JPH0479490U - - Google Patents
Info
- Publication number
- JPH0479490U JPH0479490U JP12245090U JP12245090U JPH0479490U JP H0479490 U JPH0479490 U JP H0479490U JP 12245090 U JP12245090 U JP 12245090U JP 12245090 U JP12245090 U JP 12245090U JP H0479490 U JPH0479490 U JP H0479490U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electromagnetic shielding
- heating element
- shielding cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12245090U JPH0479490U (zh) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12245090U JPH0479490U (zh) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479490U true JPH0479490U (zh) | 1992-07-10 |
Family
ID=31870231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12245090U Pending JPH0479490U (zh) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479490U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027277A (ja) * | 2005-07-13 | 2007-02-01 | Fujitsu Ltd | 半導体パッケージ |
| WO2014049898A1 (ja) * | 2012-09-26 | 2014-04-03 | パナソニック株式会社 | 電子機器 |
-
1990
- 1990-11-26 JP JP12245090U patent/JPH0479490U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027277A (ja) * | 2005-07-13 | 2007-02-01 | Fujitsu Ltd | 半導体パッケージ |
| JP4630746B2 (ja) * | 2005-07-13 | 2011-02-09 | 富士通株式会社 | 半導体パッケージ |
| WO2014049898A1 (ja) * | 2012-09-26 | 2014-04-03 | パナソニック株式会社 | 電子機器 |
| JP5834175B2 (ja) * | 2012-09-26 | 2015-12-16 | パナソニックＩｐマネジメント株式会社 | 電子機器 |
| JPWO2014049898A1 (ja) * | 2012-09-26 | 2016-08-22 | パナソニックＩｐマネジメント株式会社 | 電子機器 |