JPH0469945A - Apparatus for arranging very small metallic ball - Google Patents
Apparatus for arranging very small metallic ballInfo
- Publication number
- JPH0469945A JPH0469945A JP2183645A JP18364590A JPH0469945A JP H0469945 A JPH0469945 A JP H0469945A JP 2183645 A JP2183645 A JP 2183645A JP 18364590 A JP18364590 A JP 18364590A JP H0469945 A JPH0469945 A JP H0469945A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- bump
- substrate
- fine metal
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 34
- 229910001111 Fine metal Inorganic materials 0.000 claims description 27
- 230000010076 replication Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 235000005607 chanvre indien Nutrition 0.000 description 2
- 244000261228 chanvre indien Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Wire Bonding (AREA)
Abstract
Description
〔産業上の利用分野〕
本発明は、ＩＣチップのｔ掻と外部リードとの接続法の
一種であるＴ Ａ Ｂ （Ｔａｐｅ Ａｕｔｏｍａｔｅ
ｄ Ｂｏｎｄｉｎｇ）法において、微細金属球（以下バ
ンプとも称する。）を所定の配列パターンに従って配列
してＴＡＢテープのリード先端部に転写する際に使用す
る微細金属球の配列装置に関するものである。
〔従来の技術〕
ＴＡＢ法は、ＩＣチップの電極部へのリード配線を、Ｔ
ＡＢテープ上にパターン化されて形成されているリード
の先端部分とＩＣチップのｉ！穫部とを、バンプと呼ば
れる接合用の金属突起を介して接合する方法である。バ
ンプは予めＴＡＢテープのリード側か、もしくはＩＣチ
ップの電極側かのいずれかに取り付けて置き、ＴＡＢテ
ープとＩＣチップの接合は、ボンディングマシンを使っ
て加熱・加圧することにより行う。
バンプをＩＣチップ側でなくＴＡＢテープのすド側に形
成ｊ２ζ゛おく方法は、バ２／グ接ｒ）中（、ごｌＣ千
ノブを傷める心配の無いことから、近・；Ｉ広く１ｉわ
れるよ・）にな、旨゛、きた４、バ／シイ＝ｔ ｊき′
Ｔ″Ａ、 ＋３イブの従来の製造方法に１．−１１、す
〜１・゛りｊシーめ（、，１□゛作。
アＪ７き、バ、・ア４１Ｘ′なる部勺だ（、ｊ４残１−
５（他４．ｌ、ソ〕−ング等Ｃ５より薄く削り取るノ」
”）“；ミや１、−Ｙめガフ、ξ等の基板！−にメツキ
で゛作製１．とおいノ、！ハング４−１、ソー１先端部
１．．′転写すイ）７１′法等がある。但１５１、′れ
らの方法ご作製ｉ″本れたバ５・′ブイ・］き’ｒ Ａ
Ｉ算ｉ−’ニア’は、バングの形状が矩形（、ン：：
６いイ） （２） （！−Ｉ ｉイ、イ、ため、バンブ
の高さがｉＥ鱈ｉ、ご１仙、了いないと、べ／）゛、ｌ
Ｉｃ−７ソゾの電極との接合１．、、”バーシラ」が４
１゜ｉ−′や寸゛いとい・）欠点かあ、また。
オ発明者笠は先１．こ、′■゛Ａ１（ア ブのリ ト
“先端部ζ、ご球形状のバンブ４形成する新しい方法を
、特訓”Ｆ １−２３４９１ ’７ζ・］２゜−シ、（
′出願ｊ２、た１、ζ、の方法番：ｊ１バンブを配列１
べき位置に合わゼＣ貫通人イ′設けた基板の裏側を真空
に吸引しζ＝１−？き、４貫通穴部分にバ′、・ブとな
る金属球を吸い寄せこ′仮固定ｊまた径・に、“Ｔ”
Ａ Ｂう・−グのり−１・と基板Ｊ二仁′配列・（１に
固定６′されこいる金属ｈｉｉとを車ね自わ已７二接合
Ｓ１−るものである。
〔発明が解決ｊ、よ・う５Ｉ４る課題〕■、８形状Ｏ）
パンツ゛は１、′６号・Ｎ１１：で“の、ンリ゛フス基
机等の１（１、□゛メソ１で形成され）、・矩形のパン
ツ°Ｃ，パ比べで゛協形１、や“Ｉ＝−＜ 、＋ｍ合の
点ごはイ１利なものＣあイ：）９１８カ１、なノ）Ｘ
１ｌｌ）、１ ノ４’ ＬＳ： Ｊｌ、ζハング≦、・
形成すｚ：）場合し、ば１、始めから配列“４べき所定
の位置を特定しく′形成′４る、“、！−が゛（ネきる
のに対し０ 、球形状のパンツ゛はバ７バシの状１ｉ１
゜（−ご作製さ第１る人８め、す■定の位置に如何ｔ：
′： ｔ、、、、、−＜′６）、；率良く配列１４”
Ｊ）か、さら（、，１はｌ゛Δ１（〕 −ノ°ｌのリ
ド部分に如何ＩＪ″Ｌ ”（容易に転′５゛４るかが大
きな問題となる。
本発明は１、記事情Ｃ５づ、％−ｊい′となされたちの
Ｃあり、効率良く、ｊ、かも這実にパンｙ’ ｌｉ１’
（７ｉ定の位置に配セ！ｌ ！、、、、、、−ｆ“転与
する。、ｒ−ａができる微細金属球（ハ配列装置ＦｉＪ
、ｉ桿供づ′るごとを！′：１的−４−るものである
。
Ｃ課題４解決４るためＣ１り手段〕
Ｉ記Ｃり ［−１的を達成するための本定１リロ、係る
微細金属球の配列５ｊ１〒置は、微細金属ｆ）（を配列
ｉ゛る〃板と、該基板の微細金属１１（の配列バタ ：
／ （、：対応イ゛る位置乙こ穿謹１１．＼れた貫通穴
ごあ＞ −’ｃ １１つ；１１１記基板の表面側（、Ｊ
微細金属球の直ＩＹより僅かに大きく、、前記基板の裏
面側は微細金属１５ｉ ＋２）内径よりも小さく形成さ
れた貫通穴２：：、 ｌ、 Ｍｉｆ記恭机の裏１ｆｉｉ
に取着され貫通穴（ご対向する吸引用の開１−１部を表
面ｔ、′：イｊ４る１引部と２該！！！弓１部内を減Ｈ
Ｅ ’ｉ−る排気ゴ段とを備え、前記貫ｉ重穴に吸引さ
れた微細金属球の・部分が前記基板の表ｍから突出づ−
るように構成（７たＳ”とを特徴とするものＣある。
また、前記基板は２枚の１′板イ、二重ね合ね干て形成
し、１１つ表面側の平板には微細金属球の直径より僅か
Ｌ７大きい表面側１１通穴を１、塵血便の平板には微細
金属球の直径より小さい裏面側貫通穴を形成ｊ１．でも
よい。
〔作用〕
本発明は前記の構成＋２ごまって、基板の表面側の貫通
穴を微細金属球の的径より僅かに大きく形成し、たこと
により、各貫通穴〇、７は１個の微細金属球し、か入る
ことができない、これＣ１“より、−の貫通穴に複数ｉ
ｕａの微細金属Ｉ斗（が捕捉されイ：）のを防１１−４
る。、Ｉ：た、４吸引され六ｉＥ＋ ｌｌｌ１金属ｆ・
）（の殆どの部分は基板内Ｇこ胛土２”、）ようになる
ので、−追捕擢ｉ″はれた倣岬−、１シ属球が他の夕（
的要因、たとえば他の微細金属球の衝突や震動等ここよ
り、１１通〉[Industrial Field of Application] The present invention is directed to TAB (Tape Automate), which is a type of connection method between an IC chip's taper and an external lead.
The present invention relates to a fine metal ball arranging device used for arranging fine metal balls (hereinafter also referred to as bumps) according to a predetermined arrangement pattern and transferring them to the lead tips of a TAB tape in the d Bonding method. [Conventional technology] The TAB method connects lead wires to the electrodes of an IC chip using a TAB method.
The tip of the lead patterned on the AB tape and the i! of the IC chip. In this method, the metal protrusions called bumps are used to join the metal protrusions called bumps. The bumps are attached in advance to either the lead side of the TAB tape or the electrode side of the IC chip, and the TAB tape and the IC chip are bonded by applying heat and pressure using a bonding machine. The method of forming bumps on the side of the TAB tape instead of on the IC chip side is widely used in the near future as there is no need to worry about damaging the knob during contact. yo・）に、し゛、きた４、ba/sii=t jki'
T″A、+3 Eve's conventional manufacturing method is 1.-11、Su~1・゛rij seame(,,1□゛made. j4 remaining 1-
5 (other 4. l, song, etc.) Scrape off thinner than C5.
”)“; Boards such as Mi, 1, -Y Megaff, ξ, etc.! - Fabrication by plating 1. Tooi no! Hang 4-1, saw 1 tip 1. ．． There are methods such as 71' method. However, 151, ``These methods can be made i''.
I calculation i-'near' means that the shape of the bang is rectangular (,n::
6) (2) (!-I i, i, tame, the height of the bump is iE cod i, you're 1 sen, you have to finish, be/)゛, l
Bonding with Ic-7 Sozo electrode 1. ,,"Bersilla" is 4
1゜i-′ and size゛itoi・) Shortcomings, again. Inventor Kasa is first 1. This,'■゛A1(F1-23491 '7ζ・]2゜-shi,(
'Method number of application j2, ta1, ζ: j1 bump array 1
Align it to the desired position and vacuum the back side of the board where ζ = 1-? Then, temporarily fix the metal ball that will become the bulb in the 4 through-hole part.
The A B glue 1 and the metal 6' fixed to the board J2' array (1) are connected to the car by 72 joints S1. j, Yo・U5I4Ru assignment〕■, 8 shape O)
The pants are 1, No. 6, N11: 1 (formed by 1, □゛ meso 1), rectangular pants °C, and 1 is the same shape as the pa. “I=-< , +m combination is 1 advantageous C:)918 KA1, nano)X
1ll), 1 no 4' LS: Jl, ζ hang≦,・
Form z:) If 1, specify the predetermined position of the array ``4'' from the beginning, ``form''4,'',! - is ゛ (0 for the neck, spherical pants ゛ is a 7-bashi shape 1i1
゜(-Please make the first person 8, how about in the fixed position?
′: t, , , , -<'6), ; Good arrangement 14"
J) or Sara(,,1 is l゛Δ1() - no°l
The big problem is how to easily transfer IJ"L" (easily) to the C part.The present invention has 1, article information C5, %-j', and can be efficiently and j , Kamohori-ni bread y'li1'
(7i Arrange in a fixed position! l !, , , , -f" transfer., ra can be made fine metal spheres (c Array device FiJ
, i-kakuzu'rugoto! ': 1-4-. C1 Means for Solving Problem 4] I Note C [Required 1 to achieve target -1, the arrangement of the fine metal balls 5j1 is the arrangement of the fine metal f) (i) Arrangement pattern of the plate and the fine metal 11 of the substrate:
/ (, : Corresponding position ゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛゛Diare〇 11.㼼Drilled through hole〉 -'c 11; 111 on the surface side of the board (゜J
Slightly larger than the diameter IY of the fine metal ball, the back side of the substrate is formed with a fine metal 15i +2) A through hole 2 formed smaller than the inner diameter::, l, the back side of the Mif recording desk 1fii
It is attached to the through hole (the opening 1-1 for suction facing the surface t,': I j4, 1 pull part and 2!!! Bow 1 part inside is reduced H)
A part of the fine metal sphere sucked into the through-hole protrudes from the surface of the substrate.
There is a type C which is characterized by a structure (7S).The substrate is made of two 1' plates, double folded and dried, and the 11th flat plate on the front side is coated with fine metal. It is also possible to form an 11 through hole on the front side that is slightly L7 larger than the diameter of the ball, and a through hole on the back side that is smaller than the diameter of the fine metal ball on the flat plate of dust and blood. [Function] The present invention has the above configuration +2. Then, the through holes on the front surface side of the substrate were formed slightly larger than the target diameter of the fine metal balls, so that each through hole 〇 and 7 contained one fine metal ball, which could not enter. From C1", there are multiple i in the - through hole.
Preventing UA's fine metal Ito (I:) from being captured 11-4
Ru. ,I:ta,4 attracted 6iE+ lll1 metal f・
) (Most of the parts of the substrate are covered with 2",), so that - the traced cape -, one genus sphere is the other (
factors, such as collisions with other fine metal balls, vibrations, etc. From here, 11 letters>
【から飛び出イことばない。
また、表面側貫通穴と兜面側ｐｆ浦六）苓それイ！れ別
個の平板Ｃ穿設Ｌ２、これらの１パ板庖重ね合わせて与
板を形成づるごとにより、基板の加丁が容易になる。
［実施例］
以ｔにオ発明の一実施例を第１図乃？第３図を参照り、
Ｃ説明４る。第１図は本発明の一′に施例である微細金
属ＬＦの配列装置く以下バング配列装置とも称する。）
の配列部の概略斜視図、第２図はその配列部の概略断面
図、第３図はその微細金属球の配列装置”を用いたバ／
プ転ｒ３′装置の檀略橘成図である。本実施例においζ
はパンツ“ａしてｆ１行８０μｍの球形状のもの−４た
と拭ば、金球を使用している。
第３図に示すバンプ転写装置は、バンプ２を吸引して所
定の位置に配列するバンプ配列装置４と、ＴＡＢテープ
２２を送り出す機構（不図示）と、ＴＡＢテープ２２の
リード２６の先端部にバンプ２を転写するために加熱・
加圧するボンディングツール３０とを有するものである
。
バンプの配列装置４は、配列部１０と排気部２０とから
なる。配列部１０は、第１図及び第２図に示すようにバ
ンプ配列用の２枚の基板１２ａ。
１２ｂと、排気部２０により内部が減圧される吸引部１
４とからなる。また、配列部１０と、排気部２０とは排
気管１８を介して繋がれている。
本実施例の配列部１０においては、基板１２ａ。
！２ｂは共にニッケル類のものを使用し、基板１２ａの
厚さＡは６０μｍ、基板１２ｂの厚さＢは３０ａｍであ
る。基板１２ａ、１２ｂにはバンプ２を配列すべき全て
の位置にそれぞれ貫通穴１３が設けられている。基板１
２ａの貫通穴（表面側貫通穴） １３ａは直径Ｃが１１
００ｐに、基板１２ｂの貫通穴（裏面側貫通穴） １３
ｂは直径りが６０μｍに形成されている。吸引部１４に
は貫通穴１３ａ、１３ｂに対応して開口部１５が形成さ
れている。
貫通穴１３ａの直径をバンプ２の直径より僅かに大きく
形成しているのは貫通穴１３ａにバンプが一つだけ入る
ようにするためである。したがって、たとえば本実施例
におけるように直径８０μｍのバンプを使用する場合に
は、貫通穴１３ａの径は９０〜１００μｍ程度が望まし
い、また、貫通穴１３ｂは吸引力によりバンプ２を貫通
穴１３ａ内に吸引する役割を担うので、ハンプ２の大き
さより小さく形成すればよい、尚、基板１２ａは、バン
プを貫通穴１３ａに捕捉したときにバンプの一部分が基
板１２ａの表面から突出するように形成されている。本
実施例では基板１２ａの上面からのバンプの突出高さは
約７μｍであるが、−船釣にこの突出高さはバンブ直径
の１／２以下となるようにすることが望ましい。
本装置を用いてバンプを所定パターンに配列しＴＡＢテ
ープに転写するには、先ず排気部２０を作動させて排気
管１６を介して、吸引部１４内を減圧状態にする。これ
により、貫通穴１３ｂを介して貫通穴１３ａに吸引力を
発生させることができる。この状態のときに、たとえば
基板１２ａ上にバンプ２をふりかけるような方法でバン
プ２を貫通穴１３ａに吸引させて、所定のパターンに配
列する。また、バンプの配列部１０を多数のバンプが載
っている受は皿等のバンブ供給機構部（不図示）の近く
に寄せて、バンプを貫通穴１３ａ内に吸引するようにし
てもよい。
ところで、基板１２ａがない場合には、バンプは吸引力
だけで基板上に配列されているので、震動等が生じたと
きには定位置に収まったバンプが動いて外れてしまうこ
とがある。また、第４図に示すように複数のバンプが同
一の貫通穴に捕捉されてしまうこともある。このような
バンプの欠落や捕捉があると、転写不良が生じ、転写の
際の歩留りが著しく低下する。
本実施例においては、基板にバンプよりも僅かに大きな
穴を形成したことにより、第２図に示すようにバンプ２
は基板１２ａの貫通穴１３ａに落ち込んだ状態で捕捉さ
れる。したがって、たとえば震動等によりバンプ２が）
ぷり動かされたとしてもバンプ２は貫通穴１３ａの周縁
によって保持されているので、バンプが貫通穴１３から
飛び出して、欠落することはない。また、貫通穴１３ａ
はバンプの直径（８０μｍ）より僅かに大きいだけであ
るので、各貫通穴１３ａには１個のバンプ２しか入るこ
とができず、したがって、２個以上のバンプが一つの貫
通穴１３に集まることはない。
バンプ２を吸引して配列した後は、バンブ配列装置４の
基板１２はボンディング受は部の役割を果たすことにな
る。先ず、ポリイミド等の絶縁物からなるフィルムキャ
リア２４上にリード２６が形成されたＴＡＢテープ２２
と基板１２ａとの間の位置を、図示しない位置合わせ調
整機構部を用いて調整する。バンプ配列装置４の位置が
決まったら、適当な温度に加熱されているボンディング
ツール３０により一定の荷重を作用させることにより、
貫通穴１３ａに吸引されていたバンプ２を”ｒ Ａ Ｂ
）−グの７まれたり・−ド２６の先端部に転写・接合
（る。
また、基板１２は１．貫通穴１３ ａ心、１引されたバ
ンブ２の 部が基板１２ａの表面から突出４るよ）むこ
形成されている。ごれｔ、′より、バ／′グｔ′Ｉ゛Ａ
Ｂｅ グに転ち４る１稈に；ｌ−；いズ、パンツ°２
が変形し２、“Ｃも、基板１２がり−ｈ′２６に接触１
．？リード２６４−…傷し、ないようにしζいる。
バングシ）を写し、取られたバング配列′装置４は川び
バンブを配列する１稈に戻り、同時仁ゾ丁Ａ Ｂラージ
２２が一ニア７分込られ”ζ♀ＩＩたム゛ル−・ノアが
転゛す信置に送ら叫する。ぞし２て、［記と同様にバン
グ配列装置４０’）４Ｊ置を調整１−、た篠・、バンブ
２４、ＴΔ１３ブー・グ２２のリード２６の先端部Ｃご
転′ら″・接合４゛る。
このようにバンブを配列す゛る上程、ハンゾ各′１゛Ａ
、 Ｂ ｙ５・−ブに転′す４る１程、’１’ＡＢテー
グる−２７送るＩ丁程梳連続的に動作、トセることがご
きるので、′】゛へ１（メーーブのリード先端部へ・の
バングの転写・接合を極め°Ｃ能率的に行うこまがごき
る。
本実施例のバング配列装置におい°（′は、η、−板１
２６Ｊ−・つのバングだけ・を捕１足４′るＨ通人１３
ａを設（１ｊたこと【６゛より、 ｊ１捕）Ｆされたバ
ングが外的唱“因、た２、えば他のハンプ２の衝突や農
動等？、、： ｃＪ：り外部に飛び出４−”の４防ｊ１
するＪ７２がごきる。さらｉ、： 、、複数個のハンプ
が同・の貫通穴１３に捕捉されるの苓ＩＬｆ月１−する
こμ、ができるのζゝ、ハンプを所定の配列位置に値失
（、υつずり配列ζることができる。したが、Ｃ、ハン
プ゛をＴへ１３う− グのソー１先端部に転゛１ツζる
際の歩留り遺著［、り向１−１させるここが−ごきる。
第５図は本実施例（、，４用いられる配列部の他の例を
小４”概略斜視図ごある。第り図に示１配列部１００１
４８角形状に形成されζいる。ｓ！枚のバンブ配列用の
基板１２０ａ、１２０ｂにば貫通穴１３０ａ、１３０
ｂが１記の実施例と同様に形成されζいる。耕気管１６
０は回転軸をも兼ねこおり、Ｊｕｌ気部２０に腎がっ゛
こいる。この配列部１００を用いる場合は、たとえば配
列部１００のＦ力にハンプ供給機構を設置しておくこと
にまり、容品にバンブを吸引・配列することができる。
バンブの配列装置１００を回転し５て１１部に来た基板
１２０ａがボンディング受Ｇ〕部の役割を果釘。そし、
゛（前述と同様にして基枦、１２０−十に配列されたバ
ングがｌ” Ａ １１う−ブのリード先端部ら′転′ら
゛される。
向、上記の実施例では、異なる大きさの貫通穴を有ぐる
２枚の平板を重ね合わせて基板を形成Ｌ７た場合に・）
いて説明したが、本発明はこれζに限定されるものでは
なく、第６図（２示４−よ−＞ Ｃご一枚の基板１２に
直径の異なる２つの同心状の穴４形成と７でもよい。
また８−１−記の実施例では、異なる人きさの貫通穴４
７段状に形成し、た場合についご説明したが、この貫通
穴は、たとえばラーバー状に形成し２”−こもよい。
史に、１記の実施例では、吸引部の上面に１つの大きな
開口部を設＆Ｊた場合についこ説明したが、関Ｉ］部は
基板の貫通穴の配列パターンに対向４るようζざ溝状に
、形成Ｌ ’７もよい。
〔発明の効果）
以Ｊ説明（７たＡ、うに４発明−よれば、吸引された微
細金属球は、イの殆どの部分が基板内に埠まるようにな
るので、微細金属ｌ↓を効］シよく所定の（◇置に確実
に一つずつ配列することができ、し“たがっ“で例えば
微細金属球を゛１゛八Ｆ３う グのり・１部に転）づる
際の歩％７りを著しく向ｊさせることができる微細金属
球の配列装置を・提供壇ることができる。[There are no words that jump out at me. Also, there is a through hole on the front side and a PF on the helmet side. By forming separate flat plates C perforated L2 and overlapping these two plates to form a covering plate, the cutting of the substrate becomes easy. [Example] An example of the invention is shown in Figure 1 below. Referring to Figure 3,
CExplanation 4. FIG. 1 shows a device for arranging fine metal LF, which is a first embodiment of the present invention, hereinafter also referred to as a bang arranging device. )
Fig. 2 is a schematic cross-sectional view of the arrangement part, and Fig. 3 is a schematic perspective view of the arrangement part of the microscopic metal spheres.
FIG. 3 is a schematic diagram of the configuration of the printer r3' device. In this example, the odor ζ
The gold ball is used in the pants as shown in Figure 3, which is a spherical ball with a row of f1 of 80 μm.The bump transfer device shown in FIG. A bump arrangement device 4, a mechanism (not shown) for sending out the TAB tape 22, and a heating and
It has a bonding tool 30 that applies pressure. The bump arrangement device 4 includes an arrangement section 10 and an exhaust section 20. The arrangement section 10 includes two substrates 12a for bump arrangement, as shown in FIGS. 1 and 2. 12b, and a suction section 1 whose interior is depressurized by the exhaust section 20.
It consists of 4. Furthermore, the array section 10 and the exhaust section 20 are connected via an exhaust pipe 18. In the array section 10 of this embodiment, the substrate 12a. ! Both substrates 2b are made of nickel, and the thickness A of the substrate 12a is 60 μm, and the thickness B of the substrate 12b is 30 am. Through holes 13 are provided in each of the substrates 12a and 12b at all positions where the bumps 2 are to be arranged. Board 1
Through hole 2a (front side through hole) 13a has a diameter C of 11
00p, through hole of board 12b (back side through hole) 13
b is formed to have a diameter of 60 μm. An opening 15 is formed in the suction portion 14 in correspondence with the through holes 13a and 13b. The reason why the diameter of the through hole 13a is made slightly larger than the diameter of the bump 2 is to allow only one bump to fit into the through hole 13a. Therefore, for example, when using a bump with a diameter of 80 μm as in this embodiment, the diameter of the through hole 13a is desirably about 90 to 100 μm, and the through hole 13b allows the bump 2 to be pulled into the through hole 13a by suction force. Since it plays the role of suction, it is sufficient to form the hump 2 smaller than the size of the hump 2. The substrate 12a is formed so that a portion of the bump protrudes from the surface of the substrate 12a when the bump is captured in the through hole 13a. There is. In this embodiment, the height of the protrusion of the bump from the upper surface of the substrate 12a is approximately 7 μm, but for boat fishing it is desirable that the height of the protrusion be less than 1/2 of the diameter of the bump. In order to arrange bumps in a predetermined pattern and transfer them onto a TAB tape using this device, first, the exhaust section 20 is operated to bring the inside of the suction section 14 into a reduced pressure state via the exhaust pipe 16. Thereby, suction force can be generated in the through hole 13a via the through hole 13b. In this state, the bumps 2 are drawn into the through holes 13a by, for example, sprinkling them on the substrate 12a, and arranged in a predetermined pattern. Further, the bump array section 10 may be placed near a bump supply mechanism section (not shown) such as a plate so that the bumps are sucked into the through hole 13a. By the way, in the absence of the substrate 12a, the bumps are arranged on the substrate only by suction force, so that when vibrations or the like occur, the bumps that have been placed in a fixed position may move and come off. Further, as shown in FIG. 4, a plurality of bumps may be trapped in the same through hole. If such bumps are missing or captured, a transfer failure occurs and the yield during transfer is significantly reduced. In this example, by forming a hole slightly larger than the bump in the substrate, the bump 2 is formed as shown in FIG.
is trapped in the state of falling into the through hole 13a of the substrate 12a. Therefore, for example, bump 2 due to vibration etc.)
Even if the bump 2 is moved, the bump 2 is held by the periphery of the through hole 13a, so the bump will not jump out of the through hole 13 and be lost. In addition, the through hole 13a
is only slightly larger than the diameter of the bump (80 μm), so only one bump 2 can fit into each through hole 13a, and therefore two or more bumps can gather in one through hole 13. There isn't. After the bumps 2 are attracted and arranged, the substrate 12 of the bump arrangement device 4 serves as a bonding receiver. First, a TAB tape 22 with leads 26 formed on a film carrier 24 made of an insulating material such as polyimide is formed.
The position between the substrate 12a and the substrate 12a is adjusted using an alignment adjustment mechanism (not shown). Once the position of the bump arrangement device 4 is determined, by applying a constant load to the bonding tool 30 heated to an appropriate temperature,
The bump 2 that was attracted to the through hole 13a is
7 of the board 12 is transferred and bonded to the tip of the board 26. In addition, the board 12 has a center 1 through hole 13a, and the part of the bump 2 drawn by 1 protrudes from the surface of the board 12a. ) The mucosa is formed. Gore t,'from ba/'gt'I゛A
Be turned into a 4 culm;l-;Izu, pants °2
is deformed and 2, "C also contacts the board 12 - h'26 1
．． ? Lead 264--...Take care not to damage it. The removed bhang array device 4 returns to one culm for arranging the river bhang, and at the same time, the A B large 22 is inserted for 7 minutes and the ``ζ♀II'' mul. Noah sends it to the transfer station and shouts. Then, adjust the 4J position (bang arrangement device 40' as described above) 1-, Tashino, bam 24, TΔ13 boog 22 lead 26 There is a 4" joint at the tip of C. In the process of arranging the bumps like this, Hanzo each '1'A
, B y5. The top moves to transfer and bond the bangs to the tip extremely efficiently. In the bang arrangement device of this embodiment,
26J-・H-passer 13 who catches only one bang
A was set (1j) [From 6゛, j1 caught] The bang that was F was caused by an external chant ``Cause, for example, a collision with another hump 2, agricultural movement, etc.?'' cJ: 4-”4 defense j1
J72 is here. In addition, when multiple humps are captured in the same through hole 13, it is possible to set the humps at a predetermined array position (, υ). However, when transferring the hump to T to the tip of the saw 1 of the 13-movement, there is a yield difference [, where the direction is 1-1. Figure 5 is a schematic perspective view of another example of the array section used in this embodiment.
It is formed in a 48-sided shape. s! Through holes 130a and 130 are provided in the bump array substrates 120a and 120b.
b is formed in the same manner as in the first embodiment. Cultivation pipe 16
0 also serves as the rotation axis, and the kidney is located in the Jul air section 20. When using this arrangement section 100, for example, a hump supply mechanism is installed in the F force of the arrangement section 100, and the bumps can be sucked and arranged on the container. After rotating the bump arrangement device 100, the board 120a that came to the 11th part plays the role of the bonding receiver G]. stop,
(In the same manner as described above, the bangs arranged in a 120-10 pattern are rotated from the lead tip of the 11th wave. When a board is formed by overlapping two flat plates with through-holes L7...)
However, the present invention is not limited to ζ, and as shown in FIG. In addition, in the embodiment described in 8-1-, the through holes 4 of different humanities
Although we have explained the case where the through hole is formed in seven steps, it is also possible to form the through hole in a rubber shape and have a diameter of 2". As explained above in the case where an opening is provided, the section I] may also be formed in the shape of a groove L'7 so as to face the arrangement pattern of the through holes of the substrate. [Effects of the Invention] According to the explanation (7. It is possible to reliably arrange them one by one in each location, and it can significantly improve the step rate when rolling, for example, fine metal balls (1, 8 F3, 1 part). It is possible to provide an arrangement device for fine metal spheres.
第１図は本発明の−・実施例Ｃある微細金属球の配列装
置の配列部の概略斜視しｌ、第２図はその配列部の概略
断面図、第３図ＣＪその微細金属球の配列装置不用いた
バンブ転写装置の概略構成し１、第４図はバングをＶｌ
！する貫通穴４イ１しない基板を使用した場合のバング
の配置状態を説明するノ、−めの図、第５１ｆｆｉは本
実施例ＧＸ、用いられる配列部の他の例を示Ｊ−概略斜
視図、第６図は配列部の基板の他の例を示ψ°閏である
４、
２・・・バング、４・・・ハンプ配列装置、１２ａ、１
２ｂ、−，７Ａ板、
１３ ａ。
１４・・・
１６・・・
２２ ・・・
２４ ・・・
３０ ・・・
１３ｂ・・・貫通穴・
吸引部、１５・・・開口部、
排気管、２０・・・排気部、
ＴＡＢテープ、
フィルムキャリア、２６・・・
ボンディングツール。
リード、Fig. 1 is a schematic perspective view of the arrangement section of a certain micro metal ball arrangement device according to embodiment C of the present invention, Fig. 2 is a schematic sectional view of the arrangement section, and Fig. 3 CJ is the arrangement of the micro metal spheres. The schematic configuration of a bump transfer device that does not require a device is shown in Figures 1 and 4.
! Fig. 51 is a diagram illustrating the arrangement of the bangs when a board without through holes 4 and 1 is used; Fig. 51ffi is the present embodiment GX; Fig. 51 is a schematic perspective view showing another example of the arrangement section to be used; , FIG. 6 shows another example of the substrate of the array section.
2b, -, 7A plate, 13a. 14... 16... 22... 24... 30... 13b... Through hole/suction part, 15... Opening part, exhaust pipe, 20... Exhaust part, TAB tape, Film carrier, 26... Bonding tool. lead,
Claims (2)
球の配列パターンに対応する位置に穿設された貫通穴で
あって且つ前記基板の表面側は微細金属球の直径より僅
かに大きく、前記基板の裏面側は微細金属球の直径より
も小さく形成された貫通穴と、前記基板の裏面に取着さ
れ貫通穴に対向する吸引用の開口部を表面に有する吸引
部と、該吸引部内を減圧する排気手段とを備え、前記貫
通穴に吸引された微細金属球の一部分が前記基板の表面
から突出するように構成したことを特徴とする微細金属
球の配列装置。(1) A substrate on which fine metal spheres are arranged, and a through hole drilled at a position corresponding to the arrangement pattern of the fine metal spheres on the substrate, and the surface side of the substrate is slightly smaller than the diameter of the fine metal spheres. a through hole formed on the back side of the substrate to be smaller than the diameter of the fine metal sphere; a suction section attached to the back side of the substrate and having a suction opening facing the through hole on the surface; What is claimed is: 1. An arrangement device for fine metal spheres, comprising: an exhaust means for reducing the pressure in the suction section, and configured such that a portion of the fine metal spheres sucked into the through hole protrudes from the surface of the substrate.
、且つ表面側の平板には微細金属球の直径より僅かに大
きい表面側貫通穴が、裏面側の平板には微細金属球の直
径より小さい裏面側貫通穴が形成されている請求項１記
載の微細金属球の配列装置。(2) The substrate is formed by overlapping two flat plates, and the front side flat plate has a through hole slightly larger than the diameter of the fine metal sphere, and the back side flat plate has a through hole slightly larger than the diameter of the fine metal sphere. 2. The arrangement device for fine metal balls according to claim 1, wherein a smaller through-hole is formed on the back side.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2183645A JPH0727929B2 (en) | 1990-07-10 | 1990-07-10 | Arrangement device of fine metal balls |
| MYPI91000398A MY106135A (en) | 1990-03-14 | 1991-03-12 | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same. |
| EP91302037A EP0447170B1 (en) | 1990-03-14 | 1991-03-12 | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same |
| DE69132891T DE69132891T2 (en) | 1990-03-14 | 1991-03-12 | Method for connecting bumps on TAB carrier conductors and an apparatus for arranging bumps |
| US07/669,189 US5114878A (en) | 1989-09-11 | 1991-03-13 | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same |
| KR1019910004083A KR940004247B1 (en) | 1990-03-14 | 1991-03-14 | Bump arranging equipment and method for connecting bump to lead of tab tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2183645A JPH0727929B2 (en) | 1990-07-10 | 1990-07-10 | Arrangement device of fine metal balls |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0469945A true JPH0469945A (en) | 1992-03-05 |
| JPH0727929B2 JPH0727929B2 (en) | 1995-03-29 |
Family
ID=16139419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2183645A Expired - Lifetime JPH0727929B2 (en) | 1989-09-11 | 1990-07-10 | Arrangement device of fine metal balls |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727929B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107181A (en) * | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
| US6906427B2 (en) | 1997-04-17 | 2005-06-14 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| JP2005328017A (en) * | 2004-04-16 | 2005-11-24 | Hitachi Metals Ltd | Equipment for arranging electroconductive particles |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005243723A (en) * | 2004-02-24 | 2005-09-08 | Ibiden Co Ltd | Mask for settling conductive ball |
-
1990
- 1990-07-10 JP JP2183645A patent/JPH0727929B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6906427B2 (en) | 1997-04-17 | 2005-06-14 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
| KR100574215B1 (en) * | 1997-04-17 | 2006-04-27 | 세키스이가가쿠 고교가부시키가이샤 | Conductive particles |
| US6107181A (en) * | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6432806B1 (en) | 1997-09-08 | 2002-08-13 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
| JP2005328017A (en) * | 2004-04-16 | 2005-11-24 | Hitachi Metals Ltd | Equipment for arranging electroconductive particles |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0727929B2 (en) | 1995-03-29 |
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