JPH0478471A - Ultrasonic oscillator and production thereof - Google Patents
Ultrasonic oscillator and production thereofInfo
- Publication number
- JPH0478471A JPH0478471A JP18939890A JP18939890A JPH0478471A JP H0478471 A JPH0478471 A JP H0478471A JP 18939890 A JP18939890 A JP 18939890A JP 18939890 A JP18939890 A JP 18939890A JP H0478471 A JPH0478471 A JP H0478471A
- Authority
- JP
- Japan
- Prior art keywords
- metallic film
- conductive metallic
- radiation plate
- piezoelectric oscillator
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000005855 radiation Effects 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000010931 gold Substances 0.000 claims abstract description 11
- 229910052737 gold Inorganic materials 0.000 claims abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010453 quartz Substances 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 abstract description 16
- 230000001070 adhesive effect Effects 0.000 abstract description 16
- 238000007747 plating Methods 0.000 abstract description 4
- 238000007788 roughening Methods 0.000 abstract description 4
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract description 2
- 150000002343 gold Chemical class 0.000 abstract description 2
- 229910001120 nichrome Inorganic materials 0.000 abstract description 2
- 239000000615 nonconductor Substances 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000007740 vapor deposition Methods 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012811 non-conductive material Substances 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000005406 washing Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
【発明の詳細な説明】
(M東上の利用分野)
この発明は、超音波洗浄装置等に用いられる超音波振動
体及びその製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Application of M Tojo) The present invention relates to an ultrasonic vibrator used in an ultrasonic cleaning device, etc., and a method for manufacturing the same.
(従来の技術)
超音波洗浄装置等に用いられる超音波振動体には超音波
振動を空中あるいは液中に放射する輻射板が必要であり
、圧電振動子の輻射板への取付方法としてはボルト止め
タイプのものと接着タイプのものとか存在している。(Prior art) Ultrasonic vibrators used in ultrasonic cleaning equipment, etc. require a radiation plate that radiates ultrasonic vibrations into the air or into liquid, and the method of attaching the piezoelectric vibrator to the radiation plate is by bolts. There are fixed types and adhesive types.
第1図はボルト止めタイプの超音波振動体の一例であり
1図中1は輻射板、2はこの輻射板1に植設されたボル
ト、3はこのボルト2によって輻射板Iに固定された圧
電振動子である。Figure 1 shows an example of a bolt-fastened type ultrasonic vibrator. In the figure, 1 is a radiating plate, 2 is a bolt installed in this radiating plate 1, and 3 is fixed to a radiating plate I by this bolt 2. It is a piezoelectric vibrator.
又、1g2図は接着タイプの超音波振動体の一例であり
、圧電振動子3は接着剤4を介して導電性を有する輻射
板lに接着せしめられており、輻射板1には陰極5が、
圧電振動子3には陽極6がそれぞれ設けられている。In addition, Figure 1g2 is an example of an adhesive type ultrasonic vibrator, in which a piezoelectric vibrator 3 is bonded to a conductive radiation plate l via an adhesive 4, and a cathode 5 is attached to the radiation plate 1. ,
Each piezoelectric vibrator 3 is provided with an anode 6.
なお、100KHz以上の固有振動数を持つ振動子の場
合、この接着タイプが主流となっている。Note that this adhesive type is the mainstream for vibrators with a natural frequency of 100 KHz or more.
−力、輻射板の材質としては従来よりステンレス等の金
属材が多用されているが、金属材以外にも近年ではPV
C(塩化ビニール)、石英等か洗浄の際用いる液体の種
類に応じて採用されており、半導体製造の際用いられる
輻射板としては防塵性、耐蝕性の見地から石英か多く用
いられている。-Metal materials such as stainless steel have traditionally been widely used as materials for power and radiation plates, but in recent years, in addition to metal materials, PV
C (vinyl chloride), quartz, etc. are used depending on the type of liquid used for cleaning, and quartz is often used as a radiation plate used in semiconductor manufacturing from the standpoint of dustproofness and corrosion resistance.
しかし、この石英を輻射板とした場合1石英は導電性を
有しない為、圧電振動子の電極は輻射板から取ることか
できず、第3図に示す様に輻射板と圧電振動子との間に
金リボン7をはさみこみ。However, when this quartz is used as a radiation plate, the electrodes of the piezoelectric vibrator cannot be removed from the radiation plate because quartz has no conductivity, and as shown in Figure 3, the piezoelectric vibrator is connected to the radiation plate. Insert gold ribbon 7 in between.
この金リボン7を電極(陰極)として使用する様にした
り、第4図に示す様に回り込み電極構造の圧電振動子を
用いていた。This gold ribbon 7 was used as an electrode (cathode), or a piezoelectric vibrator having a wrap-around electrode structure was used as shown in FIG.
(解決すべき課題)
しかしながら、近年使用される振動子は高周波化かすす
み、6.8MHzでは200鉢mの板厚となり、一方、
使用される金リボン7の厚さは20gm程度である為、
これらにより輻射板を作った場合、接着箇所の厚みが負
荷として働き、輻射板の性能低下を招くことは避けられ
なかった。(Problems to be solved) However, the vibrators used in recent years have become increasingly high-frequency, and at 6.8 MHz, the plate thickness is 200 m.
Since the thickness of the gold ribbon 7 used is about 20 gm,
When a radiant plate is made using these materials, the thickness of the bonded area acts as a load, which inevitably leads to a decrease in the performance of the radiant plate.
又、金リボン7と振動子3との接合部には接着剤が介在
していないので、接着力か弱く、長時間の運転によりハ
ガレか生じる欠点かあった。一方、第4図に示す回り込
み電極構造の圧電振動子3の場合、陰極5の一部が陽極
6と同一面に存在することとなる為、陽極6の面積か十
分に確保できず、効率低下を招く欠点かあった。この発
明は、輻射板を有する石英等の非導電性を有する超音波
振動体に関する上記従来の課題を解決することを目的と
するものであり1石英等の不導体材を輻射板として用い
ても金属製輻射板と同等の性能を発揮させることができ
、しかも十分な強度を有し、耐久性にもすぐれている超
音波振動体及びその製造方法を提供せんとするものであ
る。In addition, since no adhesive is present at the joint between the gold ribbon 7 and the vibrator 3, the adhesive force is weak and there is a drawback that peeling may occur during long-term operation. On the other hand, in the case of the piezoelectric vibrator 3 with the wrap-around electrode structure shown in FIG. 4, a part of the cathode 5 exists on the same surface as the anode 6, so the area of the anode 6 cannot be secured sufficiently, resulting in a decrease in efficiency. There were some drawbacks that led to this. The purpose of this invention is to solve the above-mentioned conventional problems regarding non-conductive ultrasonic vibrators such as quartz having a radiating plate. It is an object of the present invention to provide an ultrasonic vibrating body that can exhibit performance equivalent to that of a metal radiation plate, has sufficient strength, and has excellent durability, and a method for manufacturing the same.
(課題を解決するための手段)
この発明は、不導体製の輻射板の裏面に導電性金属膜を
形成せしめ、この導電性金属膜に圧電振動子を接着せし
めると共に、前記導電性金属膜に陰極を設けて超音波振
動体を構成することより、上記課題を解決せんとするも
のである。(Means for Solving the Problems) This invention forms a conductive metal film on the back surface of a radiation plate made of a nonconductor, adheres a piezoelectric vibrator to the conductive metal film, and adheres a piezoelectric vibrator to the conductive metal film. The above problem is attempted to be solved by configuring an ultrasonic vibrator by providing a cathode.
(作 用)
圧電振動子3の共振周波数と同じ周波数の電圧を導電性
金属膜上の陰極及び圧電振動子3上の陽極から印加する
と、圧電振動子は振動を開始し、その振動は導電性金属
膜を介して輻射板に伝えられ、この輻射板から超音波と
して空中あるいは液中に放射され、超音波洗浄等の用に
供される。(Function) When a voltage with the same frequency as the resonant frequency of the piezoelectric vibrator 3 is applied from the cathode on the conductive metal film and the anode on the piezoelectric vibrator 3, the piezoelectric vibrator starts to vibrate, and the vibration is caused by the conductivity. The waves are transmitted to a radiation plate via a metal film, and are emitted from the radiation plate as ultrasonic waves into the air or into a liquid, and are used for purposes such as ultrasonic cleaning.
この際、導電性金属膜は従来の金リボンに比して著しく
薄い為、輻射板の性能低下をおこすξそれはなく、効率
の高い超音波の放射が可能である。At this time, since the conductive metal film is significantly thinner than the conventional gold ribbon, there is no deterioration in the performance of the radiation plate, and ultrasonic waves can be radiated with high efficiency.
又、長時間の運転により圧電振動子のハガレ等が生ずる
おそれもなく、すぐれた耐久性、@顕性を有する。In addition, there is no risk of peeling of the piezoelectric vibrator due to long-term operation, and it has excellent durability and sensitivity.
(実施例)
第5図はこの発明に係る超音波振動体の一実施例の断面
図である。(Embodiment) FIG. 5 is a sectional view of an embodiment of an ultrasonic vibrator according to the present invention.
図中1は石英等の非導電性の輻射板であり、この輻射板
lの表面には導電性金属膜8が形成されている。In the figure, reference numeral 1 denotes a non-conductive radiation plate made of quartz or the like, and a conductive metal film 8 is formed on the surface of this radiation plate l.
この導電性金属膜8を形成させる輻射板1の表面は、こ
の導電性金属膜8の接着強度を向上させる為、#600
相当の粗面加工が施されており、その板厚Tは接着され
る圧電振動子3の共振周波数Fと輻射板lの音速Cから
下記式により決定される。The surface of the radiation plate 1 on which this conductive metal film 8 is formed is made of #600 to improve the adhesive strength of this conductive metal film 8.
The surface has been subjected to considerable roughening, and its thickness T is determined from the resonance frequency F of the piezoelectric vibrator 3 to be bonded and the sound velocity C of the radiant plate 1 according to the following formula.
T=N−C/2・F (Nは整数)
ちなみに、共振周波数850KHzのPZT圧電振動子
を用いた場合、輻射板1の板厚は約3.5mm又はその
整数倍となる。T=N−C/2·F (N is an integer) By the way, when a PZT piezoelectric vibrator with a resonant frequency of 850 KHz is used, the thickness of the radiant plate 1 is about 3.5 mm or an integer multiple thereof.
導電性金属Wi8は、下地としてニクロムを500人程
度蒸着させた後、その上に金メツキを施し、この金メツ
キ層の厚さをlpm程度まて成長させたものであり、輻
射板1表面の粗面加工と蒸着前の適切な洗浄処理により
十分な密着強度を保持している。The conductive metal Wi8 is made by depositing about 500 nichrome as a base, then applying gold plating on top of it, and growing the gold plating layer to a thickness of about lpm. Sufficient adhesion strength is maintained through surface roughening and appropriate cleaning treatment before vapor deposition.
洗浄方法としては超音波洗浄とプラズマドライ洗浄の組
合せが最も効果的である。The most effective cleaning method is a combination of ultrasonic cleaning and plasma dry cleaning.
そして、この導電性金属膜8の上には圧電振動子3か接
着剤4によって接着せしめられている。The piezoelectric vibrator 3 is bonded onto the conductive metal film 8 using an adhesive 4.
この実施例においては、接着剤4としてはエポキシ系接
着剤を用い、導電性を確保する為、IKgの荷重をこの
圧電振動子3にかけて加熱硬化させている。更に、圧電
振動子3近傍の導電性金1uiB十二には陰極5が、圧
電振動子3上には陽極6かハンダ付けあるいは導電性接
着剤により形成されている。なお、通常の場合、一つの
輻射板1に複数の圧電振動子3を取付けるか、許容電流
値内てあれば陰極5は1箇所に設けるだけでも良い。In this embodiment, an epoxy adhesive is used as the adhesive 4, and in order to ensure conductivity, a load of I kg is applied to the piezoelectric vibrator 3 and the adhesive is heated and cured. Further, a cathode 5 is formed on the conductive gold 1uiB near the piezoelectric vibrator 3, and an anode 6 is formed on the piezoelectric vibrator 3 by soldering or conductive adhesive. Note that in normal cases, a plurality of piezoelectric vibrators 3 may be attached to one radiation plate 1, or the cathode 5 may be provided at only one location if the current value is within the allowable value.
そして、陰極5.陽極6間に圧電振動子3の共振周波数
と同じ周波数の電圧を印加すると、圧電振動子3は振動
を開始し、その振動は導電性金属膜8を介して輻射板1
に伝えられ、この輻射板1から超音波として空中あるい
は液中に放射される。and cathode 5. When a voltage with the same frequency as the resonant frequency of the piezoelectric vibrator 3 is applied between the anodes 6, the piezoelectric vibrator 3 starts to vibrate, and the vibration is transmitted to the radiation plate 1 through the conductive metal film 8.
and is emitted from the radiation plate 1 into the air or liquid as an ultrasonic wave.
(発明の効果)
この発明に係る超音波振動体は上記の通りの構成を有し
、導電性金属膜8と接着剤4の合計の厚さを従来のもの
に比して20分の1程度に減らすことかできる為、振動
系全体の共振周波数を圧電振動子3の共振周波数に近ず
けることかでき、効率の良い超音波の放射か可能である
。(Effects of the Invention) The ultrasonic vibrating body according to the present invention has the above-mentioned configuration, and the total thickness of the conductive metal film 8 and adhesive 4 is about 1/20th that of the conventional one. Since the resonant frequency of the entire vibration system can be brought close to the resonant frequency of the piezoelectric vibrator 3, efficient ultrasonic radiation can be achieved.
又、陰極5の面積を増大することが可能で、これらによ
り電気特性の向上を図ると共に導電性金属膜:膜8を圧
電振動子3から発生する熱の冷却に利用することかでき
、更に陰極は1箇所に設けるたけで良いため、配線を簡
略化てき、実用上極めてすぐれた効果を有するものであ
る。In addition, the area of the cathode 5 can be increased, thereby improving the electrical characteristics, and the conductive metal film 8 can be used to cool the heat generated from the piezoelectric vibrator 3. Because it only needs to be provided at one location, the wiring can be simplified and this has an extremely excellent practical effect.
1、輻射板 2.ボルト
3、圧電振動子 4.接着剤
5、#極 6.陽極
特 許 出 願 人 島田理化工業株式会社代 理
人 栂村繁部 外1名
第1図
第3図
第5図1. Radiant plate 2. Bolt 3, piezoelectric vibrator 4. Adhesive 5, #pole 6. Anode patent applicant Shimada Rika Kogyo Co., Ltd. Agent Shigebe Tsugamura and 1 other person Figure 1 Figure 3 Figure 5
Claims (4)
圧電振動子が接着せしめられていると共に前記導電性金
属膜の所望箇所には陰極が取付けられていることを特徴
とする超音波振動体。(1) A piezoelectric vibrator is bonded to the back surface of a nonconductive radiation plate via a conductive metal film, and a cathode is attached to a desired location on the conductive metal film. Ultrasonic vibrator.
特徴とする請求項1記載の超音波振動体。(2) The ultrasonic vibrator according to claim 1, wherein the conductive metal film is made of gold.
記載の超音波振動体。(3) Claim 1 characterized in that the radiation plate is made of quartz.
Ultrasonic vibrator described.
しめた後、この導電性金属膜に圧電振動子を接着せしめ
ると共に、前記導電性金属膜に陰極を取付けることを特
徴とする超音波振動体の製造方法。(4) After forming a conductive metal film on the back surface of a non-conductive radiation plate, a piezoelectric vibrator is adhered to this conductive metal film, and a cathode is attached to the conductive metal film. A method for manufacturing an ultrasonic vibrator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18939890A JPH0478471A (en) | 1990-07-19 | 1990-07-19 | Ultrasonic oscillator and production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18939890A JPH0478471A (en) | 1990-07-19 | 1990-07-19 | Ultrasonic oscillator and production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0478471A true JPH0478471A (en) | 1992-03-12 |
Family
ID=16240629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18939890A Pending JPH0478471A (en) | 1990-07-19 | 1990-07-19 | Ultrasonic oscillator and production thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0478471A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6698073B2 (en) * | 2000-02-22 | 2004-03-02 | Koninklijke Philips Electronics N.V. | Method of manufacturing a piezoelectric filter with an acoustic resonator situated on an acoustic reflector layer formed by a carrier substrate |
AT500807A1 (en) * | 2004-01-23 | 2006-03-15 | Austria Tech & System Tech | METHOD FOR MANUFACTURING A PCB LAYER ELEMENT AND PCB LAYERING ELEMENT |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6188700A (en) * | 1984-10-08 | 1986-05-06 | Hitachi Ltd | Piezoelectric element |
JPH0280397A (en) * | 1988-09-12 | 1990-03-20 | Matsushita Electric Ind Co Ltd | Ferroelectric thin film |
-
1990
- 1990-07-19 JP JP18939890A patent/JPH0478471A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6188700A (en) * | 1984-10-08 | 1986-05-06 | Hitachi Ltd | Piezoelectric element |
JPH0280397A (en) * | 1988-09-12 | 1990-03-20 | Matsushita Electric Ind Co Ltd | Ferroelectric thin film |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6698073B2 (en) * | 2000-02-22 | 2004-03-02 | Koninklijke Philips Electronics N.V. | Method of manufacturing a piezoelectric filter with an acoustic resonator situated on an acoustic reflector layer formed by a carrier substrate |
AT500807A1 (en) * | 2004-01-23 | 2006-03-15 | Austria Tech & System Tech | METHOD FOR MANUFACTURING A PCB LAYER ELEMENT AND PCB LAYERING ELEMENT |
AT500807B1 (en) * | 2004-01-23 | 2006-11-15 | Austria Tech & System Tech | METHOD FOR MANUFACTURING A PCB LAYER ELEMENT AND PCB LAYERING ELEMENT |
US7552525B2 (en) | 2004-01-23 | 2009-06-30 | AT & Saustria Technologie & Systemtechnik Aktiengesellschaft | Method for the production of a circuit board element |
US8039755B2 (en) | 2004-01-23 | 2011-10-18 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for manufacturing a printed circuit board element as well as a printed circuit board element |
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