JPH0472371B2 - - Google Patents
Info
- Publication number
- JPH0472371B2 JPH0472371B2 JP63120237A JP12023788A JPH0472371B2 JP H0472371 B2 JPH0472371 B2 JP H0472371B2 JP 63120237 A JP63120237 A JP 63120237A JP 12023788 A JP12023788 A JP 12023788A JP H0472371 B2 JPH0472371 B2 JP H0472371B2
- Authority
- JP
- Japan
- Prior art keywords
- chips
- adhesive film
- organic adhesive
- laminate
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 19
- 239000002313 adhesive film Substances 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims 1
- 230000006866 deterioration Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は積層セラミツクチツプコンデンサの製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a multilayer ceramic chip capacitor.
（従来の技術）
従来、積層セラミツクチツプコンデンサを製造
するには、セラミツクシートの積層体を所定寸法
のチツプに切断し、その後、チツプを基板上に並
べるかあるいは粉末中に埋め焼成している。(Prior Art) Conventionally, in order to manufacture a multilayer ceramic chip capacitor, a stack of ceramic sheets is cut into chips of a predetermined size, and then the chips are arranged on a substrate or buried in powder and fired.
（発明が解決しようとする課題）
しかし、この従来の方法では、作業工率が低い
欠点がある。また、焼成時にチツプどうしが接触
し易く、セラミツクシートの内部電極と誘電体の
部分とが反応して特性が劣化する欠点があつた。(Problems to be Solved by the Invention) However, this conventional method has a drawback of low labor efficiency. Additionally, the chips tend to come into contact with each other during firing, and the internal electrodes of the ceramic sheet react with the dielectric portion, resulting in deterioration of characteristics.
本発明は、以上の欠点を改良し、製造が容易で
特性を向上しうる積層セラミツクチツプコンデン
サを提供するものである。 The present invention improves the above-mentioned drawbacks and provides a multilayer ceramic chip capacitor that is easy to manufacture and has improved characteristics.
（課題を解決するための手段）
本発明は、上記の目的を達成するために、積層
セラミツクチツプコンデンサの製造方法におい
て、
複数個の内部電極を形成したセラミツクシー
トを複数枚、積層し圧着して積層する工程と、
該積層したセラミツクシートを有機粘着フイ
ルム上に固定する工程と、
前記セラミツクシートにスリツトを形成して
複数個のチツプに切断する工程と、
前記有機粘着フイルム上に固定したまま該チ
ツプを基板上に配置する工程と、
前記チツプを焼成する工程と
を順次行なうことを特徴とする積層セラミツクチ
ツプコンデンサの製造方法を提供するものであ
る。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for manufacturing a multilayer ceramic chip capacitor, in which a plurality of ceramic sheets each having a plurality of internal electrodes formed thereon are laminated and crimped. a step of laminating the laminated ceramic sheets on an organic adhesive film; a step of forming slits in the ceramic sheets and cutting them into a plurality of chips; The present invention provides a method for manufacturing a multilayer ceramic chip capacitor, characterized in that a step of arranging a chip on a substrate and a step of firing the chip are performed in sequence.
（作用）
本発明によれば、セラミツクシートにスリツト
を設けて切断し、形成したチツプを予じめ有機粘
着フイルムに固定できる。従つて、チツプは互い
に接触することなく、所定の間隔を維持したまま
焼成できる。(Function) According to the present invention, it is possible to cut a ceramic sheet by providing slits, and to fix the formed chips to an organic adhesive film in advance. Therefore, the chips can be fired while maintaining a predetermined distance without coming into contact with each other.
（実施例） 以下、本発明を実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on examples.
先ず、第１図に示す通り、内部電極１を形成し
たセラミツクシート２を複数枚、積層し圧着して
積層体３を形成する。 First, as shown in FIG. 1, a plurality of ceramic sheets 2 having internal electrodes 1 formed thereon are laminated and pressed together to form a laminate 3.
次に第２図に示す通り、積層体３を有機粘着フ
イルム４の表面に固定する。 Next, as shown in FIG. 2, the laminate 3 is fixed to the surface of the organic adhesive film 4.
積層体３を有機粘着フイルム４に固定後、第３
図に示す通り、ダイシングマシン５により積層体
３のみにスリツト６を形成して、個々のチツプ７
に切断する。スリツト６の幅は50〜200μm程度が
好ましい。 After fixing the laminate 3 to the organic adhesive film 4, the third
As shown in the figure, slits 6 are formed only in the laminate 3 by a dicing machine 5, and individual chips 7 are separated.
Cut into. The width of the slit 6 is preferably about 50 to 200 μm.
積層体３を切断後、第４図に示す通り、チツプ
７を有機粘着フイルム４に固定したまま基板８表
面に配置し、この状態で焼成する。基板８は焼成
時にチツプ７と反応しない材質とする。 After cutting the laminate 3, as shown in FIG. 4, the chip 7 is placed on the surface of the substrate 8 while being fixed to the organic adhesive film 4, and fired in this state. The substrate 8 is made of a material that does not react with the chip 7 during firing.
上記実施例では、積層体３を、有機粘着フイル
ム４に固定したまま切断して、チツプ７を形成で
きる。従つて、チツプ７はお互いに接触すること
なく、所定の間隔を維持できる。 In the above embodiment, the chip 7 can be formed by cutting the laminate 3 while it is fixed to the organic adhesive film 4. Therefore, the chips 7 can maintain a predetermined distance without coming into contact with each other.
（発明の効果）
以上の通り、本発明によれば、有機粘着フイル
ムに固定したままチツプを形成できるため、作業
が容易でチツプどうしの接触による特性の劣化を
防止しうる積層セラミツクチツプコンデンサの製
造方法が得られる。(Effects of the Invention) As described above, according to the present invention, since chips can be formed while being fixed to an organic adhesive film, a multilayer ceramic chip capacitor can be manufactured which is easy to work with and can prevent deterioration of characteristics due to contact between chips. method is obtained.
第１図〜第４図は本発明の製造工程の図を示
し、第１図は積層体の正面図、第２図は積層体を
有機粘着フイルムに固定した状態の正面図、第３
図は積層体を切断している状態の斜視図、第４図
はチツプを基板に配置した状態の正面図を示す。
１……内部電極、２……セラミツクシート、３
……積層体、４……有機粘着フイルム、６……ス
リツト、７……チツプ、８……基板。
1 to 4 show diagrams of the manufacturing process of the present invention, FIG. 1 is a front view of the laminate, FIG. 2 is a front view of the laminate fixed to an organic adhesive film, and FIG. 3 is a front view of the laminate fixed to an organic adhesive film.
The figure shows a perspective view of the laminate being cut, and FIG. 4 shows a front view of the chip placed on the substrate. 1... Internal electrode, 2... Ceramic sheet, 3
... Laminate, 4... Organic adhesive film, 6... Slit, 7... Chip, 8... Substrate.
Claims (1)
において、 複数個の内部電極を形成したセラミツクシー
トを複数枚、積層し圧着して積層する工程と、 該積層したセラミツクシートを有機粘着フイ
ルム上に固定する工程と、 前記セラミツクシートにスリツトを形成して
複数個のチツプに切断する工程と、 前記有機粘着フイルム上に固定したまま該チ
ツプを基板上に配置する工程と、 前記チツプを焼成する工程と を順次行なうことを特徴とする積層セラミツクチ
ツプコンデンサの製造方法。[Claims] 1. A method for manufacturing a multilayer ceramic chip capacitor, comprising the steps of laminating and pressing a plurality of ceramic sheets each having a plurality of internal electrodes formed thereon, and placing the laminated ceramic sheets on an organic adhesive film. forming slits in the ceramic sheet and cutting it into a plurality of chips; placing the chips fixed on the organic adhesive film on a substrate; and firing the chips. A method for manufacturing a multilayer ceramic chip capacitor, characterized in that the steps are sequentially performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12023788A JPH01289234A (en) | 1988-05-17 | 1988-05-17 | Manufacture of laminated ceramic chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12023788A JPH01289234A (en) | 1988-05-17 | 1988-05-17 | Manufacture of laminated ceramic chip capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01289234A JPH01289234A (en) | 1989-11-21 |
| JPH0472371B2 true JPH0472371B2 (en) | 1992-11-18 |
Family
ID=14781238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12023788A Granted JPH01289234A (en) | 1988-05-17 | 1988-05-17 | Manufacture of laminated ceramic chip capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01289234A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5583738A (en) * | 1993-03-29 | 1996-12-10 | Murata Manufacturing Co., Ltd. | Capacitor array |
| JP5131349B2 (en) * | 2008-04-18 | 2013-01-30 | 株式会社村田製作所 | Manufacturing method of multilayer piezoelectric ceramic element |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4981859A (en) * | 1972-12-13 | 1974-08-07 | ||
| JPS5988816A (en) * | 1982-11-12 | 1984-05-22 | 日本電気ホームエレクトロニクス株式会社 | Method of producing laminated ceramic part |
| JPS6050910A (en) * | 1983-08-30 | 1985-03-22 | 日本電気株式会社 | Method of producing laminated condenser |
| JPS61144810A (en) * | 1984-12-18 | 1986-07-02 | 関西日本電気株式会社 | Manufacture of laminated ceramic part |
| JPS61219124A (en) * | 1985-03-25 | 1986-09-29 | 関西日本電気株式会社 | Manufacture of ceramic part |
-
1988
- 1988-05-17 JP JP12023788A patent/JPH01289234A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4981859A (en) * | 1972-12-13 | 1974-08-07 | ||
| JPS5988816A (en) * | 1982-11-12 | 1984-05-22 | 日本電気ホームエレクトロニクス株式会社 | Method of producing laminated ceramic part |
| JPS6050910A (en) * | 1983-08-30 | 1985-03-22 | 日本電気株式会社 | Method of producing laminated condenser |
| JPS61144810A (en) * | 1984-12-18 | 1986-07-02 | 関西日本電気株式会社 | Manufacture of laminated ceramic part |
| JPS61219124A (en) * | 1985-03-25 | 1986-09-29 | 関西日本電気株式会社 | Manufacture of ceramic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01289234A (en) | 1989-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |