the chip capacitor 3 and the terminal 1 into the same insulating housing 2, the thermal stress caused by the difference in thermal expansion / contraction rate is prevented, and even if the thermal expansion / contraction occurs, the concave portion of the insulating housing 2 is formed. 4a,
4b and the press-fitted portions of the electrode portions 7 at both ends of the chip capacitor 3 can be slightly changed to alleviate mechanical stress and prevent damage to the chip capacitor 3.

【0016】図3〜図6はそれぞれ本発明の他の実施例
を示すものであり、上記電極部7への圧入時の機械的応
力の緩和を図り、チップコンデンサ3の損傷を防止する
とともに、より適度な接触圧力の確保を狙ったものであ
る。
FIGS. 3 to 6 show other embodiments of the present invention, in which mechanical stress at the time of press-fitting into the electrode portion 7 is relieved to prevent damage to the chip capacitor 3 and This is aimed at securing a more appropriate contact pressure.

【0017】なお、以下の説明にあたっては図1の実施
例と同一部分は同一番号を付与し、説明を省略して説明
すると、4a1は端子1およびチップコンデンサ3の電
極7を圧入する金属メッキ5aが施された絶縁ハウジン
グ2の突出部間の溝部である。
In the following description, the same parts as those in the embodiment of FIG. 1 are designated by the same reference numerals, and the description will be omitted. 4a 1 is a metal plating for press-fitting the terminal 1 and the electrode 7 of the chip capacitor 3. 5a is a groove portion between the protrusions of the insulating housing 2.

【0018】上記実施例にあっては図1の実施例に比較
して、両側の突出部によって電極7を圧入挟持している
のみであるので、圧入による機械的応力が緩和されると
ともに、電気的接触は確保されている。なお、上記溝4
1内には端子1の貫通穴(図示せず)が勿論金属メッ
キ5aによって溝4a1内と導通するように設けられて
おり、以降の実施例でも同様である。
In the above embodiment, as compared with the embodiment of FIG. 1, since the electrodes 7 are only press-fitted and sandwiched by the protrusions on both sides, the mechanical stress due to the press-fitting is alleviated, and the electrical resistance is reduced. Physical contact is secured. In addition, the groove 4
The inside a 1 (not shown) through holes of the terminals 1 are provided to be electrically connected to the groove 4a 1 by course metal plating 5a, is the same in the following examples.

【0019】図4の他の実施例は絶縁ハウジング2の突
出部のチップコンデンサ3の電極7の挿入される側の反
対側を塞いだ溝4a2を設けたものであり、絶縁ハウジ
ング2の突出部の圧入に対する強度を高めるとともに、
端子1によって、チップコンデンサ3の電極7への機械
的応力の緩和を図ったものである。
In another embodiment of FIG. 4, a groove 4a 2 is provided which closes the protruding portion of the insulating housing 2 on the side opposite to the side where the electrode 7 of the chip capacitor 3 is inserted. While increasing the strength against press fitting of the part,
The terminal 1 is intended to relieve mechanical stress on the electrode 7 of the chip capacitor 3.

【0020】図5,図6は絶縁ハウジング2の突出部を
H形とし、端子1が挿入される溝6a,6b、チップコ
ンデンサ3の電極7が挿入される溝4a3,4a4を設け
たもので、図5,図6の実施例の相違点は上記突出部の
両側をつなぐ突出部の高さを図6のものは低くした点に
ある。
FIG. 5, FIG. 6 is a H-shaped protrusions of the insulating housing 2, a groove 6a of the terminal 1 is inserted, 6b, the groove 4a 3, 4a 4 where the electrode 7 of the chip capacitor 3 is inserted is provided However, the difference between the embodiments of FIGS. 5 and 6 is that the height of the protrusion connecting both sides of the protrusion is lowered in FIG.

【0021】即ち、図5のものは端子1が挿入される側
を溝としたので端子1挿入時の絶縁ハウジング2の突出
部に対する機械的応力の緩和を図るものであり、図6の
ものは、低くすることにより、更に、チップコンデンサ
3の電極7に加わる機械的応力も緩和するものである。
That is, in FIG. 5, the side into which the terminal 1 is inserted is formed as a groove, so that the mechanical stress on the projecting portion of the insulating housing 2 when the terminal 1 is inserted is relaxed, and that in FIG. 6 is. By lowering the mechanical stress, the mechanical stress applied to the electrode 7 of the chip capacitor 3 is further alleviated.

【0022】なお、上記各実施例では、チップコンデン
サ3の端子1を、それぞれ絶縁ハウジング2の凹部や溝
部又は端子貫通穴へ圧入しただけであるが、チップコン
デンサ3の対環境信頼性を向上させるために、モールド
材によってチップコンデンサ3を保護することが望まし
い。
In each of the above embodiments, the terminal 1 of the chip capacitor 3 is only press-fitted into the recess or groove of the insulating housing 2 or the terminal through hole, but the reliability of the chip capacitor 3 with respect to the environment is improved. Therefore, it is desirable to protect the chip capacitor 3 with a molding material.

【0023】[0023]

【発明の効果】以上のように本発明は、金属メッキを施
し、チップコンデンサ3を保持し得る一対の凹部を絶縁
ハウジングに設けることにより、組立工数が少なく、組
み立てコストが安くなり、コストダウンが可能となり、
また、熱膨脹収縮率の差より発生する熱応力による、チ
ップコンデンサ3の損傷を防止することが可能となる優
れたフィルタ内蔵コネクタを実現できるものである。
As described above, according to the present invention, metal plating is performed and a pair of recesses capable of holding the chip capacitor 3 are provided in the insulating housing, so that the number of assembling steps is small, the assembling cost is low, and the cost is reduced. Becomes possible,
Further, it is possible to realize an excellent connector with a built-in filter that can prevent the chip capacitor 3 from being damaged by the thermal stress generated by the difference in thermal expansion / contraction rate.

【0024】なお、絶縁ハウジングの突出部の外周部に
設けた凹部と端子貫通穴を有する溝によってチップコン
デンサの電極を圧入挟持させるものにあっては、一方の
電極を上記溝を形成する上記突出部の壁によって挟むの
で、電極圧入時の機械的応力の緩和も図れるものであ
る。
In the case where the electrode of the chip capacitor is press-fitted and sandwiched by the groove having the recess and the terminal through hole provided on the outer periphery of the protruding portion of the insulating housing, one of the electrodes forms the groove. Since it is sandwiched by the wall of the portion, it is possible to relieve the mechanical stress when the electrode is press-fitted.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のフィルタ内蔵コネクタの一実施例の要
部分解斜視図
FIG. 1 is an exploded perspective view of essential parts of an embodiment of a connector with a filter according to the present invention.

【図2】同斜視図FIG. 2 is a perspective view of the same.

【図3】同他の実施例の要部分解斜視図FIG. 3 is an exploded perspective view of a main part of the other embodiment.

【図4】同他の実施例の要部分解斜視図FIG. 4 is an exploded perspective view of a main part of the other embodiment.

【図5】同他の実施例の要部分解斜視図FIG. 5 is an exploded perspective view of essential parts of the other embodiment.

【図6】同他の実施例の要部分解斜視図FIG. 6 is an exploded perspective view of essential parts of the other embodiment.

【図7】(a)従来のフィルタ内蔵コネクタの正面断面
図 (b)同側断面図
FIG. 7A is a front sectional view of a conventional connector with a built-in filter, and FIG. 7B is a sectional view of the same side.

【符号の説明】[Explanation of symbols]

1 端子 2 絶縁ハウジング 3 チップコンデンサ 4a,4b 凹部 4a1,4a2,4a3,4a4 溝 5a,5b 金属メッキ 6 端子貫通穴 7 電極部1 Terminal 2 Insulation Housing 3 Chip Capacitor 4a, 4b Recess 4a 1 , 4a 2 , 4a 3 , 4a 4 Groove 5a, 5b Metal Plating 6 Terminal Through Hole 7 Electrode

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 複数の端子を貫通保持してなる絶縁ハウ
ジングと複数のチップコンデンサとからなるフィルタ内
蔵コネクタにおいて、前記絶縁ハウジングにチップコン
デンサを保持し得る一対の凹部を端子貫通穴近傍と外周
部に設け、端子貫通穴と端子貫通穴近傍側に設けた一方
の凹部とがそれぞれ導通するように、ホット側電極とし
て金属メッキを施し、前記外周部の凹部側にはアース側
電極として、前記ホット側電極とは一定の距離をもって
金属メッキを施してなり、金属メッキされた端子貫通穴
に端子を圧入し、ホット側電極である金属メッキと接触
導通し、かつチップコンデンサ両端の電極部をそれぞれ
前記絶縁ハウジングの端子貫通穴近傍と外周部の凹部に
圧入し、ホット側電極とアース側電極それぞれの金属メ
ッキと接触導通させたことを特徴とするフィルタ内蔵コ
ネクタ。
1. A connector with a built-in filter, which comprises an insulating housing having a plurality of terminals penetratingly held therein and a plurality of chip capacitors, wherein a pair of recesses capable of holding the chip capacitor are provided in the insulating housing in the vicinity of the terminal through hole and the outer peripheral portion. The metal is plated as the hot-side electrode so that the terminal through-hole and one recess provided near the terminal through-hole are electrically connected to each other. The side electrodes are metal-plated at a certain distance, and the terminals are press-fitted into the metal-plated terminal through holes to make contact with the metal plating that is the hot-side electrode, and the electrode parts at both ends of the chip capacitor are Press in the vicinity of the terminal through hole of the insulating housing and the concave part of the outer periphery to make contact with the metal plating of the hot side electrode and the ground side electrode respectively. A connector with a built-in filter.
【請求項2】 複数の端子を貫通保持してなる絶縁ハウ
ジングと複数のチップコンデンサとからなるフィルタ内
蔵コネクタにおいて、前記絶縁ハウジングの突出部にチ
ップコンデンサを保持し得る一対の凹部と溝部を、上記
凹部は外周部に、上記溝部には端子貫通穴を設け、端子
貫通穴と端子貫通穴を設けた溝部とがそれぞれ導通する
ように、ホット側電極として金属メッキを施し、前記外
周部の凹部側にはアース側電極として、前記ホット側電
極とは一定の距離をもって金属メッキを施してなり、金
属メッキされた端子貫通穴に端子を圧入し、ホット側電
極である金属メッキと接触導通し、かつチップコンデン
サ両端の電極部をそれぞれ前記絶縁ハウジングの溝部と
外周部の凹部に圧入し、ホット側電極とアース側電極そ
れぞれの金属メッキと接触導通させたことを特徴とする
フィルタ内蔵コネクタ。
2. A filter built-in connector comprising an insulating housing having a plurality of terminals penetratingly held therein and a plurality of chip capacitors, wherein a pair of recesses and grooves capable of holding a chip capacitor are provided on a protruding portion of the insulating housing. The concave portion is provided on the outer peripheral portion, and the terminal through hole is provided in the groove portion. Metal plating is applied as the hot side electrode so that the terminal through hole and the groove portion provided with the terminal through hole are electrically connected, respectively, and the concave portion side of the outer peripheral portion is provided. As a ground side electrode, metal plating is performed at a certain distance from the hot side electrode, the terminal is press-fitted into the metal plated terminal through hole, and the metal plating that is the hot side electrode is brought into contact conduction, and The electrodes on both ends of the chip capacitor are press-fitted into the groove of the insulating housing and the recess of the outer circumference, respectively, and the hot side electrode and the ground side electrode are plated with metal. A connector with a built-in filter, which is brought into contact with and electrically connected to.
JP6201991A 1994-08-26 1994-08-26 Filter-built-in connector Pending JPH0864310A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6201991A JPH0864310A (en) 1994-08-26 1994-08-26 Filter-built-in connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6201991A JPH0864310A (en) 1994-08-26 1994-08-26 Filter-built-in connector

Publications (1)

Publication Number Publication Date
JPH0864310A true JPH0864310A (en) 1996-03-08

Family

ID=16450138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6201991A Pending JPH0864310A (en) 1994-08-26 1994-08-26 Filter-built-in connector

Country Status (1)

Country Link
JP (1) JPH0864310A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6907658B2 (en) * 2001-06-26 2005-06-21 Intel Corporation Manufacturing methods for an electronic assembly with vertically connected capacitors
JP2007096223A (en) * 2005-09-30 2007-04-12 Fujitsu Ltd Feeder system with built-in capacitor to power supply pin of electric component
JP2012135175A (en) * 2010-12-24 2012-07-12 Toyota Industries Corp Electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6907658B2 (en) * 2001-06-26 2005-06-21 Intel Corporation Manufacturing methods for an electronic assembly with vertically connected capacitors
JP2007096223A (en) * 2005-09-30 2007-04-12 Fujitsu Ltd Feeder system with built-in capacitor to power supply pin of electric component
JP2012135175A (en) * 2010-12-24 2012-07-12 Toyota Industries Corp Electronic apparatus

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