JPH0479649U - - Google Patents
Info
- Publication number
- JPH0479649U JPH0479649U JP1990121879U JP12187990U JPH0479649U JP H0479649 U JPH0479649 U JP H0479649U JP 1990121879 U JP1990121879 U JP 1990121879U JP 12187990 U JP12187990 U JP 12187990U JP H0479649 U JPH0479649 U JP H0479649U
- Authority
- JP
- Japan
- Prior art keywords
- led
- led array
- array head
- substrate
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990121879U JPH0479649U (OSRAM) | 1990-11-22 | 1990-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990121879U JPH0479649U (OSRAM) | 1990-11-22 | 1990-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479649U true JPH0479649U (OSRAM) | 1992-07-10 |
Family
ID=31869704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990121879U Pending JPH0479649U (OSRAM) | 1990-11-22 | 1990-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479649U (OSRAM) |
-
1990
- 1990-11-22 JP JP1990121879U patent/JPH0479649U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0479649U (OSRAM) | ||
| JPH0397952U (OSRAM) | ||
| JPS6336052U (OSRAM) | ||
| JPS6323867U (OSRAM) | ||
| JPS6117759U (ja) | 発光器 | |
| JPH0247069U (OSRAM) | ||
| JPS61123555U (OSRAM) | ||
| JPS63100896U (OSRAM) | ||
| JPS63172141U (OSRAM) | ||
| JPH02108033U (OSRAM) | ||
| JPH0292960U (OSRAM) | ||
| JPS6176963U (OSRAM) | ||
| JPH0399443U (OSRAM) | ||
| JPS60170285U (ja) | 自転車用照明装置 | |
| JPH0385674U (OSRAM) | ||
| JPH02135243U (OSRAM) | ||
| JPS62166642U (OSRAM) | ||
| JPH0247055U (OSRAM) | ||
| JPS6048266U (ja) | 半導体レ−ザ装置 | |
| JPH0426550U (OSRAM) | ||
| JPS6146745U (ja) | 集積回路装置の集中放熱機構 | |
| JPH0390957U (OSRAM) | ||
| JPS60172350U (ja) | Icソケツトにおける放熱装置 | |
| JPS6127337U (ja) | 半導体装置用ヘツダ | |
| JPS59171358U (ja) | 発光ダイオ−ド表示器 |