JPH0471339B2 - - Google Patents

Info

Publication number
JPH0471339B2
JPH0471339B2 JP59270407A JP27040784A JPH0471339B2 JP H0471339 B2 JPH0471339 B2 JP H0471339B2 JP 59270407 A JP59270407 A JP 59270407A JP 27040784 A JP27040784 A JP 27040784A JP H0471339 B2 JPH0471339 B2 JP H0471339B2
Authority
JP
Japan
Prior art keywords
gate circuit
container
cooling device
bushing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59270407A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61148848A (ja
Inventor
Hiroshi Itahana
Masataka Onoe
Yoshinori Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP59270407A priority Critical patent/JPS61148848A/ja
Publication of JPS61148848A publication Critical patent/JPS61148848A/ja
Publication of JPH0471339B2 publication Critical patent/JPH0471339B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59270407A 1984-12-21 1984-12-21 半導体冷却装置 Granted JPS61148848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59270407A JPS61148848A (ja) 1984-12-21 1984-12-21 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59270407A JPS61148848A (ja) 1984-12-21 1984-12-21 半導体冷却装置

Publications (2)

Publication Number Publication Date
JPS61148848A JPS61148848A (ja) 1986-07-07
JPH0471339B2 true JPH0471339B2 (https=) 1992-11-13

Family

ID=17485831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59270407A Granted JPS61148848A (ja) 1984-12-21 1984-12-21 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS61148848A (https=)

Also Published As

Publication number Publication date
JPS61148848A (ja) 1986-07-07

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