JPH04765U - - Google Patents
Info
- Publication number
- JPH04765U JPH04765U JP1990039088U JP3908890U JPH04765U JP H04765 U JPH04765 U JP H04765U JP 1990039088 U JP1990039088 U JP 1990039088U JP 3908890 U JP3908890 U JP 3908890U JP H04765 U JPH04765 U JP H04765U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- microlens
- emitting device
- optical filter
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
第１図はこの考案の一実施例である半導体発光
装置の側面図、第２図は第１図の半導体発光装置
のスペクトル特性曲線図、第３図は従来の発光ダ
イオードの側面図、第４図は第３図の発光ダイオ
ードのスペクトル特性曲線図である。 図において、１……ヘツダー、２……サブマウ
ント、３……発光ダイオードチツプ、４……マイ
クロレンズ、５……リード端子、６……Ａｕワイ
ヤ、７……光フイルター膜を示す。なお、図中、
同一符号は同一、又は相当部分を示す。
装置の側面図、第２図は第１図の半導体発光装置
のスペクトル特性曲線図、第３図は従来の発光ダ
イオードの側面図、第４図は第３図の発光ダイオ
ードのスペクトル特性曲線図である。 図において、１……ヘツダー、２……サブマウ
ント、３……発光ダイオードチツプ、４……マイ
クロレンズ、５……リード端子、６……Ａｕワイ
ヤ、７……光フイルター膜を示す。なお、図中、
同一符号は同一、又は相当部分を示す。
Claims (1)
- マイクロレンズを光出射面に装着した半導体発
光装置において、前記マイクロレンズに光フイル
ター機能に持たせた事を特徴とする半導体発光装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990039088U JPH04765U (ja) | 1990-04-11 | 1990-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990039088U JPH04765U (ja) | 1990-04-11 | 1990-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04765U true JPH04765U (ja) | 1992-01-07 |
Family
ID=31547680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990039088U Pending JPH04765U (ja) | 1990-04-11 | 1990-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04765U (ja) |
-
1990
- 1990-04-11 JP JP1990039088U patent/JPH04765U/ja active Pending