JPH0480631U - - Google Patents
Info
- Publication number
- JPH0480631U JPH0480631U JP12360890U JP12360890U JPH0480631U JP H0480631 U JPH0480631 U JP H0480631U JP 12360890 U JP12360890 U JP 12360890U JP 12360890 U JP12360890 U JP 12360890U JP H0480631 U JPH0480631 U JP H0480631U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- mold
- electronic component
- molds
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Processing (AREA)
Description
第１図は本考案の一実施例の電子部品のリード
成形装置を示す斜視図、第２図は第１図における
リード保持部の先端部形状を示す側面図、第３図
は第１図のリード成形装置の動作を説明する断面
図、第４図は多数本のリードを有する電子部品及
び該部品をリード成形した状態を説明する説明図
、第５図は従来のリード成形装置の動作を説明す
る要部断面図、第６図は従来のリード成形装置に
よるリード成形部の切断状態を示す側面図である
。
１……電子部品、２……部品本体、３……リー
ド、１０……リード成形装置、１１……下型、１
１ａ……嵌合溝、１２……上型、１２ａ……嵌合
部、１３……リード保持部、１４……位置決めブ
ロツク、１５……スプリング、１６……ガイドシ
ヤフト。
FIG. 1 is a perspective view showing a lead forming apparatus for electronic components according to an embodiment of the present invention, FIG. 2 is a side view showing the shape of the tip of the lead holding part in FIG. 1, and FIG. 4 is an explanatory diagram illustrating an electronic component having a large number of leads and the state in which the component is formed into leads; FIG. 5 is a sectional view illustrating the operation of a conventional lead forming device; FIG. FIG. 6 is a side view showing a state in which a lead forming part is cut by a conventional lead forming apparatus. DESCRIPTION OF SYMBOLS 1...Electronic component, 2...Part body, 3...Lead, 10...Lead forming device, 11...Lower mold, 1
1a... Fitting groove, 12... Upper die, 12a... Fitting portion, 13... Lead holding portion, 14... Positioning block, 15... Spring, 16... Guide shaft.
Claims (1)
形状に成形する第１、第２の型であつて、第１の
型を固定し、これに対して第２の型を押し付けて
リード成形する一対の金型と、 前記第２の型を前記第１の型に押し付けてリー
ド成形を行うに際し、前記電子部品の部品本体側
リード部分を前記第１の型に対して押し付けて保
持するためのものであつて、リード成形時におい
て、その保持力が、前記電子部品の部品本体側リ
ード部分が前記金型に引き込まれる力よりも小さ
くなるように設定されるリード保持手段と、 リード成形する際に、前記電子部品の部品本体
を位置決めするためのものであつて、その部品本
体を前記第１の型に対して、成形時の引き込み移
動量よりも大きい所定距離をおいて位置決めする
位置決め手段と を具備したことを特徴とする電子部品のリード成
形装置。[Claims for Utility Model Registration] An electronic component having a lead; first and second molds that sandwich the lead of the electronic component and mold the lead into a predetermined shape, the first mold being fixed; A pair of molds for forming a lead by pressing a second mold against the mold; and a pair of molds for forming a lead by pressing a second mold against the first mold; The device is used to press and hold the electronic component against the first mold, and its holding force is smaller than the force with which the lead portion of the electronic component on the component body side is drawn into the mold during lead molding. a lead holding means configured to position the main body of the electronic component during lead molding, the main body of the electronic component being retracted and moved relative to the first mold during molding; 1. A lead forming apparatus for an electronic component, comprising: positioning means for positioning at a predetermined distance greater than the length of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12360890U JPH0480631U (en) | 1990-11-27 | 1990-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12360890U JPH0480631U (en) | 1990-11-27 | 1990-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480631U true JPH0480631U (en) | 1992-07-14 |
Family
ID=31871303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12360890U Pending JPH0480631U (en) | 1990-11-27 | 1990-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480631U (en) |
-
1990
- 1990-11-27 JP JP12360890U patent/JPH0480631U/ja active Pending
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