JPH0471263A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPH0471263A
JPH0471263A JP18320190A JP18320190A JPH0471263A JP H0471263 A JPH0471263 A JP H0471263A JP 18320190 A JP18320190 A JP 18320190A JP 18320190 A JP18320190 A JP 18320190A JP H0471263 A JPH0471263 A JP H0471263A
Authority
JP
Japan
Prior art keywords
lead
resin tape
lead frame
frame
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18320190A
Other languages
Japanese (ja)
Inventor
Kenji Suetake
末竹　健司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP18320190A priority Critical patent/JPH0471263A/en
Publication of JPH0471263A publication Critical patent/JPH0471263A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To protect an inner lead from being deformed by heaping by putting resin tape having the same thickness as that of resin tape used for fixing the lead portion on part of either of the front and back of a lead frame. CONSTITUTION:Inner lead 1 is fixed by resin tape 2. Further, there is also resin tape 4 put on a frame portion 4. Therefore, when a number of lead frames 3 are piles up for conveyance, the thickness of resin tape 2 put on the tips of inner lead 1 of lead frames eliminates swelling of the central portion of lead frame 3, thus being able to hold accumulated lead frames 3. Accordingly, in the assembly of mount or the like, deformation of lead frames due to vertical catching in the assembly process of mount or the like can be protected.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置用リードフレームに関し、特に非導
電性の樹脂テープにてインナーリードを固定した半導体
装置用リードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for a semiconductor device, and more particularly to a lead frame for a semiconductor device in which inner leads are fixed with a non-conductive resin tape.

〔従来の技術〕[Conventional technology]

従来、第３図（ａ）、（ｂ）に示すように、この種の半
導体装置用リードフレーム（以下リードフレームと記す
）３は、インナーリード１の変形を防止するなめ非導電
性の樹脂テープ２でインナーリード１を固定していた。Conventionally, as shown in FIGS. 3(a) and 3(b), this type of lead frame (hereinafter referred to as lead frame) 3 for a semiconductor device is made of a tapered non-conductive resin tape that prevents inner leads 1 from deforming. Inner lead 1 was fixed with 2.

この樹脂テープ２は、０．１２ｍｍのリード厚のリード
に関しては０．０５〜０．０７５ｍｍの厚みを有しテイ
ル。This resin tape 2 has a tail thickness of 0.05 to 0.075 mm for a lead having a lead thickness of 0.12 mm.

この樹脂テープ２をリードフレーム３のインナーリード
１の先端付近に固定することにより、インナーリード２
の先端の横方向のリード変形を防止している。By fixing this resin tape 2 near the tip of the inner lead 1 of the lead frame 3, the inner lead 2
This prevents lateral lead deformation at the tip.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の樹脂テープによって固定されたリードフ
レームは、第３図（ａ＞、（ｂ）に示すように、リード
フレーム３を搬送するためリードフレーム３を重ねた場
合、樹脂テープ２の厚み分インナーリードが浮きあがり
リードフレーム３を水平に保つことができず変形がおこ
るという欠点がある。As shown in FIGS. 3(a) and 3(b), the lead frame fixed with the conventional resin tape described above is fixed by the thickness of the resin tape 2 when the lead frames 3 are overlapped to transport the lead frames 3. There is a drawback that the inner leads float up, making it impossible to keep the lead frame 3 horizontal, resulting in deformation.

また、マウントなどの組立工程においてインナーリード
１の上下方向のひっかかりによる変形がおこるという欠
点がある。Further, there is a drawback that deformation occurs due to the inner lead 1 being caught in the vertical direction during an assembly process such as mounting.

本発明の目的は、インナーリードの変形をおこすことの
ないリードフレームを提供することにある。An object of the present invention is to provide a lead frame that does not cause deformation of inner leads.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、非導電性の樹脂テープでリード部を固定した
半導体装置用リードフレームにおいて、前記樹脂テープ
と同一の厚みをもつ樹脂テープがリードフレーム枠部の
表面と裏面とのいずれか一方の一部に貼付けられている
。The present invention provides a lead frame for a semiconductor device in which a lead portion is fixed with a non-conductive resin tape, in which a resin tape having the same thickness as the resin tape is attached to one of the front and back surfaces of the lead frame frame portion. It is attached to the section.

〔実施例〕〔Example〕

次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.

第１図（ａ）、（ｂ）は本発明の第１の実施例の平面図
及び側面図である。FIGS. 1(a) and 1(b) are a plan view and a side view of a first embodiment of the present invention.

第１の実施例は、第１図（ａ）、（ｂ）に示すように、
インナーリード１は樹脂テープ２によって固定されてい
る。さらに、フレーム枠部４にも樹脂テープ１２が貼付
けている。The first embodiment, as shown in FIGS. 1(a) and (b),
Inner lead 1 is fixed with resin tape 2. Further, a resin tape 12 is attached to the frame portion 4 as well.

よって、リードフレーム３を搬送するため重ねた場合、
第３図（ａ）、（ｂ）に示す従来のリードフレーム３の
インナ−リード１先端部に貼付けた樹脂テープ２の厚み
によるリードフレーム３中央部の膨らみがなくなり、リ
ードフレーム３を水平に保持することができるようにな
る。Therefore, when the lead frames 3 are stacked for transportation,
The bulge in the center of the lead frame 3 due to the thickness of the resin tape 2 attached to the tips of the inner leads 1 of the conventional lead frame 3 shown in FIGS. 3(a) and 3(b) is eliminated, and the lead frame 3 is held horizontally. You will be able to do this.

第２図＜ａ）、（ｂ）は本発明の第２の実施例の製造工
程を説明するリードフレーム及び樹脂テープの平面図で
ある。FIGS. 2A and 2B are plan views of a lead frame and a resin tape for explaining the manufacturing process of a second embodiment of the present invention.

第２の実施例は、第２図（ａ）、（ｂ）に示すように、
まず、樹脂テープ３２を打抜きインナーリード１を固定
する樹脂テープ２を貼付ける。The second embodiment, as shown in FIGS. 2(a) and (b),
First, the resin tape 32 is punched out and the resin tape 2 for fixing the inner lead 1 is attached.

次に、樹脂テープ２の打抜き部を含んで、樹脂テープ３
２を打抜き、アウターリードの周囲を囲むフレーム枠部
４に樹脂テープ２２を貼付ける。Next, the resin tape 3 including the punched part of the resin tape 2 is
2 is punched out, and a resin tape 22 is attached to the frame portion 4 surrounding the outer lead.

第２の実施例は、第１の実施例と比べて樹脂テープ３２
は、インナーリード１に貼付けた樹脂テープ２の内抜き
部を含んでフレーム枠部４に樹脂テープ２２を貼り付け
ることができるので、樹脂テープ３２の資材費を節減で
きる効果がある。The second embodiment has a resin tape 32 different from the first embodiment.
Since the resin tape 22 can be attached to the frame portion 4 including the hollow portion of the resin tape 2 attached to the inner lead 1, the material cost of the resin tape 32 can be reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、樹脂チー１２と同一の厚
みをもつ樹脂テープ１２．２２をリードフレーム枠部４
の表面もしくは表面の一部に貼付けているため、リード
フレーム３を搬送するため重ねた場合テープ貼付部の膨
らみがなくなり、リードフレーム３を水平に保持するこ
とができる効果がある。As explained above, in the present invention, the resin tape 12, 22 having the same thickness as the resin chip 12 is attached to the lead frame frame portion 4.
Since the tape is attached to the surface or a part of the surface of the lead frame 3, when the lead frame 3 is overlapped for transportation, there is no bulge in the tape attached portion, and the lead frame 3 can be held horizontally.

また、マウントなどの組立工程において上下方向のひっ
かかりによる変形を防止することができる効果もある。It also has the effect of preventing deformation due to catching in the vertical direction during the assembly process of mounts and the like.

枠部。Frame.

Claims (1)

【特許請求の範囲】[Claims] 　非導電性の樹脂テープでリード部を固定した半導体装
置用リードフレームにおいて、前記樹脂テープと同一の
厚みをもつ樹脂テープをリードフレーム枠部の表面と裏
面とのいずれか一方の一部に貼付けたことを特徴とする
半導体装置用リードフレーム。In a lead frame for a semiconductor device in which a lead portion is fixed with a non-conductive resin tape, a resin tape having the same thickness as the resin tape is pasted to a portion of either the front or back surface of the lead frame frame portion. A lead frame for semiconductor devices characterized by the following.
JP18320190A 1990-07-11 1990-07-11 Lead frame for semiconductor device Pending JPH0471263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18320190A JPH0471263A (en) 1990-07-11 1990-07-11 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18320190A JPH0471263A (en) 1990-07-11 1990-07-11 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPH0471263A true JPH0471263A (en) 1992-03-05

Family

ID=16131542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18320190A Pending JPH0471263A (en) 1990-07-11 1990-07-11 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPH0471263A (en)

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