JPH0474294B2 - - Google Patents
Info
- Publication number
- JPH0474294B2 JPH0474294B2 JP1013459A JP1345989A JPH0474294B2 JP H0474294 B2 JPH0474294 B2 JP H0474294B2 JP 1013459 A JP1013459 A JP 1013459A JP 1345989 A JP1345989 A JP 1345989A JP H0474294 B2 JPH0474294 B2 JP H0474294B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- weight
- present
- photosensitive
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006089 photosensitive glass Substances 0.000 claims description 18
- 239000013078 crystal Substances 0.000 claims description 10
- 238000002425 crystallisation Methods 0.000 claims description 7
- 230000008025 crystallization Effects 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000272 alkali metal oxide Inorganic materials 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 229910052681 coesite Inorganic materials 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 229910052682 stishovite Inorganic materials 0.000 claims 1
- 229910052905 tridymite Inorganic materials 0.000 claims 1
- 239000011521 glass Substances 0.000 description 30
- 239000000203 mixture Substances 0.000 description 9
- 239000002241 glass-ceramic Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229910018068 Li 2 O Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- -1 halogen ions Chemical class 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/04—Compositions for glass with special properties for photosensitive glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/095—Glass compositions containing silica with 40% to 90% silica, by weight containing rare earths
Description
〔産業上の利用分野〕
本発明は磁気記録、再生装置、特に磁気記録装
置の貯蔵素子となるメモリーデイスク、ソフト及
び固定ハードデイスク、光デイスク、光磁気デイ
スク、磁気デイスク基板及び半導体回路基板に関
する。さらに詳しくは、焼結セラミツク、結晶化
ガラスでは従来不可能とされていた切削特性、材
料特性を有する感光性のガラス及びガラスセラミ
ツクに関する。
〔従来の技術〕
従来の回路基板としてはアルミセラミツク基板
があり、その上にメツキ法又は厚膜法で全面導体
を形成したものをフオトリゾグラフイーで集積回
路を形成するものが開発されている。しかしセラ
ミツク基板の寸法精度が集積回路の寸法基準に追
い付けず現状では多くのマスクを使つて合わせ作
業をしている。
一方ガラスセラミツク基板としてはSiO2・
Li2O・Al2O3系ガラスにAu、CeO2、Ag等を含有
させたものが知られている（特開昭62−72547）。
ガラスに紫外線を照射するといわゆるソーラリ
ゼーシヨン現像を生じ、その部分に一次結晶を折
出させ酸に溶けやすくなるのでケミカルエツチン
グ法によつて回路を形成する。
〔発明が解決しようとする問題点〕
しかし上記従来のガラスにおいては、感光範囲
が狭く不安定であるとともに結晶核としてのAu
が有効に機能しない。又、発光源としての高圧水
銀灯には種々のスペクトルを含むためガラスに吸
収された熱エネルギーが結晶核としてのAuコロ
イドの有効な大きさにも影響を与える（10〜20μ
ｍ以下では有効でない）。
本発明は感光範囲が広く安定したAgコロイド
を折出させることにより寸法精度がすぐれた（最
少25μｍ）孔、溝のエツチング加工が可能な感光
性ガラスを提供することを目的とする。
本発明の他の目的は、民生及び半導体部品に使
用されるガラス及びガラスセラミツクにおいて、
従来の焼結セラミツクス、結晶化ガラスでは不可
能と考えられる加工特性、切削特性を有し、さら
に処理工程別の材料特性の変換が可能な材料を提
供することにあり、特に自己融着性、対摩耗性、
優れた加工性、薄膜との優れたマツチング（α：
80〜120×10-7deg-1）、低誘電率（5.0〜6.0）、高
強度、金属との接合性、Lowoutgas、耐熱性、
低熱収縮特性、耐薬品特性においていずれも優れ
た特性を有する感光性ガラスを提供することを目
的とする。
〔問題点を解決するための手段〕
本発明はSiO268〜84重量％、Li2O3〜16重量
％、Al2O33〜12重量％、６重量％以下のアルカ
リ金属酸化物、CeO20.02〜0.15重量％、Ag0.05〜
0.2重量％からなる感光性ガラスである。アルカ
リ金属酸化物はK2O又はNa2Oないしはそれらの
双方が用いられる。添付成分として２重量％以下
のP2O5、３重量％以下のB2O3、CaO、MgO及び
BaO、２重量％以下のSrO、２重量％以下の
TiO2、ZrO2、ZnO及びPbO、１重量％以下の
Sb2O3及びAs2O3の少なくとも１種を含有させる
ことができ、結晶化補助剤として0.1〜6.0重量％
のハロゲン、0.1〜3.0重量％のSO3の少なくとも
１種を含有させることができる。
本発明は種々の検討及び実験の結果、従来の感
光性ガラスの欠点を解決し、開発に成功したもの
であり、本発明の要旨とするところは、前記特許
請求の範囲に明記したとおりであるが、本発明を
更に詳細に説明する。
SiO2、Li2O及びAl2O3はこの感光性ガラスの基
本成分として周知の酸化物である。本発明は、他
の成分であるK2O、Na2O、CeO2及びAgの含有
量を前記の組成範囲に限定したものであり、前記
範囲外の含有量では本発明所期の目的は達成され
得ない。添加成分も上記基本成分の含有量との関
係から前記の組成範囲に限定したものであり、各
成分が前記の組成範囲内にある場合に、本発明所
期の目的が達成され、充分な清澄効果を発揮す
る。
上記組成範囲とすることにより、本発明感光性
ガラスの溶融温度は1420℃以下となつた。
本発明感光性ガラスは多量のリチウムケイ酸塩
の針状結晶（SiO2・2Li2O）を折出させ曲げ強度
は元のガラスに比べて４倍以上に増加した。さら
に、変形としてメタケイ酸リチウム塩結晶
（SiO2・Li2O）を選択的に生成させ、ふつ化水素
（HF）水に対する溶解度が元のガラスと著しく
異なる現象を利用して化学切削用ガラスに使用さ
れる。結晶化の処理方法は近紫外光源として、
1Kw高圧水銀灯を使用し、発光中心より100〜
150mmの距離で２〜120分照射したのち、520〜530
℃（屈伏点）で30〜60分、570〜600℃（軟化点）
で60〜120分各保持する。本発明の感光性ガラス
に上記の結晶化処理を加えると照射量に応じた深
さの白色結晶層を生じる。この結晶化物メタケイ
酸リリチウムを３〜6vol％のHF水で処理すると
白色結晶化部分が著しく侵蝕され、未照射のガラ
ス部分は殆ど侵蝕されずに残る。溶出比を高める
には20〜200KCの超音波を照射処理を行うとよ
い。
更に結晶化ガラスの変換（結晶化処理によつて
ガラス特性を変換させる）には、その部分が結晶
化ガラスの必要性がある場合には、このガラスに
マスクを施さずに再び紫外線を照射し、それに前
述の熱処理に追加して熱処理を加える。650〜720
℃で60〜90分保持することにより全体が暗色かつ
不透明な結晶化ガラスとなる。
更に高温での結晶化ガラスの変換へは更に追加
の熱処理工程を加える（800〜850℃で60〜120分
保持）とやや異なつた特性の結晶化ガラス（コゲ
茶色のガラスセラミツク）となり、強度、耐熱
性、耐久性にすぐれたものとなる。
このガラス組成系においてAg0.1重量％以上含
有する場合はガラス中のAgコロイドの分散濃度
に従い黄色に変色が起こる。このコロイドの大き
さは可視光の波長より小さいことが必要で、コロ
イドが波長と同程度以上の大きさの微粒子に成長
すると光は強い散乱をおこし、白色から黒色とな
る、Agの量は重量％として0.2wt％を越えてはな
らない。尚、高温処理でのガラスセラミツクの結
晶体はLi2O・2SiO2、Li2O・SiO2と少量のクリス
トバライトおよびβ−スポジユームメンの単一又
は複数の結晶体である。
添加成分を加え多成分系とすることにより、結
晶折出速度の制御が可能となる。結晶体をとりま
くガラスマトリツクスの組成自体の安定性や結晶
粒径の調整も可能となる。
本発明の感光性ガラスは長時間自然光に晒すと
濃い黒紫色に変色し、その現象は以下の式で示さ
れる（ソラリゼーシヨンが生じていると考えられ
る。）。
(a) Ce3+＋hrCe4+＋e*
(b) Ag+＋e*Ag0＋＊
(c) nAg→Ag0n
e*：励起電子
hr：電磁波
＊：余剰エネルギー
Ag重量％として0.05〜0.2を含有させたものは
感光範囲が広く安定したAgコロイドが折出する
ので最少25μまでの無数の孔や溝をガラスに開け
ることが可能となる。エツチングに於ける公差は
±8μであり、0.2〜0.3mmの板厚の場合は±3μまで
の公差とすることも可能である。
これらのエツチング加工のメリツトは機械加工
では困難は異形の穴や溝を容易に加工でき、しか
も金型を必要としないため、低価格として量産が
できる。
また本発明の感光性ガラスは用途、特性を考え
ると３種に分類できそれぞれ用途に応じた特性を
だすことができる。
(1) アモルフアスのガラス材料でエツチングした
ままの製品で、特に加工精度がよい
（TYPE1）。
(2) 不透明な部分結晶化ガラスで殆ど黒色のた
め、遮光性に優れているばかりか、上記透明ガ
ラスよりも化学的、物理的耐久性に優れている
（TYPE2）。
(3) さらに結晶化を進め、コゲ茶色のガラスセラ
ミツクとした場合は、もつとも優れた強度耐熱
性、耐久性を持ち最高使用温度は750℃であり
高膨張係数、無孔、平滑な加工面を有する材料
となる（TYPE3）。
上記の特性をさらに詳述すれば未処理の透明ガ
ラスは硬く、化学的に安定で、優れた誘導特性を
もち、無孔であり、熱膨張係数はフエライト組成
及び低融点ガラスとほぼ同等の素材であるので封
着が可能である。
また通常のガラス及びセラミツクでは不可能な
エツチング加工ができ、特に複雑な形状でも正確
にエツチングができ公差は±3μ以内でガラスの
厚みが0.3mm付近の場合１mm2当たり6000〜7000個
の孔加工が可能であり、30μの孔、溝加工が可能
な材料である。
エツチング加工をした透明感光性ガラス（1.5
mm厚）を数十枚重ね熱処理し、結晶化と同時に一
体化した多層構造も加工できる。ケミカルエツチ
ング加工のため治具としては原版およびフオトマ
スクのみで、金型は不要である。またエマルジヨ
ンマスクの使用により、低コストで均一多数の加
工ができる。以上の如く、本発明感光性ガラスは
通常のガラス及びガラスセラミツクでは不可能な
問題を容易に解決できると言える。
〔実施例〕
本発明の感光ガラスの実施例を組成例として表
１に示す。同表で核材としてのハロゲンイオン、
Ag、CeO2は微量のため外掛で表示してある。
[Industrial Field of Application] The present invention relates to magnetic recording and reproducing devices, and particularly to memory disks, soft and fixed hard disks, optical disks, magneto-optical disks, magnetic disk substrates, and semiconductor circuit boards serving as storage elements of magnetic recording devices. More specifically, the present invention relates to photosensitive glass and glass-ceramic having cutting properties and material properties that were previously considered impossible with sintered ceramics and crystallized glass. [Prior art] Conventional circuit boards include aluminum ceramic boards, on which conductors are formed over the entire surface using plating or thick film methods, and integrated circuits have been developed using photolithography. . However, the dimensional accuracy of ceramic substrates cannot keep up with the dimensional standards of integrated circuits, and currently many masks are used for alignment work. On the other hand, as a glass ceramic substrate, SiO 2
Li 2 O.Al 2 O 3 glass containing Au, CeO 2 , Ag, etc. is known (Japanese Unexamined Patent Publication No. 72547/1983). When glass is irradiated with ultraviolet rays, so-called solarization development occurs, and primary crystals are precipitated in that area and become easily soluble in acid, so a circuit can be formed by chemical etching. [Problems to be solved by the invention] However, in the above-mentioned conventional glasses, the photosensitive range is narrow and unstable, and Au as crystal nuclei is
does not function effectively. In addition, since the high-pressure mercury lamp used as a light source includes various spectra, the thermal energy absorbed by the glass also affects the effective size of the Au colloid as a crystal nucleus (10 to 20μ).
m or less). The object of the present invention is to provide a photosensitive glass that can be etched with holes and grooves with excellent dimensional accuracy (minimum 25 μm) by depositing a stable Ag colloid with a wide photosensitive range. Another object of the present invention is to provide glass and glass ceramics for use in consumer and semiconductor components.
Our goal is to provide a material that has processing and cutting properties that are considered impossible with conventional sintered ceramics and crystallized glass, and that also allows for changes in material properties depending on the processing process. Abrasion resistance,
Excellent processability, excellent matching with thin films (α:
80~120× 10-7 deg -1 ), low dielectric constant (5.0~6.0), high strength, bondability with metal, lowoutgas, heat resistance,
The object of the present invention is to provide a photosensitive glass having excellent properties in both low heat shrinkage properties and chemical resistance properties. [Means for Solving the Problems] The present invention uses SiO 2 68-84% by weight, Li 2 O3-16% by weight, Al 2 O 3 3-12% by weight, 6% by weight or less of alkali metal oxides, CeO 2 0.02~0.15% by weight, Ag0.05~
It is a photosensitive glass consisting of 0.2% by weight. As the alkali metal oxide, K 2 O or Na 2 O or both thereof are used. As attached components, P 2 O 5 of 2% by weight or less, B 2 O 3 of 3% by weight or less, CaO, MgO, and
BaO, up to 2% by weight SrO, up to 2% by weight
TiO 2 , ZrO 2 , ZnO and PbO, up to 1% by weight
Can contain at least one of Sb 2 O 3 and As 2 O 3 , 0.1 to 6.0% by weight as a crystallization aid
of halogen and 0.1 to 3.0% by weight of SO3 . As a result of various studies and experiments, the present invention has been successfully developed by solving the drawbacks of conventional photosensitive glass, and the gist of the present invention is as specified in the claims above. The present invention will now be described in more detail. SiO 2 , Li 2 O and Al 2 O 3 are oxides well known as basic components of this photosensitive glass. The present invention limits the content of other components K 2 O, Na 2 O, CeO 2 and Ag to the above composition range, and if the content is outside the above range, the intended purpose of the present invention will not be achieved. cannot be achieved. The additive components are also limited to the above composition ranges in relation to the content of the basic components above, and when each component is within the above composition range, the intended purpose of the present invention is achieved and sufficient clarification is achieved. be effective. By setting the composition within the above range, the melting temperature of the photosensitive glass of the present invention was 1420°C or lower. The photosensitive glass of the present invention precipitated a large amount of acicular crystals of lithium silicate (SiO 2 .2Li 2 O), and its bending strength increased more than four times that of the original glass. Furthermore, as a modification, lithium metasilicate salt crystals (SiO 2 Li 2 O) are selectively generated, and the solubility of hydrogen fluoride (HF) in water is significantly different from that of the original glass, which can be used to create glass for chemical cutting. used. The crystallization process uses a near-ultraviolet light source.
Using a 1Kw high pressure mercury lamp, 100~ from the center of light emission.
After 2-120 minutes of irradiation at a distance of 150 mm, 520-530
30-60 minutes at ℃ (deflection point), 570-600℃ (softening point)
Hold for 60-120 minutes each. When the photosensitive glass of the present invention is subjected to the above-described crystallization treatment, a white crystal layer is formed with a depth corresponding to the irradiation amount. When this crystallized lylithium metasilicate is treated with 3 to 6 vol% HF water, the white crystallized portion is significantly eroded, while the unirradiated glass portion remains almost uncorroded. In order to increase the elution ratio, it is recommended to perform irradiation treatment with ultrasonic waves of 20 to 200 KC. Furthermore, when converting crystallized glass (changing glass properties through crystallization treatment), if there is a need for crystallized glass in that area, the glass is irradiated with ultraviolet rays again without masking. , in addition to the heat treatment described above. 650~720
By keeping it at ℃ for 60 to 90 minutes, the whole becomes dark-colored and opaque crystallized glass. In order to convert crystallized glass at even higher temperatures, an additional heat treatment step (held at 800-850℃ for 60-120 minutes) results in crystallized glass (burnt brown glass-ceramic) with slightly different properties, resulting in increased strength, It has excellent heat resistance and durability. When this glass composition system contains 0.1% by weight or more of Ag, discoloration occurs to yellow depending on the dispersion concentration of Ag colloid in the glass. The size of this colloid must be smaller than the wavelength of visible light, and when the colloid grows into fine particles with a size equal to or larger than the wavelength, the light will be strongly scattered and the color will change from white to black. Must not exceed 0.2wt%. Incidentally, the crystalline bodies of the glass ceramic in the high-temperature treatment are single or plural crystalline bodies of Li 2 O.2SiO 2 , Li 2 O.SiO 2 and small amounts of cristobalite and β-spodium. By adding additional components to form a multi-component system, it becomes possible to control the crystal precipitation rate. It also becomes possible to adjust the stability of the composition of the glass matrix surrounding the crystal and the crystal grain size. When the photosensitive glass of the present invention is exposed to natural light for a long time, it changes color to deep blackish purple, and this phenomenon is shown by the following formula (solarization is considered to occur). (a) Ce 3+ +hrCe 4+ +e * (b) Ag + +e * Ag 0 +* (c) nAg→Ag 0 n e * : Excited electron hr: Electromagnetic wave *: Surplus energy Contains 0.05 to 0.2 as Ag weight% Since the photosensitive material has a wide photosensitive range and stable Ag colloid is precipitated, it is possible to make countless holes and grooves down to 25μ in size in glass. The tolerance in etching is ±8μ, and for plate thicknesses of 0.2 to 0.3 mm, the tolerance can be up to ±3μ. The advantages of these etching processes are that irregularly shaped holes and grooves that are difficult to form using machining can be easily formed, and since no molds are required, mass production is possible at low cost. Further, the photosensitive glass of the present invention can be classified into three types in consideration of usage and characteristics, and each type can exhibit characteristics depending on the usage. (1) Etched product made of amorphous glass material with particularly good processing accuracy (TYPE1). (2) Since it is an opaque partially crystallized glass with an almost black color, it not only has excellent light blocking properties, but also has better chemical and physical durability than the transparent glass mentioned above (TYPE 2). (3) When crystallization is further advanced to produce a burnt-brown glass ceramic, it has excellent strength, heat resistance, and durability, with a maximum operating temperature of 750°C, and a high expansion coefficient, non-porous, and smooth processed surface. (TYPE3) To further elaborate on the above characteristics, untreated transparent glass is hard, chemically stable, has excellent inductive properties, is non-porous, and has a thermal expansion coefficient similar to that of ferrite composition and low melting point glass. Therefore, sealing is possible. In addition, it is possible to perform etching processes that are impossible with ordinary glass and ceramics, and in particular, it can accurately etch even complex shapes.The tolerance is within ±3μ, and when the glass thickness is around 0.3mm, it is possible to process 6000 to 7000 holes per mm2. It is a material that can be machined with 30μ holes and grooves. Etched transparent photosensitive glass (1.5
It is also possible to create a multilayered structure in which dozens of sheets (mm thick) are layered and heat treated to form an integrated structure at the same time as crystallization. Because it is a chemical etching process, the only jigs required are the original plate and a photomask; no mold is required. Furthermore, by using an emulsion mask, uniform processing can be performed in large numbers at low cost. As described above, it can be said that the photosensitive glass of the present invention can easily solve problems that cannot be solved with ordinary glasses and glass ceramics. [Example] Examples of the photosensitive glass of the present invention are shown in Table 1 as composition examples. In the same table, halogen ions as core materials,
Since Ag and CeO 2 are in trace amounts, they are shown on the outside.
【表】【table】
【表】
No.９の組成の感光性ガラスの特性を表２に示
す。[Table] Table 2 shows the properties of the photosensitive glass with composition No. 9.
本発明は上記の構成を有する感光性ガラスであ
るので、優れた加工性、薄膜とのマツチング、高
強度、耐熱性、耐酸性、耐摩耗性いずれの点にお
いても従来にはない優れた特性を有し、かつ低価
格にして量産に適した感光性ガラスを提供するこ
とができた。
Since the present invention is a photosensitive glass having the above structure, it has excellent properties not found in the past in terms of excellent processability, matching with thin films, high strength, heat resistance, acid resistance, and abrasion resistance. We were able to provide a photosensitive glass suitable for mass production at a low price.
Claims (1)
Al2O33〜12重量％、６重量％以下のアルカリ金
属酸化物、CeO20.02〜0.15重量％、結晶核として
のAg0.05〜0.2重量％、結晶化補助剤として0.1〜
6.0重量％のハロゲン又は0.1〜3.0重量％のSO3か
らなるデイスク基板用の感光性ガラス。1 SiO2 68-84% by weight, Li2O3-16 % by weight,
Al 2 O 3 3-12% by weight, alkali metal oxides not more than 6% by weight, CeO 2 0.02-0.15% by weight, Ag 0.05-0.2% by weight as crystal nuclei, 0.1-0.1% by weight as crystallization aids.
Photosensitive glass for disk substrates consisting of 6.0% by weight of halogen or 0.1-3.0% by weight of SO3 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1345989A JPH02196048A (en) | 1989-01-23 | 1989-01-23 | Photosensitive glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1345989A JPH02196048A (en) | 1989-01-23 | 1989-01-23 | Photosensitive glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02196048A JPH02196048A (en) | 1990-08-02 |
| JPH0474294B2 true JPH0474294B2 (en) | 1992-11-25 |
Family
ID=11833732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1345989A Granted JPH02196048A (en) | 1989-01-23 | 1989-01-23 | Photosensitive glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02196048A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2315266B (en) * | 1996-07-12 | 1999-11-17 | Ibm | Magnet and method for manufacturing a magnet |
| KR20140075778A (en) * | 2011-10-14 | 2014-06-19 | 이보클라 비바덴트 아게 | Lithium silicate glass ceramic and lithium silicate glass comprising a tetravalent metal oxide |
| CN106542733B (en) * | 2016-09-28 | 2019-04-23 | 北方夜视技术股份有限公司 | Micropore optical element and preparation method thereof |
| CN111718120A (en) * | 2020-07-09 | 2020-09-29 | 电子科技大学 | Li-Al-Si photosensitive glass and preparation method thereof |
| CN114933416B (en) * | 2022-06-24 | 2023-07-25 | 成都光明光电有限责任公司 | Photosensitive microcrystalline glass |
| CN114873918B (en) * | 2022-06-24 | 2023-08-08 | 成都光明光电有限责任公司 | Photosensitive glass material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163542A (en) * | 1984-09-03 | 1986-04-01 | Hoya Corp | Crystallized glass having high thermal expansion coefficient and its preparation |
-
1989
- 1989-01-23 JP JP1345989A patent/JPH02196048A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163542A (en) * | 1984-09-03 | 1986-04-01 | Hoya Corp | Crystallized glass having high thermal expansion coefficient and its preparation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02196048A (en) | 1990-08-02 |
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