JPH0477568A - Coating for forming piezoelectric buzzer and its electrode - Google Patents
Coating for forming piezoelectric buzzer and its electrodeInfo
- Publication number
- JPH0477568A JPH0477568A JP2186272A JP18627290A JPH0477568A JP H0477568 A JPH0477568 A JP H0477568A JP 2186272 A JP2186272 A JP 2186272A JP 18627290 A JP18627290 A JP 18627290A JP H0477568 A JPH0477568 A JP H0477568A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- electrode
- phenolic resin
- piezoelectric buzzer
- gold powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 title abstract description 11
- 238000000576 coating method Methods 0.000 title abstract description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000011134 resol-type phenolic resin Substances 0.000 claims abstract description 14
- 150000003839 salts Chemical class 0.000 claims abstract description 8
- 238000002834 transmittance Methods 0.000 claims abstract description 8
- 150000004671 saturated fatty acids Chemical class 0.000 claims abstract description 6
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims abstract description 6
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims abstract description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims abstract description 5
- -1 methylol group Chemical group 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 5
- 238000004566 IR spectroscopy Methods 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000003973 paint Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 229920006395 saturated elastomer Polymers 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000006467 substitution reaction Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 235000003441 saturated fatty acids Nutrition 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、圧電ブザー及びその電極形成用塗料に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a piezoelectric buzzer and a paint for forming electrodes thereof.
圧電ブザーは、第1図に示すようムこ、圧電振動子1の
両面に電極2を形成し、この電極2に、直接又は金属弾
性体3を介してリード線4を接続したものである。As shown in FIG. 1, the piezoelectric buzzer has electrodes 2 formed on both sides of a piezoelectric vibrator 1, and a lead wire 4 connected to the electrodes 2 either directly or via a metal elastic body 3.
この圧電ブザーにおける前記電極2は、従来から銀ペー
ストが用いられ、第3図に示すように、印刷により、そ
の銀ペーストが圧電振動子10両面に塗布されて電極2
が形成され、以後、同図に示すフローによって乾燥・焼
付は等が行われて、圧電ブザーが製造される。Silver paste has conventionally been used for the electrodes 2 in this piezoelectric buzzer, and as shown in FIG. 3, the silver paste is applied to both sides of the piezoelectric vibrator 10 by printing.
is formed, and thereafter, drying, baking, etc. are performed according to the flow shown in the figure, and a piezoelectric buzzer is manufactured.
上記圧電ブザーの圧電振動子1は、振動特性の面から極
力薄いことが望まれる。しかしながら、薄くすると従来
の乾燥・焼付は等による製造方法では前記焼付け(約8
00’C)後温潤雰囲気で直流電圧が印加されるとに電
極2において銀マイグレーションが生しる恐れがあって
、圧電振動子1の薄膜化を図れない問題がある。The piezoelectric vibrator 1 of the piezoelectric buzzer is desired to be as thin as possible from the viewpoint of vibration characteristics. However, when thinning the film, conventional manufacturing methods such as drying and baking require the baking (approximately 8
If a DC voltage is applied in a warm atmosphere after 00'C), there is a risk that silver migration will occur in the electrode 2, and there is a problem that the piezoelectric vibrator 1 cannot be made thinner.
上記a!膜化を図る方法として、金属銀粉末と熱硬化性
樹脂から成る導電性ペーストの塗膜を加熱硬化させる方
法が知られているが、この場合は導電性が低下し、絶縁
基体上への塗膜の密着性が悪いなどの問題があった。Above a! A known method for forming a film is to heat-cure a film of conductive paste made of metal silver powder and thermosetting resin, but in this case, the conductivity decreases and the coating on the insulating substrate becomes difficult. There were problems such as poor adhesion of the film.
そこで、この発明の課題は上記従来の銀ペーストの問題
点を解決するにあり、■良好な導電性を有する、■スク
リーン印刷、凹版印刷、が容品である、■絶縁基体上へ
の塗膜の密着性がよい、■細線回路が形成できる、■塗
膜上への半田付性と半田付強度がすぐれている、■半田
コートの導電回路の導電性が長期にわたって維持できる
金ペーストを提案するにある。Therefore, the object of this invention is to solve the above-mentioned problems of the conventional silver paste, which are as follows: 1) It has good conductivity, 2) It is suitable for screen printing and intaglio printing, and 2) It is suitable for coating on insulating substrates. We propose a gold paste that has good adhesion, ■ allows the formation of thin wire circuits, ■ has excellent solderability and soldering strength on the coating film, and ■ maintains the conductivity of the conductive circuit in the solder coat over a long period of time. It is in.
上記課題を解決するために、本発明にあっては、金属金
粉A85〜96重量%と、レゾール型フェノール樹脂8
15〜4重量%と、その両者A、Bの合計100重量部
に対して、飽和脂肪酸若しくは不飽和脂肪酸又はそれら
の金属塩0.1〜8重量部とから成り、前記レゾール型
フェノール樹脂Bは、それが有する2−1置換体、2.
4−2置換体、2.4.6−3置換体、メチロール基、
ジメチレンエーテル、フェニル基の赤外分光法による赤
外線透過率をl、
m、n、a、b、cとするとき、各透過率の間に!
(イ)l/n= 0.8〜1,2
(ロ)c/a= 0.8〜1.2
(ハ)l/n= 0.8〜1,2
(ニ)l/n= 1.2〜1.5
なる関係が成り立つペーストから成る圧電ブザー電極形
成用塗料を採用したのである。In order to solve the above problems, the present invention contains 85 to 96% by weight of metal gold powder A and 8% by weight of resol type phenolic resin.
15 to 4% by weight, and 0.1 to 8 parts by weight of saturated fatty acids or unsaturated fatty acids or metal salts thereof based on a total of 100 parts by weight of both A and B, and the resol type phenolic resin B , the 2-1 substitution it has, 2.
4-2-substituted product, 2.4.6-3-substituted product, methylol group,
When the infrared transmittance of dimethylene ether and phenyl group by infrared spectroscopy is defined as l, m, n, a, b, and c, there is a difference between each transmittance! (a) l/n = 0.8-1,2 (b) c/a = 0.8-1.2 (c) l/n = 0.8-1,2 (d) l/n = 1 A piezoelectric buzzer electrode forming paint made of a paste satisfying the following relationship was adopted.
上記金属金粉Aは、平均粒子径が0.1〜20−2好ま
しくは1n以下とする。The metal gold powder A has an average particle diameter of 0.1 to 20-2, preferably 1n or less.
そして、圧電振動子の両面に、上述した構成のペースト
から成る電極を形成し、この電極に直接又は弾性体を介
してリード線を接続して成る圧電ブザーを構成したので
ある。Then, electrodes made of the paste having the above-described structure were formed on both sides of the piezoelectric vibrator, and lead wires were connected to the electrodes either directly or through an elastic body, thereby constructing a piezoelectric buzzer.
上記のように構成したこの発明による金ペーストは、金
属金粉の配合量が85重量%未満では、半田付性が悪く
なり、逆に96重量%を超えるときは、金属金粉が十分
にバインドされず、得られる電極も脆くなり、所望の半
田付強度が得られず、導電性が低下すると共にスクリー
ン印刷性も悪くなる。In the gold paste according to the present invention configured as described above, if the amount of metal gold powder blended is less than 85% by weight, the solderability will be poor, and if it exceeds 96% by weight, the metal gold powder will not be sufficiently bound. The resulting electrode also becomes brittle, the desired soldering strength cannot be obtained, the electrical conductivity decreases, and the screen printability also deteriorates.
好ましくは、樹脂との配合において88重量%以上、さ
らに好ましくは90〜93重量%とする。Preferably, the content in the blend with the resin is 88% by weight or more, more preferably 90 to 93% by weight.
使用するレゾール型フェノール樹脂について、その化学
量、2−1置換体量をλ、2.4−2置換体量をμ、2
.4.6−3置換体蓋をν、メチロール基量をα、ジメ
チレンエーテル量をβ、フェニル基量をγとすると、前
記構成の一一が大きいということは、−仁、土が
n
ν ν小さいということになる。すな
わち、2−1置換体量λ、2.4−2置換体量μ、に比
して、2.4.6−3置換体量をνが多いということを
意味する。Regarding the resol type phenolic resin used, its chemical amount, the amount of 2-1 substitution product is λ, the amount of 2.4-2 substitution product is μ, 2
.. 4.6-3 If the substituent cap is ν, the amount of methylol group is α, the amount of dimethylene ether is β, and the amount of phenyl group is γ, the fact that the above structure is large means that -ren, soil is n
This means that ν ν is small. That is, it means that the amount of 2.4.6-3 substitution product ν is larger than the amount of 2-1 substitution product λ and the amount of 2.4-2 substitution product μ.
また、前記構成の」し、−が大きいといa
a
うことは、 S 、上が小さいということにα
α
なる、すなわち、ジメチレンエーテル量β、フェニル基
量γに比して、メチロール基量αが多いということを意
味する。In addition, if `` and -'' in the above configuration are large, a
a The fact that S is small above α
α, that is, it means that the amount of methylol groups α is larger than the amount of dimethylene ether β and the amount of phenyl groups γ.
一般に2.4.6−3置換体量νが大きくなると、レゾ
ール型フェノール樹脂の架橋密度が大きくなるため、前
記−L −Lが小さい方が、ν ν
すなわち、」し −が大きい方が電極の導n
n
電性は良くなる。しかし、逆に電極が硬く、脆くなる傾
向を示し、物理的特性が悪くなる。In general, as the amount ν of 2.4.6-3 substituents increases, the crosslinking density of the resol type phenolic resin increases. The guidance of
n Electricity improves. However, on the contrary, the electrode tends to become hard and brittle, resulting in poor physical properties.
また、1が小さいと電極の半田付性が悪くなリ、□が大
きいと電極の導電性が悪くなる。Furthermore, if 1 is small, the solderability of the electrode will be poor, and if □ is large, the conductivity of the electrode will be poor.
α
従って、得られる電極の硬さを適切にし、良好な導電性
と半田付性とを兼備するレゾール型フェノール樹脂とし
ては、前記構成に示す
1 m b
□ □がそれぞれ0.8〜1.2、
n n a□が1.2〜
1.5とするのが適している。α Therefore, as a resol type phenolic resin that makes the hardness of the obtained electrode appropriate and has both good conductivity and solderability, 1 m b □ □ shown in the above structure is 0.8 to 1.2, respectively. , n n a □ is 1.2 ~
A value of 1.5 is suitable.
レゾール型フェノール樹脂の配合量は、4重量%未満で
は、金属金粉が十分にバインドされず、得られる電極も
脆くなり、導電性が低下すると共にスクリーン印刷性が
悪くなる。逆に15重量%を超えるときは、半田付性が
好ましいものとならない。If the amount of the resol type phenolic resin is less than 4% by weight, the metal gold powder will not be sufficiently bound, and the resulting electrode will become brittle, resulting in decreased conductivity and poor screen printability. On the other hand, if it exceeds 15% by weight, the solderability will not be favorable.
飽和脂肪酸若しくは不飽和脂肪酸又はそれら金属塩とは
、飽和脂肪酸にあっては、炭素数16〜20のパルチミ
ン酸、ステアリン酸、アラキン酸など、不飽和脂肪酸に
あっては炭素数16〜18のシーマリン酸、オレイン酸
、リルン酸などで、それらの金属塩にあってはカリウム
、銅、アルミニウム、ナトリウム、亜鉛などの金属との
塩である。Saturated fatty acids, unsaturated fatty acids, or metal salts thereof include saturated fatty acids such as palmitic acid, stearic acid, and arachidic acid having 16 to 20 carbon atoms, and unsaturated fatty acids such as seamarin having 16 to 18 carbon atoms. acids, oleic acid, lyric acid, etc., and their metal salts include salts with metals such as potassium, copper, aluminum, sodium, and zinc.
これらの分散剤の使用は、金属金粉とレゾール型フェノ
ール樹脂との配合において、金属金粉の樹脂中への微細
分散を促進し、導電性の良好な電極を形成するので好ま
しい。The use of these dispersants is preferable in blending the metal gold powder with the resol type phenolic resin because it promotes fine dispersion of the metal gold powder into the resin and forms an electrode with good conductivity.
飽和脂肪酸若しくは不飽和脂肪酸又はそれらの金属塩の
配合量は、金属金粉とレゾール型フェノール樹脂の合計
量100重量部に対して0.1〜8重量部の範囲で用い
られ、好ましくは1〜3重量部である。The blending amount of saturated fatty acids, unsaturated fatty acids, or metal salts thereof is in the range of 0.1 to 8 parts by weight, preferably 1 to 3 parts by weight, based on 100 parts by weight of the total amount of metal gold powder and resol type phenolic resin. Parts by weight.
前記分散剤の配合量が、0.1重量部未満では、金属金
粉の微細分散性が期待できず、逆に8重重部を超えると
きは、電極の導電性を低下させ、電極と圧電振動子との
密着性の低下をまねくので好ましくない。If the amount of the dispersant is less than 0.1 parts by weight, fine dispersion of the metal gold powder cannot be expected, and if it exceeds 8 parts by weight, the conductivity of the electrode will be reduced and the electrodes and piezoelectric vibrator may be damaged. This is not preferable because it leads to a decrease in adhesion with the material.
本発明に係る金ペーストには、粘度調節をするために、
通常の有機溶剤を適宜使用することができる。例えば、
ブチルカルピトール、ブチルカルピトールアセテート、
ブチルセロソルブ、メチルイソブチルケトン、トルエン
、キシレンなどの公知の溶剤である。In order to adjust the viscosity, the gold paste according to the present invention includes:
Conventional organic solvents can be used as appropriate. for example,
Butyl carpitol, butyl carpitol acetate,
These are known solvents such as butyl cellosolve, methyl isobutyl ketone, toluene, and xylene.
粒径1nの金属金粉、表1に示す赤外線透過率比のレゾ
ール型フェノール樹脂、オレイン樹脂カリウムをそれぞ
れ表2に示す割合で配合(重量部)し、溶剤として若干
のブチルカルピトールを加えて、20分間三輪ロールで
混練して金ペーストを調整した。とくに、実施例3は、
金属金粉平均粒径が=1μ、同2は、同平均粒径:0.
5−とした。Metallic gold powder with a particle size of 1n, a resol type phenolic resin with an infrared transmittance ratio shown in Table 1, and an oleic resin potassium were mixed in the proportions shown in Table 2 (parts by weight), and some butyl calpitol was added as a solvent. The gold paste was prepared by kneading with a tricycle roll for 20 minutes. In particular, Example 3
The metal gold powder average particle size is 1μ, and 2 is the same average particle size: 0.
It was set as 5-.
この各実施例を、第2図のフローに示すようにスクリー
ン印刷により圧電振動子1の疑似基板両面に塗布して電
極2を形成し、その電極2の諸特性を見るために、まず
、その電極2付の各圧電振動子1を有機酸系のフラック
ス槽に4秒間浸漬し、次いで250°Cの溶融半田槽(
Pb/5n=40/60 )中に5秒間浸漬して引上げ
ると同時に2〜6.0気圧、220〜230”Cの熱風
を吹きつけた後、洗浄した。As shown in the flowchart of FIG. 2, each of these examples is coated on both sides of the pseudo substrate of the piezoelectric vibrator 1 by screen printing to form the electrodes 2. In order to examine the various characteristics of the electrodes 2, first, Each piezoelectric vibrator 1 with electrode 2 was immersed in an organic acid flux bath for 4 seconds, and then immersed in a 250°C molten solder bath (
It was immersed in Pb/5n=40/60) for 5 seconds, pulled up, and simultaneously blown with hot air at 2 to 6.0 atm and 220 to 230''C, and then washed.
このとき、電極2に半田付された半田コート厚は平均1
0μであった。At this time, the average thickness of the solder coat soldered to the electrode 2 is 1
It was 0μ.
この過程で得た電極2の諸特性を調べた結果を表2に示
す。Table 2 shows the results of examining various characteristics of the electrode 2 obtained through this process.
ここに、電極の導電性とは、加熱硬化された電極2の体
積固有抵抗を測定した値である。Here, the electrical conductivity of the electrode is a value obtained by measuring the volume resistivity of the electrode 2 that has been heat-cured.
電極の密着性とはJIS K5400(1979)の基
盤目試験方法に準して、電極となる塗膜上に互に直交す
る縦横11本づつの平行線を1胚の間隔で引いて、ld
中に100個のます目ができるように基盤目状の切り傷
を付け、その上からセロハンテープで塗膜を引きはがし
たときに、絶縁基板上に残る塗膜の基盤目個数を求めた
ものである。The adhesion of the electrode is determined by drawing 11 parallel lines perpendicular to each other at intervals of one embryo on the coating film that will become the electrode, in accordance with the base test method of JIS K5400 (1979).
When a cut is made in the shape of a substrate so that 100 squares are formed inside, and the coating film is peeled off with cellophane tape, the number of substrate squares remaining on the insulating substrate is determined. It is.
半田付性とは、電極2上に半田付された状態を低倍率の
実体顕微鏡によって観察し、下記の基準によって評価し
た。Solderability was evaluated by observing the soldered state on the electrode 2 using a low magnification stereoscopic microscope and using the following criteria.
○印:表面平滑で全面に半田が付着しているもの
△印:部分的に電極が露出しているもの×印:部分的に
しか半田が付着していないもの印刷性とは、粘度調整し
て得られた金ペーストを用いてスクリーン印刷法により
電極2を形成するに際して、その印刷の容易性を観察し
、下記の基準により評価した。○ mark: The surface is smooth and the solder is adhered to the entire surface. △ mark: The electrode is partially exposed. × mark: The solder is only partially attached. Printability refers to the viscosity adjustment. When forming the electrode 2 by screen printing using the gold paste obtained in the above, the ease of printing was observed and evaluated according to the following criteria.
O印:電極2の形成が良好なもの
△印:電極2の形成が稍々困難なもの
×印:1を極2の形成が困難なもの
次に、半田付強度とは、ガラス・エポキシ樹脂基板(例
えば、G10)上に直径3鵬φのランドで、厚さが25
〜30−の塗膜を形成させ、 130〜180°C×1
0〜60分間加熱して塗膜を硬化させた後、そのランド
上にリード線(0,1wφの錫メツキ軟銅線)を垂直に
半田付(63Snの共晶半田を使用)をし、前記基板を
固定して50m/分の引張速度でリード線を垂直に引張
り、その強度を求めたものである。O mark: Good formation of electrode 2 △ mark: Somewhat difficult to form electrode 2 × mark: 1 is difficult to form electrode 2 Next, soldering strength refers to glass/epoxy resin A land with a diameter of 3 φ and a thickness of 25 mm is placed on the substrate (for example, G10).
Form a coating film of ~30°C, 130~180°C x 1
After curing the coating film by heating for 0 to 60 minutes, a lead wire (tin-plated annealed copper wire of 0.1 wφ) is vertically soldered (using 63Sn eutectic solder) onto the land, and The lead wire was pulled vertically at a pulling speed of 50 m/min with the lead wire fixed, and its strength was determined.
この結果かられかるように、各実施例は、特定の配合材
料が適切に組合わされているので、電極(塗膜)の導電
性、電極の密着性、半田付性、半田付強度、印刷性など
の緒特性が良好なものとなる。また、得られた硬化電極
に通常の有機酸系のフラックス剤を用いて直接半田付を
施すことができる。As can be seen from the results, each example has an appropriate combination of specific compounded materials, resulting in improved conductivity of the electrode (coating film), adhesion of the electrode, solderability, soldering strength, and printability. It has good properties such as: Further, the obtained cured electrode can be directly soldered using a normal organic acid fluxing agent.
次に、比較例についてみると、比較例1.2.3は使用
するレゾール型フェノール樹脂の赤外線透過率比が適切
でないため、好ましい半田付性をもつ電極2が得られな
い。比較例4は、金属金粉が少ないため、半田付におい
て圧電振動子1の部分的にしか半田が付着しないので好
ましくない。Next, regarding Comparative Examples, in Comparative Examples 1, 2, and 3, the infrared transmittance ratio of the resol-type phenolic resin used was not appropriate, and therefore the electrode 2 with preferable solderability could not be obtained. Comparative Example 4 is not preferable because the amount of metal gold powder is small, so that the solder only partially adheres to the piezoelectric vibrator 1 during soldering.
比較例5は、金属金粉が多く、金属金粉が十分にバイン
ドされないため、電極の導電性が不安定であって、得ら
れる電極2も脆く、又スクリーン印刷性が稍々困難で好
ましくない。In Comparative Example 5, there is a large amount of metal gold powder and the metal gold powder is not sufficiently bound, so the conductivity of the electrode is unstable, the obtained electrode 2 is also brittle, and screen printing is somewhat difficult, which is not preferable.
以上詳細に説明した如く、本発明に係る電極形成用塗料
を用いて電極を形成した圧電ブザーは、電極形成の際に
焼付けを必要としないため製作性が向上し、かつその焼
付後の湿潤雰囲気下におけるマイグレーションの恐れも
ないため、圧電振動子の薄膜化を図り得る効果がある。As explained in detail above, the piezoelectric buzzer in which electrodes are formed using the electrode forming paint according to the present invention has improved manufacturability because baking is not required when forming the electrodes, and a moist atmosphere is provided after baking. Since there is no fear of migration underneath, there is an effect that the piezoelectric vibrator can be made thinner.
第1図は、本発明に係る圧電ブザーの一実施例の概略図
、第2図は同実施例の製作説明図、第3図は従来の製作
説明図である。
1・・・・・・圧電振動子、 2・・・・・・電極、3
・・・・・・金属弾性体、 4・・・・・・リード線わ
表1
以下余白
以下余白FIG. 1 is a schematic diagram of an embodiment of a piezoelectric buzzer according to the present invention, FIG. 2 is an explanatory diagram of manufacturing the same embodiment, and FIG. 3 is an explanatory diagram of conventional manufacturing. 1... Piezoelectric vibrator, 2... Electrode, 3
......Metal elastic body, 4...Lead wires Table 1 Below margins Below margins
Claims (3)
ノール樹脂B15〜4重量%と、その両者A、Bの合計
100重量部に対して、飽和脂肪酸若しくは不飽和脂肪
酸又はそれらの金属塩0.1〜8重量部とから成り、前
記レゾール型フェノール樹脂Bは、それが有する2−1
置換体、2、4−2置換体、2、4、6−3置換体、メ
チロール基、ジメチレンエーテル、フェニル基の赤外分
光法による赤外線透過率をl、m、n、a、b、cとす
るとき、各透過率の間に (イ)l/n=0.8〜1.2 (ロ)m/n=0.8〜1.2 (ハ)b/a=0.8〜1.2 (ニ)c/a=1.2〜1.5 なる関係が成り立つペーストから成る圧電ブザー電極形
成用塗料。(1) 85 to 96% by weight of metal gold powder A, 15 to 4% by weight of resol type phenolic resin B, and 0.00% of saturated fatty acid or unsaturated fatty acid or a metal salt thereof for a total of 100 parts by weight of both A and B. 1 to 8 parts by weight, and the resol type phenolic resin B has 2-1 parts by weight.
The infrared transmittance of the substituted product, 2, 4-2 substituted product, 2, 4, 6-3 substituted product, methylol group, dimethylene ether, and phenyl group by infrared spectroscopy is determined by l, m, n, a, b, When c, between each transmittance (a) l/n = 0.8 to 1.2 (b) m/n = 0.8 to 1.2 (c) b/a = 0.8 to 1.2 (d) A piezoelectric buzzer electrode forming paint comprising a paste satisfying the following relationship: c/a = 1.2 to 1.5.
mとしたことを特徴とする請求項(1)に記載の圧電ブ
ザー電極形成用塗料。(2) The metal gold powder A has an average particle diameter of 0.1 to 20μ
The paint for forming a piezoelectric buzzer electrode according to claim 1, characterized in that m.
のペーストからなる電極を形成し、この電極に直接又は
弾性体を介してリード線を接続して成る圧電ブザー。(3) A piezoelectric buzzer comprising electrodes made of the paste according to claim (1) formed on both sides of a piezoelectric vibrator, and lead wires connected to the electrodes directly or via an elastic body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2186272A JPH0477568A (en) | 1990-07-13 | 1990-07-13 | Coating for forming piezoelectric buzzer and its electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2186272A JPH0477568A (en) | 1990-07-13 | 1990-07-13 | Coating for forming piezoelectric buzzer and its electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0477568A true JPH0477568A (en) | 1992-03-11 |
Family
ID=16185394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2186272A Pending JPH0477568A (en) | 1990-07-13 | 1990-07-13 | Coating for forming piezoelectric buzzer and its electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0477568A (en) |
-
1990
- 1990-07-13 JP JP2186272A patent/JPH0477568A/en active Pending
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