JPH0468530U - - Google Patents
Info
- Publication number
- JPH0468530U JPH0468530U JP11150790U JP11150790U JPH0468530U JP H0468530 U JPH0468530 U JP H0468530U JP 11150790 U JP11150790 U JP 11150790U JP 11150790 U JP11150790 U JP 11150790U JP H0468530 U JPH0468530 U JP H0468530U
- Authority
- JP
- Japan
- Prior art keywords
- piece
- lead frame
- heat conductive
- conductive plate
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11150790U JPH0468530U (en, 2012) | 1990-10-24 | 1990-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11150790U JPH0468530U (en, 2012) | 1990-10-24 | 1990-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0468530U true JPH0468530U (en, 2012) | 1992-06-17 |
Family
ID=31858969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11150790U Pending JPH0468530U (en, 2012) | 1990-10-24 | 1990-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0468530U (en, 2012) |
-
1990
- 1990-10-24 JP JP11150790U patent/JPH0468530U/ja active Pending