JPH02132949U - - Google Patents
Info
- Publication number
- JPH02132949U JPH02132949U JP4210289U JP4210289U JPH02132949U JP H02132949 U JPH02132949 U JP H02132949U JP 4210289 U JP4210289 U JP 4210289U JP 4210289 U JP4210289 U JP 4210289U JP H02132949 U JPH02132949 U JP H02132949U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bonding
- inner lead
- crimped
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4210289U JPH02132949U (en, 2012) | 1989-04-11 | 1989-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4210289U JPH02132949U (en, 2012) | 1989-04-11 | 1989-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132949U true JPH02132949U (en, 2012) | 1990-11-05 |
Family
ID=31553350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4210289U Pending JPH02132949U (en, 2012) | 1989-04-11 | 1989-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132949U (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019161138A (ja) * | 2018-03-16 | 2019-09-19 | 芝浦メカトロニクス株式会社 | 基板載置ステージおよび実装装置 |
-
1989
- 1989-04-11 JP JP4210289U patent/JPH02132949U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019161138A (ja) * | 2018-03-16 | 2019-09-19 | 芝浦メカトロニクス株式会社 | 基板載置ステージおよび実装装置 |