JPH0470210B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a separating and supplying apparatus for horizontally conveying semiconductor devices.

[Conventional technology] Conventionally, this type of semiconductor device separation and supply equipment is
It is constructed as shown in FIGS. 5 and 6. This will be briefly explained based on the figure. In the figure, reference numerals 1 and 2 denote grooves 3 and 4, which are provided at a predetermined distance from each other in the vertical direction, and which extend in the longitudinal direction of the rail at the front end thereof. A pair of upper and lower rails 5 are clamp holders having a pair of upper and lower clamps 7 and 8 that are movably provided on the sides of both rails 1 and 2 and grip the semiconductor device 6. Both clamps 7 of this clamp holder 5,
8 includes pads 7a and 8 formed of a soft material.
A is attached. Reference numeral 9 designates a stopper pin that is movably provided between the rails 1 and 2 and has an axis extending in a direction perpendicular to the conveying direction of the semiconductor device 6; and 10 is a guide rod that guides the clamp holder 5. . Note that the guide rod 10 and the clamp holder 5 are provided with a rotation stopping function.

In the device for separating and supplying semiconductor devices configured in this manner, the frontmost semiconductor device 6 moving on the rail 2 in the direction shown by arrow A in FIG. When it stops, it is gripped by both clamps 7 and 8 and moves in the direction indicated by B in the figure.

In this way, a large number of semiconductor devices 6 moving on the rail 2 can be successively separated and supplied to the front of the rail.

Note that the semiconductor device 6 on the groove edge is detected by a detector (not shown).

[Problems to be Solved by the Invention] Incidentally, in the conventional separation supply device for semiconductor devices, the structure includes clamps 7 and 8 and stopper pins 9, each of which operates independently of the other, which makes the entire structure complicated. There was a problem.
In addition, both clamps 7 separate and supply the semiconductor device 6.
Since this is done by gripping with the clamps 8, there is a problem that if the gripping force is small, a conveyance error may occur, and if the gripping force is large, the clamps 7, 8 and the semiconductor 6 may be damaged. Furthermore, the separation and supply speed of the semiconductor devices 6 depends on the moving speed of the clamp holder 5, which has the disadvantage of preventing high speed separation and supply. Moreover, in semiconductor devices with burrs, the burrs may become entangled with each other, making it difficult to separate the semiconductor devices sufficiently.

The present invention was developed in view of the above circumstances, and is capable of preventing the occurrence of transportation errors of semiconductor devices and damage to semiconductor devices, etc., as well as simplifying the structure and speeding up separation and supply. Moreover, it is an object of the present invention to provide a semiconductor device separation/supply device that can reliably separate even semiconductor devices with burrs.

[Means for Solving the Problem] A semiconductor device separation and supply apparatus according to the present invention is provided with a conveyance roller for conveying a semiconductor device, which is equipped with a reversibly rotating conveyance roller, and is provided with a conveyance roller that is continuous with the conveyance direction and coincides with the conveyance direction of the conveyance roller. The transport rail is extended so that the rail transport surface is lower than the roller transport surface of the transport roller with a step, and the direction of air jet is directed above the starting end of the transport rail to the rail transport surface. In contrast, an air nozzle is provided which is opened so as to be inclined in the transport direction, and a detection means is further provided to detect that the first semiconductor device placed on the transport roller has been transferred from the transport roller to the transport rail. The apparatus also includes a control means for rotating the reversibly rotatable conveying roller in a direction opposite to the transport direction and injecting air from the air nozzle based on the signal from the detection means.

[Function] In the semiconductor device separation and supply device configured as described above, the conveyance surface of the conveyance rail has a step and is lower than the conveyance surface of the conveyance roller, so that the first semiconductor device and the succeeding semiconductor device are separated. Objects can be separated without any burrs getting tangled. Furthermore, when the first semiconductor device is transferred from the transport roller onto the transport rail, this transport detection means detects it, and based on the signal from this detection means, the reversible rotary transport roller is rotated in the opposite direction to the transport direction. Since air is injected from the air nozzle, a separating effect is applied between the succeeding semiconductor device which is driven in reverse and the first semiconductor device to which air has been injected, causing the succeeding semiconductor device to follow the first semiconductor device. Furthermore, even if the step does not prevent the burrs from becoming entangled, the separating action reliably separates the semiconductor device. Combined with transportation by air jet,
Separate supply of semiconductor devices can be achieved quickly and reliably without damaging the semiconductor devices.

[Embodiment] FIG. 1 is a cross-sectional view showing the entire separation and supply apparatus for semiconductor devices according to the present invention, and FIG. 2 is a cross-sectional view showing the main parts of the separation and supply apparatus for semiconductor devices.
In the same figure, a plurality of conveyance rollers as a conveyance means are arranged in parallel at a predetermined interval in the horizontal direction, and are denoted by the reference numeral 11.
The device is configured to transport the semiconductor device 12 on the device a. Further, in this embodiment, an example is shown in which the reversible rotary conveyance roller 11b is disposed only at the frontmost portion of the conveyance rollers 11 in the direction of conveyance of the semiconductor device. 13 is S(S) from the roller transfer surface 11a.
= 0.3mm to 0.6mm) on the rail conveyance surface 1
3a, the conveyance roller 11
A wall portion 14 extending in the longitudinal direction of the rail is integrally provided on both sides of the rail. Further, this transport rail 13 is provided with a through hole 15 that opens to the rail transport surface 13a. The through hole 15 is located at a distance L from the starting end of the transport rail 13 forward. Note that the dimension L is the size of the semiconductor device 1.
The size is set to be smaller than the package size l of No.2. A guide rail 16 has a guide surface 16a extending in the direction of conveyance of the semiconductor device 12, and is provided above the conveyance roller 11 and the conveyance rail 13 at a predetermined interval. This guide rail 16 is provided with a through hole 17 that opens in the same axial direction as the through hole 15, and a nozzle insertion hole 18 is provided behind this through hole 17. A detector 19 serves as a detection means for detecting the semiconductor device 12 on the rail conveyance surface 13a, and is composed of a light emitting element 19a and a light receiving element 19b, each having an optical axis on the same axis as both the through holes 15 and 17. , are provided in a direction perpendicular to the direction in which the transport rail 13 extends. 20 is the semiconductor device 12
The nozzle is an air nozzle having an injection port 20a that opens in the conveyance direction, and the tip thereof faces into the nozzle insertion hole 18 and is provided above the starting end of the conveyance rail 13. The air jetting direction of this air nozzle 20 is directed toward the rail conveying surface 13a and toward the rail conveying surface 13a.
It is oriented in a direction that is inclined toward the transfer direction by θ (θ=15° to 45°) from a. Reference numeral 21 denotes a guide rail having a tapered surface 21a at its front end, and is provided on both sides of the conveyance roller 11. Note that a rubber layer is formed on the outer peripheral surface of the conveyance roller 11 in order to prevent the semiconductor device 12 from being conveyed incorrectly.
Further, based on the signal from the detector 19, a control means for rotating the reversibly rotatable conveying roller 11b included in the conveying roller 11 in a direction opposite to the direction in which the semiconductor device 12 is conveyed and spouting air from the air nozzle 20. (not shown) is provided.

Next, the operation will be explained.

In the semiconductor device separation and supply apparatus configured as described above, the frontmost semiconductor device 1 moves on the roller transfer surface 11a in the direction indicated by the arrow in FIG.
2 is positioned on the rail conveyance surface 13a,
Air is injected from the air nozzle 20. The air injected from the air nozzle 20 forms a negative pressure atmosphere in front of the semiconductor device 12 and presses the package 12a of the semiconductor device 12 in the transport direction. As a result, the semiconductor device is separated and supplied to the front of the transport rail 13, and is transported at high speed in the direction shown by arrow C in FIG.

In this case, in the present invention, the transport rail 13
Since the rail conveying surface 13a of the semiconductor device 12 is positioned lower than the roller conveying surface 11a of the conveying roller 11 with a step, it is possible to avoid conveyance errors involving the burrs 12b of the frame of the semiconductor device 12, as shown in FIGS. 4a and 4b. Occurrence can be prevented. When the frontmost semiconductor device 12 moving on the roller transfer surface 11a is positioned on the rail transfer surface 13a as described above, the detector 19 detects this and sends this detection signal to the control means. Based on the detection signal, the control means controls the reversibly rotatable transport roller 11b of the transport rollers 11 to rotate in a direction opposite to the direction in which the semiconductor device 12 is transported and to inject air from the air nozzle 20. By performing such an operation, the semiconductor device 12 transferred onto the transfer rail 13 is moved in the transfer direction, while the subsequent semiconductor device 12 on the transfer roller 11 is moved in the opposite direction to the transfer direction. For this reason, an effect is added that attempts to separate the semiconductor device 12 transferred onto the transport rail 13 from the succeeding semiconductor device 12. Therefore, subsequent semiconductor devices 12 are prevented from following the first semiconductor device. Furthermore, even if the burr 12b of the frame of the semiconductor device 12 cannot be untangled due to the step provided between the rail conveying surface 13a and the roller conveying surface 11a,
Since the semiconductor devices are forcibly separated by the above-mentioned separating action, transport errors due to entanglement of the burrs 12b are reliably prevented.

Further, in this embodiment, an example is shown in which a single inline package IC is used as the semiconductor device 12, but the present invention is not limited to this.
Of course, it can also be used for ICs or other ICs.

[Effects of the Invention] As explained above, according to the present invention, a conveyance roller equipped with a reversibly rotating conveyance roller is provided, and the rail conveyance surface of the rail following the conveyance roller has a level difference from the roller transfer surface of the conveyance roller. make it lower,
Based on a signal that detects that the semiconductor device has been transferred from the transport roller to the transport rail, the reversible rotary transport roller is rotated in the opposite direction to the transport direction, and the air nozzle provided above the starting end of the transport rail is Since air is injected to separate and supply the semiconductor devices on the rail transport surface to the front of the rail, it is possible not only to simplify the overall structure of the separation and supply device but also to speed up the separation and supply. Further, by separating and supplying semiconductor devices by air injection, it is possible to prevent transport errors and damage to semiconductor devices and the like. Furthermore, even if a semiconductor device has burrs, it can be reliably separated.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the entire semiconductor device separation and supply apparatus according to the present invention, FIG. 2 is a sectional view showing the main parts of the semiconductor device separation and supply apparatus, and FIG. 3 is a sectional view showing the semiconductor device transport operation. FIGS. 4A and 4B are side views for explaining the transport operation of semiconductor devices, and FIGS. 5 and 6 are cross-sectional views showing a conventional semiconductor device separation and supply apparatus. In the figure, 11 is a conveyance roller, 11a is a roller conveyance surface, 11b is a reversible rotary conveyance roller, 12 is a semiconductor device, 13 is a conveyance rail, 13a is a rail conveyance surface, 19 is a detection means, 20 is an air nozzle, 2
0a is an injection port.

Claims (1)

[Scope of Claims] 1. A transport means comprising a reversible rotary transport roller, on which a semiconductor device is placed and transported, and a transport roller of the transport means that extends so that their transport directions coincide with each other. and a conveyor rail disposed such that the rail conveyance surface has a step with the roller transfer surface of the conveyance roller and is located low; and a conveyance rail provided above the starting end of the conveyance rail, and the air jet direction is aligned with the rail. an air nozzle opened so as to be inclined in the transport direction while facing the transport surface; and detecting that the first semiconductor device placed on the transport roller is transferred from the transport roller to the transport rail. A semiconductor device comprising: a detection means; and a control means for controlling the reversible rotary conveyance roller to rotate in a direction opposite to the transport direction and to inject air from the air nozzle based on a signal from the detection means. Separation and feeding equipment.