JPH0469065B2 - - Google Patents
Info
- Publication number
- JPH0469065B2 JPH0469065B2 JP60048771A JP4877185A JPH0469065B2 JP H0469065 B2 JPH0469065 B2 JP H0469065B2 JP 60048771 A JP60048771 A JP 60048771A JP 4877185 A JP4877185 A JP 4877185A JP H0469065 B2 JPH0469065 B2 JP H0469065B2
- Authority
- JP
- Japan
- Prior art keywords
- mirror plate
- mirror
- pressure
- heater
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 49
- 238000000465 moulding Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000565 sealant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、多層プリント配線板並びに銅張積層
板、非銅張積層板等の積層板を真空加圧加熱成形
する際に用いる成形用鏡面板の改良に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a mirror-finished molding plate used in vacuum pressure and heat molding of multilayer printed wiring boards and laminates such as copper-clad laminates and non-copper-clad laminates. It is about improvement.
従来の技術
従来、多層プリント配線板並びに該多層プリン
ト配線板に用いる銅張積層板、非銅張積層板等の
積層板を真空加圧加熱し成形する技術として、本
出願人が先に出願している特願昭60−17451号、
特願昭60−27480号がある。Prior Art Conventionally, the present applicant previously filed an application for a technology for molding multilayer printed wiring boards and laminates such as copper-clad laminates and non-copper-clad laminates used in the multilayer printed wiring boards by applying vacuum pressure and heating. Patent Application No. 17451, 1986,
There is a special application No. 1983-27480.
これらの技術は、定盤（プラテン）１０上に、
積層板を成形するための材料である被成形材Ｃを
第８図に示すように鏡面板Ｅを挟んで多段に積載
配置し、その上に耐熱性があり且つ柔軟性のある
真空バツクフイルム１５にて被覆密封して圧力容
器内に収容し密閉した後、前記真空バツグフイル
ム１５内を減圧すると共に前記容器内に高圧蒸気
を供給するか、または、高圧ガスを供給し該ガス
を加熱して被成形材を加圧加熱し接着硬化せしめ
成形するものである。 In these technologies, on the surface plate (platen) 10,
As shown in FIG. 8, the material to be formed C, which is the material for forming the laminate, is stacked in multiple stages with mirrored plates E in between, and a heat-resistant and flexible vacuum backing film 15 is placed thereon. After the vacuum bag film 15 is covered and sealed and placed in a pressure vessel and hermetically sealed, the pressure inside the vacuum bag film 15 is reduced and high pressure steam is supplied into the vessel, or high pressure gas is supplied and the gas is heated. The material to be molded is heated under pressure to harden the adhesive and then molded.
発明が解決しようとする問題点
しかしながら、この技術では、下記のような問
題点を抱えている。Problems to be Solved by the Invention However, this technique has the following problems.
例えば、被成形材Ｃを加熱加圧プログラムに従
い加熱し加圧した場合、被成形材Ｃは、一般に、
４層、６層に成形したとしても１〜２mm前後と薄
いものであるが、面積は330mm×500mm、500mm×
500mm、600mm×600mm等と広く、しかも、加熱は
熱風や蒸気を用いているため被成形材の表面より
加熱される。のため、被成形材は第８図に示すよ
うに多段に積載された被成形材の上下面及び四側
面から加熱されるが、中間部の芯部（中央部）へ
の熱伝達が遅くなり、従つて、被成形材の表面部
と芯部とは第９図のグラフの一点鎖線で示すよう
に大きな温度差が生じる。 For example, when a material to be formed C is heated and pressurized according to a heating and pressurizing program, the material to be formed C is generally
Even if it is formed into 4 or 6 layers, it will be thin at around 1 to 2 mm, but the area will be 330 mm x 500 mm, 500 mm x
It has a wide range of 500 mm, 600 mm x 600 mm, etc., and because it is heated using hot air or steam, it is heated from the surface of the material to be formed. Therefore, as shown in Figure 8, the material to be formed is heated from the top, bottom and four sides of the material stacked in multiple stages, but the heat transfer to the core (center) of the intermediate portion is slow. Therefore, a large temperature difference occurs between the surface portion and the core portion of the material to be formed, as shown by the dashed line in the graph of FIG.
その温度差により、被成形材のプリプレグは熱
硬化性樹脂を含浸させたものを用いているため、
その特性により被成形材の表面部が溶融している
にもかかわらず、その芯部は未だ溶融せず、従つ
て、加圧による上からの押圧と減圧による横から
の真空引きを行う手段を用いても、なお、プリプ
レグに内在している気泡（ガス）の押し出しがで
きず、従つて、プリプレグ外部の真空中に排出さ
せることが困難であり芯部に気泡が残留する。 Due to the temperature difference, the prepreg material to be molded is impregnated with thermosetting resin, so
Due to its characteristics, even though the surface part of the material to be formed is melted, the core part is not yet melted. Even if it is used, the bubbles (gas) contained in the prepreg cannot be extruded, and therefore it is difficult to expel them into the vacuum outside the prepreg, and the bubbles remain in the core.
そこで、この気泡の残留をなくするため、被成
形材Ｃを昇温する速度とゆつくりにして被成形材
Ｃの芯部と表面部との温度差を少なくし気泡の残
留を防止しているが、反面、昇温が遅いため成形
時間が長くなり、生産能率を低下させるという新
たな問題が生じている。 Therefore, in order to eliminate the remaining air bubbles, the rate at which the temperature of the material to be formed C is raised is slowed down to reduce the temperature difference between the core and surface of the material to be formed, thereby preventing the air bubbles from remaining. However, on the other hand, a new problem has arisen in that the temperature rise is slow, which lengthens the molding time and reduces production efficiency.
本発明は前述の問題点を解決することを目的と
して開発したものである。 The present invention was developed with the aim of solving the above-mentioned problems.
問題点を解決するための手段
本発明である積層板の成形用鏡面板は、積層板
を真空加圧加熱成形するにおいて、被成形材を挟
持する鏡面板にヒータを内蔵すると共に、前記鏡
面板の温度を制御する制御手段を設けたことを特
徴としたものである。Means for Solving the Problems The mirror plate for forming a laminate according to the present invention has a built-in heater in the mirror plate that clamps a material to be formed when a laminate is subjected to vacuum pressure and heat molding. The device is characterized by being provided with a control means for controlling the temperature of the device.
実施例
以下、添付図面に従い本発明の実施例を説明す
る。Embodiments Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
最初に、説明に先立ち本発明でいう積層板につ
いて説明する。 First, prior to the explanation, the laminate as used in the present invention will be explained.
本発明でいう積層板とは、多層プリント配線板
並びに該多層プリント配線板に用いる銅張積層
板、非銅張積層板（例えばアルミニウム張積層
板）等の積層板のことをいう。その積層板を積層
成形す
被成形材とは、前記積層板を成形するための材
料であり、前記銅張積層板、非銅張積層板を含
み、プリプレグ、銅箔などより構成したものであ
る。 The laminate used in the present invention refers to a multilayer printed wiring board and a laminate such as a copper-clad laminate, a non-copper-clad laminate (for example, an aluminum-clad laminate), etc. used in the multilayer printed wiring board. The material to be formed is a material for forming the laminate, and includes the copper-clad laminate and non-copper-clad laminate, and is composed of prepreg, copper foil, etc. .
プリプレグとは、紙、ガラス布などの基材にフ
エノール樹脂ワニスやエポキシ樹脂ワニスなど熱
硬化性樹脂ワニスを含浸させて樹脂含浸シートを
作成し、この樹脂含浸シートを乾燥させてＢステ
ージ化したものである。 Prepreg is made by impregnating a base material such as paper or glass cloth with thermosetting resin varnish such as phenol resin varnish or epoxy resin varnish to create a resin-impregnated sheet, and then drying this resin-impregnated sheet to make it B-stage. It is.
銅張積層板とは、前記プリプレグを定寸法に切
断し、該プリプレグを複数枚重ねてプリプレグの
片面または両面に銅箔を貼り合わせ加熱加圧し接
着硬化成形したものである。 A copper-clad laminate is obtained by cutting the above prepreg into a fixed size, stacking a plurality of sheets of the prepreg, pasting copper foil on one or both sides of the prepreg, and applying heat and pressure to adhesively cure and mold.
多層プリント配線板とは、１例として片面銅張
積層板、プリプレグ、内層回路板、プリプレグ、
片面銅張積層板を順次積層し加熱加圧し接着硬化
成形したものである。 Examples of multilayer printed wiring boards include single-sided copper-clad laminates, prepregs, inner layer circuit boards, prepregs,
Single-sided copper-clad laminates are laminated one after another and bonded and cured by heating and pressing.
更に、本発明で用いる特殊な用語について説明
する。 Furthermore, special terms used in the present invention will be explained.
ボイドとは、積層板に用いるプリプレグには若
干の水分、積層時の空気、塗工紙布に内包されて
いる空気および未反応の樹脂原料の揮発性物質等
が気泡として含まれており、その状態のまま加熱
加圧成形した場合に積層板内部に発生するガス状
の物体のことをいう。そして、このボイドの残溜
は積層板の特性性を著しく低下させる。 Voids are air bubbles that are contained in the prepreg used for laminates, such as some moisture, air during lamination, air contained in coated paper cloth, and volatile substances from unreacted resin raw materials. This is a gaseous substance that is generated inside a laminate when it is heated and pressure-molded in its original state. The remaining voids significantly deteriorate the properties of the laminate.
真空バツグフイルムとは、耐熱性があり、しか
も柔軟性のあるフイルムで被成形材を外部から遮
断し、真空圧によつて被成形材に密着させるもの
である。そして、一般に、ナイロン６、ナイロン
66、ポリテトラフルオロエチレン等のプラスチツ
クフイルムが用いられている。 A vacuum bag film is a heat-resistant and flexible film that isolates a material to be molded from the outside and brings it into close contact with the material by vacuum pressure. And generally, nylon 6, nylon
66, plastic films such as polytetrafluoroethylene are used.
ブリーザとは、真空バツグフイルム内が減圧さ
れ、溶器内に圧力が負荷された時でも空気や反応
によつて発生したガス（気泡）を通過させ均一な
圧力負荷を維持できるようにしたもので、一般
に、耐熱性のあるガラスクロスが用いられてい
る。 A breather is a device that allows air and gas (bubbles) generated by reaction to pass through to maintain a uniform pressure load even when the pressure inside the vacuum bag film is reduced and pressure is applied to the melter. Generally, heat-resistant glass cloth is used.
シーラントとは、被成形材を定盤（プラテン）
に対して完全に密封し、成形中密封性を確保する
もので、一般に、粘着性のある粘土状の物体が用
いられている。 A sealant is used to seal the material to be formed on a surface plate (platen).
A sticky, clay-like substance is generally used to completely seal the mold and ensure sealing properties during molding.
定盤（プラテン）とは、被成形材を積層載置す
ると共に被成形材の上面より加圧される圧力を受
圧する平板状の治具であり、一般に、加熱による
歪が少なく、かつ上面を平滑に加工した軽金属製
の平板が用いられている。 A surface plate (platen) is a flat jig that stacks materials to be formed and receives pressure from the top surface of the materials. A smooth flat plate made of light metal is used.
次に、実施例の構成を説明する。 Next, the configuration of the embodiment will be explained.
鏡面板Ａは、平面板で且つその表面を鏡面状に
仕上げており、しかも、熱伝導性のよい材質のも
のより成り、更に、該鏡面板を加熱するためのヒ
ータ（発熱体）Ｂを挿入したもので、該ヒータは
鏡面板を加熱できるよう配設したものである。 The mirror plate A is a flat plate with a mirror-like surface finish and is made of a material with good thermal conductivity, and a heater (heating element) B is inserted to heat the mirror plate. The heater is arranged to heat the mirror plate.
挿入されたヒータ口出部１は、例えば、電気ヒ
ータの場合は外部の電圧調整器や可変抵抗器等の
制御手段Ｄに接続されている。 For example, in the case of an electric heater, the inserted heater outlet 1 is connected to a control means D such as an external voltage regulator or a variable resistor.
第１図、第２図は本発明の実施例を示したもの
である。 1 and 2 show an embodiment of the present invention.
図に示すように鏡面板Ａは、２枚の平２と平板
３とで少なくとも一方にヒータを挿入する溝を設
け、その溝に電気ヒータを埋め込み、２枚の平板
でヒータＢが内蔵できる形にして張り合せ固着せ
しめている。そして、前記ヒータＢの鏡面板口出
部は前述したようにヒータの加熱状態を制御する
ための電圧調整器４に接続し、更に、温度検出器
５の信号により鏡面板Ａを所望の温度に制御する
よう構成している。 As shown in the figure, the mirror plate A is made of two flat plates 2 and 3, with a groove for inserting a heater in at least one of them, an electric heater is embedded in the groove, and a heater B can be built in with the two flat plates. It is pasted together and fixed. The mirror plate outlet of the heater B is connected to the voltage regulator 4 for controlling the heating state of the heater as described above, and the mirror plate A is kept at a desired temperature by a signal from the temperature detector 5. It is configured to control.
ヒータＢを制御する制御手段Ｄは、第４図に示
すように鏡面板Ａに挿入せしめた温度検出器５の
値と設定値の値とを比較器にて比較し、その偏差
を増幅して駆動部に伝達し電圧調整器を作動させ
る。そして、電圧を調整してヒータの加熱温度を
設定値になるよう制御するようにしたものであ
る。 As shown in FIG. 4, the control means D for controlling the heater B compares the value of the temperature detector 5 inserted into the mirror plate A with the set value using a comparator, and amplifies the deviation. It is transmitted to the drive unit and operates the voltage regulator. Then, the voltage is adjusted to control the heating temperature of the heater to a set value.
なお、鏡面板Ａの表面は前述したように銅箔等
と接触し、プリプレグを加熱するものであるが、
同時に、或る程度の圧力（本発明に用いる真空加
圧加熱方式では一般に20Kg／cm2以下）が均等に加
わるため、鏡面状で且つ平面度を必要とすること
は勿論のこと、ヒータ内蔵部における強度を考慮
する必要がある。 In addition, as mentioned above, the surface of the mirror plate A comes into contact with copper foil etc. and heats the prepreg.
At the same time, since a certain amount of pressure (generally 20 kg/cm 2 or less in the vacuum pressure heating method used in the present invention) is applied evenly, it goes without saying that a mirror-like surface and flatness are required, and the heater built-in part It is necessary to consider the strength of
更に、鏡面板Ａは第１図に示す平板に溝を設け
る代りに第３図に示すような平板状のスペーサ６
を介在させてもよく平板の枚数には限定されな
い。 Furthermore, instead of providing a groove in the flat plate shown in FIG. 1, the mirror plate A has a flat spacer 6 as shown in FIG.
It is not limited to the number of flat plates.
また、本発明に用いるヒータＢはニツケルクロ
ム線等の電熱線やシーズヒータ等の発熱体に限定
されるものではなく、例えば、電磁力発熱体、発
熱塗料材、セラミツクス発熱体等の他の発熱体を
用いてもよい。 Furthermore, the heater B used in the present invention is not limited to a heating wire such as a nickel chrome wire or a heating element such as a sheathed heater. You can also use your body.
また、ヒータを制御する制御手段も第４図に示
す手段に限定されるものではなく、例えば、時間
の経過に従いヒータを入り、切りする二位置制御
を用いてもよい。 Furthermore, the control means for controlling the heater is not limited to the means shown in FIG. 4; for example, two-position control may be used in which the heater is turned on and off as time passes.
ここで、本発明の鏡面板を用いて被成形材を積
層載置する状態を説明する。 Here, a state in which materials to be formed are stacked and placed using the mirror plate of the present invention will be described.
第５図に示すように定盤１０上には真空路を設
けて通気板１６を配置し、次いで、鏡面板Ａ〜離
型フイルム１２〜銅箔１１〜プリプレグ１３〜内
層回路板１４〜プリプレグ１３〜銅箔１１〜離型
フイルム１２〜鏡面板Ａと順次積層して一段とな
し、この積重ねを複数段に重ねた後、最上部にブ
リーザ１７を被せ、更に、その上には真空バツグ
フイルム１５にて覆い、定盤１０外周部に設けた
シーラント１８にて完全に密封せしめる。 As shown in FIG. 5, a vacuum path is provided on the surface plate 10 and a ventilation plate 16 is arranged, and then mirror plate A - release film 12 - copper foil 11 - prepreg 13 - inner layer circuit board 14 - prepreg 13 ~ Copper foil 11 ~ Release film 12 ~ Specular plate A are laminated in order to form a single layer, and after stacking this stack into multiple layers, a breather 17 is placed on the top, and a vacuum bag film 15 is placed on top of it. and completely seal it with a sealant 18 provided on the outer periphery of the surface plate 10.
そして、前記定盤１０には真空路を備え、第６
図に示す外部の減圧手段２０へと連通できるよう
設けている。 The surface plate 10 is provided with a vacuum path, and the sixth
It is provided so as to be able to communicate with an external pressure reducing means 20 shown in the figure.
更に、前記複数段に重ねられた被成形材Ｃの少
なくとも表面部と芯部とに温度検出器５を挿入
し、その検出信号を外部の制御手段に伝達できる
よう配線されている。この場合、外部への配線は
シーラント１８またはその他の手段によりシール
せしめる。 Further, a temperature detector 5 is inserted into at least the surface and core of the plurality of layers of molded materials C, and wiring is provided so that the detection signal can be transmitted to an external control means. In this case, the wiring to the outside is sealed with a sealant 18 or other means.
このように、鏡面板Ａは被成形材Ｃを挟持して
加熱し制御できるよう構成している。 In this way, the mirror plate A is configured to be able to sandwich the material to be formed C, heat it, and control it.
次に、本発明の鏡面板を用いて被成形材を成形
する方法を説明する。 Next, a method of forming a material to be formed using the mirror plate of the present invention will be explained.
第５図により準備された被成形材Ｃを、第６図
に示す圧力容器２１内に収容し密閉した後、真空
バツグフイルム１５内を減圧すると共に、高圧ガ
ス供給手段２２により前記容器内に高圧ガス（例
えば高圧チツソガス、高圧炭酸ガス、高圧空気な
ど）を供給して被成形材Ｃを真空バツクフイルム
１５の上から加圧する。この圧力は、成形条件に
よつて異なるが、最初から所要の圧力を付与する
場合もあり、また、後述するように最初は低い圧
力を付与し、被成形材のプリプレグ樹脂部が溶融
状態になつた時点で所要の圧力を付与する場合も
ある。 After the material to be formed C prepared as shown in FIG. 5 is housed in the pressure vessel 21 shown in FIG. A gas (for example, high-pressure nitrogen gas, high-pressure carbon dioxide gas, high-pressure air, etc.) is supplied to pressurize the material C to be formed from above the vacuum backing film 15. This pressure varies depending on the molding conditions, but in some cases the required pressure may be applied from the beginning, or as described later, a low pressure may be applied initially until the prepreg resin part of the material to be molded becomes molten. In some cases, the required pressure may be applied at that point.
次いで、鏡面板Ａ内のヒータＢを作動させて被
成形材Ｃを加熱し、被成形材Ｃのプリプレグ樹脂
部の表面部と芯部とが溶融状態になる温度に至つ
た時点で、高圧ガス供給手段２２を再度作動させ
て被成形材Ｃに所要の圧力を付与する。 Next, the heater B in the mirror plate A is activated to heat the material to be formed C, and when the temperature reaches such a temperature that the surface and core portions of the prepreg resin portion of the material to be formed C are in a molten state, high-pressure gas is heated. The supply means 22 is operated again to apply the required pressure to the material C to be formed.
この時、プリプリグ樹脂部内に存在している気
泡は樹脂部の上方へ浮いた状態となるが、上から
の加圧と横からの真空引きにより、前記気泡はプ
リプレグと銅箔との間を通り、プリプレグの周辺
端部へと移動し真空中へ排出される。 At this time, the air bubbles existing in the prepreg resin part float above the resin part, but due to the pressure applied from above and the vacuum drawn from the side, the air bubbles pass between the prepreg and the copper foil. , moves to the peripheral edge of the prepreg and is ejected into vacuum.
次に、鏡面板Ａの温度を更に上昇させ所定温度
に至りてしばらくその温度を維持し、被成形材Ｃ
を接着硬化させる。 Next, the temperature of the mirror plate A is further increased until it reaches a predetermined temperature, and the temperature is maintained for a while, and the material to be formed C
Let the adhesive harden.
然る後、冷却工程に入る。 After that, the cooling process begins.
第７図は積層板の加熱加圧プログラムの一実施
例を示したもので、この方法に従い成形したとこ
ろ、第７図に示すようにプリプレグ樹脂部の温度
は設定プログラムにほぼ沿う状態で加熱すること
ができ、その結果、ボイドのない積層板を所定時
間内で形成することができた。 Figure 7 shows an example of a heating and pressing program for a laminate. When molded according to this method, as shown in Figure 7, the temperature of the prepreg resin part is heated almost in accordance with the set program. As a result, a void-free laminate could be formed within a predetermined time.
なお、本発明の鏡面板の加熱手段と従来の熱風
または蒸気で加熱する手段とを併用することもで
きる。即ち、従来の加熱手段の欠点である被成形
材の表面部と芯部との上昇時の温度差をなくする
ため、本発明の鏡面板を温度上昇の遅い芯部の箇
所に挿入し、表面部には従来の鏡面板を用いて、
従来の加熱手段の不足分を補助加熱するようにし
てもよく、また、本発明の鏡面板を被成形材各段
に用いて、それぞれの鏡面板の温度を、その上昇
差分だけ補正するように用いることも可能であ
り、本発明において設計上容易にできるものであ
る。 Note that the mirror plate heating means of the present invention and conventional means for heating with hot air or steam can also be used together. That is, in order to eliminate the temperature difference between the surface and core of the material to be formed, which is a drawback of conventional heating means, the mirror plate of the present invention is inserted into the core where the temperature rises slowly, and the surface Using a conventional mirror plate for the part,
It is also possible to perform auxiliary heating to compensate for the insufficiency of conventional heating means, and the mirror plate of the present invention may be used at each stage of the material to be formed, and the temperature of each mirror plate may be corrected by the difference in temperature rise. It is also possible to use it, and it can be easily designed in the present invention.
発明の効果
以上、本発明によると下記のような効果を奏す
る。Effects of the Invention As described above, the present invention provides the following effects.
積層板を真空加圧加熱成形するにおいて、被成
形材を挟持する鏡面板にヒータを内蔵すると共
に、前記鏡面板の温度を制御する制御手段を設け
ているから、鏡面板間に挟持せしめた被成形材を
直接加熱することができるため、従来、多段に積
載せしめた被成形材の表面部と芯部との温度差が
なくなり、被成形材のプリプレグ樹脂部の溶融状
態を同時に且つ均一に得られ、従つて、従来の技
術に比し成形時間を大幅に短縮することができ
る。 When vacuum pressurizing and heat forming a laminate, the mirror plates that sandwich the material to be formed have a built-in heater and a control means for controlling the temperature of the mirror plates. Since the molded material can be directly heated, there is no longer a temperature difference between the surface and core of the molded materials stacked in multiple stages, and the prepreg resin portion of the molded materials can be melted simultaneously and uniformly. Therefore, the molding time can be significantly shortened compared to conventional techniques.
更に、被成形材のみを加熱することができるた
め、熱効率が高く省エネルギー効果も大である。 Furthermore, since only the material to be formed can be heated, the thermal efficiency is high and the energy saving effect is also large.
第１図は本発明実施例である鏡面板の横断面
図。第２図は第１図の上面図で、ヒータ口出部よ
り外部の制御機器に接続する状態を示したもので
ある。第３図は本発明の他の実施例を示す横断面
図。第４図は本発明である鏡面板のヒータを制御
する制御手段を示すブロツク線図。第５図は被成
形材を鏡面板に挟んで積載し真空バツグフイルム
にて被覆し密封せしめた状態を示す横断面図で、
右断面図は説明上フイルムを被せていない状態を
示したものである。第６図は本発明である鏡面板
を用いて被成形材を成形する装置の概略正面断面
図。第７図は本発明である鏡面板のヒータを制御
して被成形材を成形する加熱加圧プログラムの一
実施例を示す図。第８図は従来の鏡面板を用いて
被成形材を積載し真空バツグフイルムにて被覆し
密封せしめた状態を示す横断面図。第９図は被成
形材を成形する加熱加圧プログラムの従来技術の
一実施例を示す図である。
これらの図において、Ａ：鏡面板、Ｂ：ヒー
タ、Ｃ：被成形材、Ｄ：制御手段、Ｅ：従来の鏡
面板、１：ヒータ口出部、２：平板、３：平板、
４：電圧調整器、５：温度検出器、６：スペー
サ、１０：定盤、１１：銅箔、１２：離型フイル
ム、１３：プリプレグ、１４：内層回路板、１
５：真空バツグフイルム、１６：通気板、１７：
ブリーザ、１８：シーラント、２０：減圧手段、
２１：圧力容器、２２：高圧ガス供給手段。
FIG. 1 is a cross-sectional view of a mirror plate according to an embodiment of the present invention. FIG. 2 is a top view of FIG. 1, showing a state in which the heater outlet is connected to an external control device. FIG. 3 is a cross-sectional view showing another embodiment of the present invention. FIG. 4 is a block diagram showing the control means for controlling the heater of the mirror plate according to the present invention. FIG. 5 is a cross-sectional view showing the state in which the material to be formed is sandwiched between mirror plates, covered with a vacuum bag film, and sealed.
For illustrative purposes, the right sectional view shows a state in which no film is covered. FIG. 6 is a schematic front cross-sectional view of an apparatus for forming a material to be formed using a mirror plate according to the present invention. FIG. 7 is a diagram showing an embodiment of the heating and pressurizing program of the present invention, which controls the heater of the mirror plate to mold the material to be molded. FIG. 8 is a cross-sectional view showing a state in which materials to be formed are loaded using a conventional mirror plate, covered with a vacuum bag film, and sealed. FIG. 9 is a diagram showing an example of a prior art heating and pressing program for molding a material to be molded. In these figures, A: mirror plate, B: heater, C: molded material, D: control means, E: conventional mirror plate, 1: heater outlet, 2: flat plate, 3: flat plate,
4: Voltage regulator, 5: Temperature detector, 6: Spacer, 10: Surface plate, 11: Copper foil, 12: Release film, 13: Prepreg, 14: Inner layer circuit board, 1
5: Vacuum bag film, 16: Ventilation plate, 17:
breather, 18: sealant, 20: pressure reduction means,
21: Pressure vessel, 22: High pressure gas supply means.
Claims (1)
成形材を挟持する鏡面板にヒータを内蔵すると共
に、前記鏡面板の温度を制御する制御手段を設け
たことを特徴とする積層板の成形用鏡面板。 ２ 鏡面板は平面板で且つその表面を鏡面状に仕
上げている特許請求の範囲第１項記載の積層板の
成形用鏡面板。 ３ 鏡面板は熱伝導性のよい材質より成る特許請
求の範囲第１項記載の積層板の成形用鏡面板。[Claims] 1. In vacuum pressure and heat molding of a laminate, a heater is built into mirror plates that sandwich the material to be formed, and a control means for controlling the temperature of the mirror plates is provided. Mirror plate for forming laminates. 2. The mirror plate for forming a laminate according to claim 1, wherein the mirror plate is a flat plate and has a mirror-finished surface. 3. The mirror plate for forming a laminate according to claim 1, wherein the mirror plate is made of a material with good thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60048771A JPS61206650A (en) | 1985-03-12 | 1985-03-12 | Mirror board for molding laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60048771A JPS61206650A (en) | 1985-03-12 | 1985-03-12 | Mirror board for molding laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61206650A JPS61206650A (en) | 1986-09-12 |
| JPH0469065B2 true JPH0469065B2 (en) | 1992-11-05 |
Family
ID=12812537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60048771A Granted JPS61206650A (en) | 1985-03-12 | 1985-03-12 | Mirror board for molding laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61206650A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9352386B2 (en) | 2010-08-05 | 2016-05-31 | Danieli & C. Officine Meccaniche S.P.A. | Process and apparatus for controlling the flows of liquid metal in a crystallizer for the continuous casting of thin flat slabs |
-
1985
- 1985-03-12 JP JP60048771A patent/JPS61206650A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61206650A (en) | 1986-09-12 |
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