JPH0474860B2 - - Google Patents
Info
- Publication number
- JPH0474860B2 JPH0474860B2 JP2211552A JP21155290A JPH0474860B2 JP H0474860 B2 JPH0474860 B2 JP H0474860B2 JP 2211552 A JP2211552 A JP 2211552A JP 21155290 A JP21155290 A JP 21155290A JP H0474860 B2 JPH0474860 B2 JP H0474860B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- contact
- amount
- ball
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07173—
-
- H10W72/075—
-
- H10W72/07502—
-
- H10W72/07533—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2211552A JPH03114239A (ja) | 1990-08-13 | 1990-08-13 | ボンディング面接触検出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2211552A JPH03114239A (ja) | 1990-08-13 | 1990-08-13 | ボンディング面接触検出装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57093032A Division JPS58210629A (ja) | 1982-06-02 | 1982-06-02 | ボンデイング方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03114239A JPH03114239A (ja) | 1991-05-15 |
| JPH0474860B2 true JPH0474860B2 (index.php) | 1992-11-27 |
Family
ID=16607704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2211552A Granted JPH03114239A (ja) | 1990-08-13 | 1990-08-13 | ボンディング面接触検出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03114239A (index.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010082418A1 (ja) | 2009-01-13 | 2010-07-22 | ヤンマー株式会社 | エンジン装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3474132B2 (ja) | 1999-09-28 | 2003-12-08 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ワイヤボンディング方法および装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5826524Y2 (ja) * | 1975-12-12 | 1983-06-08 | 富士通株式会社 | ハンドウタイワイヤボンダソウチ |
| JPS5524403A (en) * | 1978-08-09 | 1980-02-21 | Shinkawa Ltd | Detecting device of bonding face height |
-
1990
- 1990-08-13 JP JP2211552A patent/JPH03114239A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010082418A1 (ja) | 2009-01-13 | 2010-07-22 | ヤンマー株式会社 | エンジン装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03114239A (ja) | 1991-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4266710A (en) | Wire bonding apparatus | |
| US4925083A (en) | Ball bonding method and apparatus for performing the method | |
| US4444349A (en) | Wire bonding apparatus | |
| US4603802A (en) | Variation and control of bond force | |
| US5060841A (en) | wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus | |
| US4340166A (en) | High speed wire bonding method | |
| JPH0131695B2 (index.php) | ||
| US5176311A (en) | High yield clampless wire bonding method | |
| JP3475776B2 (ja) | フリップチップボンディング装置及びフリップチップボンディング方法 | |
| JPH0474860B2 (index.php) | ||
| US5221037A (en) | Wire bonding method and apparatus | |
| JPH0141023B2 (index.php) | ||
| JP2575066B2 (ja) | 半導体組立装置 | |
| JPH0774201A (ja) | ワイヤの供給および消費を監視する装置 | |
| JP2578932B2 (ja) | ダイボンディング装置 | |
| JPS6348123Y2 (index.php) | ||
| JPH05283463A (ja) | ワイヤボンディング方法 | |
| JP2627968B2 (ja) | 半導体組立装置 | |
| JPH0213818B2 (index.php) | ||
| JPH0213815B2 (index.php) | ||
| JPS6229897B2 (index.php) | ||
| JPS61290730A (ja) | ボンデイング装置 | |
| JPH01251729A (ja) | インナーリードボンディング装置及びインナーリードボンディング方法 | |
| JPH0732174B2 (ja) | 超音波ワイヤボンディング方法および装置 | |
| JPH0110929Y2 (index.php) |