JPH047312Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field The present invention relates to a construction board, and particularly to a construction board suitable for use as a flooring material.

Prior Art Composite boards such as fiberboard and wood chip board are used as building boards and are also used as flooring materials.

In general, in order to quickly attach these boards to areas wider than their length and width, the ends of the boards must be machined in the longitudinal and/or width directions, and the boards can be attached to studs or joists. It is nailed in the actual processing department,
It has been practiced for a long time to cover and hide the nail head by fitting the actual machined part. The completed construction surface, especially when the construction surface is a floor surface, tends to bend toward the back side under the load from the front side between the support structures such as joists that support it, and as a result, Causes squeaks.

When these composite boards are used as flooring materials, they must be at least 12 mm thick, and thicker boards require a great deal of labor during transportation and construction, and also increase manufacturing costs.

Purpose of the invention Therefore, the purpose of the present invention is to provide a lightweight and inexpensive construction board that has less deflection and creaking after construction.

Composition of the invention According to the invention, in a construction board having a substantially constant thickness and made of a composite board having a rectangular board surface, at least one strip is formed over the entire length in the longitudinal direction and the width direction, or in either one of them. A linear or band-shaped high-density portion is formed. The high-density portion is provided at any location on the main body portion of the substrate, excluding the constant thickness portion of the substrate, that is, the real portion for fitting and connection provided as necessary at the longitudinal and/or widthwise ends of the substrate.

Appropriate decorative surface treatments such as pasting a veneer veneer, pasting a decorative synthetic resin sheet, or printing a pattern may be applied to the surface of the board, and the surface may be treated in the longitudinal and/or width directions of the board. Actual processing may be performed on the wood end.

The high-density portion can be formed along the entire thickness of the substrate, and can be formed along at least one of the front side and the back side of the substrate, or can be formed along the entire thickness of the substrate. It may be formed in the intermediate portion and not exposed on the front and back surfaces of the substrate.

For example, when the substrate is a wood fiberboard, the high-density portion is formed when the wood fibers, which have been dried after adding an adhesive, are dropped and deposited on a screen conveyor using multiple forming devices. The desired part is pressed in advance to form corresponding grooves, and after more wood fibers are allowed to fall and accumulate in the grooves, the resulting wood fiber mat is heated and pressed. It can be carried out. For example, when dropping wood fibers using four forming devices, the first forming device presses the pine on which the wood fibers have fallen and piled up to form a first groove, and then a second groove is formed on top of the pine. A forming device presses the pine on which wood fibers have been deposited to form a second groove, and a third forming device presses the pine on which wood fibers have been deposited to form a third groove. A method is adopted in which grooves are formed and finally the pine on which wood fibers are dropped and deposited using a fourth forming device is heated and pressed to obtain a composite board. In this method, the positions of the first to third grooves are If the grooves are formed at the same location, a high-density portion can be formed throughout the thickness direction, and by shifting the formation position of each groove in the length direction or width direction, for example, the first groove can be formed at the same location. A backside high-density portion can be formed at the position of the groove shown in FIG. 3, an intermediate high-density portion can be formed at the position of the second groove, and a front side high-density portion can be formed at the position of the groove shown in FIG.

The presence of these dense sections increases the strength between the structural parts of the building supporting the building boards and allows the thickness of the composite board to be reduced to support the same load. Deflection again,
There are fewer warps, creaks, etc., and the livability and walking feel are improved.

DESCRIPTION OF EMBODIMENTS FIGS. 1a-c are perspective views of various embodiments of a construction board 10 according to the present invention. Architectural board 10 is shown as comprising a substrate 11 and a decorative surface 12, with the decorative surface 12 being drawn on the lower side in these figures for convenience of explanation. Further, the longitudinal ends of these architectural boards 10 are shown as having been subjected to actual processing consisting of male seeds 13 and female seeds 14.

In the embodiment shown in FIG. 1a, a plurality of high-density portions 15 are provided in the longitudinal direction of the substrate 11, and in the embodiment shown in FIG.
In the embodiment shown in FIG. 1, a plurality of high-density parts 15 are provided in the width direction of the substrate 11, and in the embodiment shown in FIG. It is being

The high-density portion 15 can be provided at various positions in the thickness direction of the substrate 11, and various aspects thereof are shown in FIG.

Specifically, the high-density portion 15 can be formed along at least one of the front side and the back side of the substrate 11, and various aspects thereof are shown in FIGS.
It is shown in d. Further, the high-density portion 15 can be formed in the intermediate portion in the thickness direction of the substrate 11, and this embodiment is shown in FIGS. 2e and 2f. Furthermore, the high-density portion 15 is
This embodiment is illustrated in FIG. 2g. FIG. 2h is a further modification of FIG. 2g, in which a high-density portion 17 is further provided on the entire back surface of the substrate 11. This modification has the effect of preventing the back surface from cracking along the boundary surface of the density difference of the substrates when the load is repeatedly applied from the front surface side.

The width of the high-density portion 15 and the spacing between the high-density portions when multiple high-density portions are provided;
The arrangement of the high-density portion 15 in the thickness direction of the substrate 11, etc. is appropriately selected depending on the material, density, size, and purpose of the substrate 11 used.

When using the construction board according to the present invention as a flooring material, for example, as shown in FIG. The male fruit is mated to hide the head of the nail. This procedure is repeated to form the floor surface. In the post-construction state, the high-density portion 15a oriented in a direction perpendicular to the longitudinal direction of the joists 16 extends over adjacent joists to increase the supporting force against the load, and also
The high-density portion 15b oriented in the direction parallel to 6 has the function of a temporary joist, which also increases the supporting capacity against the load.

Effects of the invention According to the invention, when supporting the same load, the thickness can be made thinner than that of a construction board that uses a conventional composite board as a substrate, and If it has the same thickness as a building board, it can support a larger load.

In addition, the reinforcing action of the high-density portion 15 prevents deflection and creaking due to load after construction, making it possible to reduce weight and manufacturing costs, and also to reduce labor during transportation and construction.

Furthermore, when a high-density portion is provided over at least one of the front and back surfaces, the reinforcing effect of the present invention is further improved. Furthermore, during construction, it is possible to widen the spacing between supporting structural members such as joists, which is economical.

[Brief explanation of the drawing]

1A to 1C are perspective views showing various embodiments of the construction board according to the present invention, and FIGS. 2A to 2H are side views of various embodiments of the construction board according to the present invention as viewed from the thickness direction. FIG. 3 is a perspective view showing a state in which the construction board according to the present invention is used as a flooring material. Explanation of symbols, 10... Architectural board, 11... Base material, 12... Decorated surface, 13... Male fruit, 14
... female fruit, 15 ... dense part, 16 ... joist, 1
7...High density area.

Claims (1)

[Scope of Claim for Utility Model Registration] 1. In a construction board of approximately constant thickness that uses a composite board such as a wood fiberboard or wood chip board as a substrate and has a rectangular board surface, in the constant thickness portion of the substrate, 1. A building board characterized by integrally providing at least one linear or band-like high-density portion extending over its entire length in the direction and width direction, or in either one of these directions. 2. The architectural board according to claim 1, wherein the linear or band-like high-density portion is formed along at least one of the front side and the back side of the substrate. . 3. The architectural board according to claim 1, wherein the linear or band-like high-density portion is formed at an intermediate portion between the front side and the back side of the substrate. 4. The architectural board according to claim 1, wherein the linear or band-like high-density portion is formed over the entire thickness of the substrate.