JPH0467645A - Burn-in device - Google Patents
Burn-in deviceInfo
- Publication number
- JPH0467645A JPH0467645A JP18101390A JP18101390A JPH0467645A JP H0467645 A JPH0467645 A JP H0467645A JP 18101390 A JP18101390 A JP 18101390A JP 18101390 A JP18101390 A JP 18101390A JP H0467645 A JPH0467645 A JP H0467645A
- Authority
- JP
- Japan
- Prior art keywords
- burn
- board
- test
- result
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 210000001550 testis Anatomy 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体装置用のバーンイン装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a burn-in device for semiconductor devices.
従来、この種のバーンイン装置においては、バーンイン
のテスト結果は、バーンイン装置本体の記憶装置に記憶
され、バーンイン終了後バーンインボードより半導体装
置を取り出す装置へオンライン又はフロッピーにて伝達
される形となっていた。Conventionally, in this type of burn-in equipment, the burn-in test results are stored in the storage device of the burn-in equipment itself, and after the burn-in is completed, they are transmitted online or via floppy to the equipment that takes out the semiconductor device from the burn-in board. Ta.
上述した従来のバーンイン装置は、オンライン又はフロ
ッピーにてテスト結果を伝達しバーンインボードから半
導体装置を取り出すようになっているのでバーンインボ
ードの順序が入れ替るだけでテスト結果が完全に狂って
しまうという欠点がある。The conventional burn-in equipment described above transmits the test results online or via floppy disk and takes out the semiconductor device from the burn-in board, so it has the disadvantage that the test results can be completely messed up just by changing the order of the burn-in boards. There is.
本発明のバーンイン装置は、テスト結果を書き込む電気
的書き込み可能な不揮発性半導体装置を内蔵し、被テス
ト用の半導体装置を搭載するバーンインボートと、前記
不揮発性半導体記憶装置へ情報を書き込む書込回路とを
有するというものである。The burn-in device of the present invention includes a burn-in board that incorporates an electrically writable non-volatile semiconductor device for writing test results, and a burn-in board that mounts a semiconductor device to be tested, and a write circuit that writes information to the non-volatile semiconductor memory device. It is said that it has.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は、本発明の一実施例の構成図である。FIG. 1 is a block diagram of an embodiment of the present invention.
バーンインボード1は、被テスト用の半導体装置を複数
個搭載してバーンインテスト回路4から電気信号を供給
される。従来のバーンインボードとの相違点は、電気的
書き込み可能な不揮発性記憶袋W2を内蔵していること
である。この不揮発性記憶装置への書込回路5はバーン
イン装置本体に内蔵させる。The burn-in board 1 mounts a plurality of semiconductor devices to be tested and is supplied with electrical signals from the burn-in test circuit 4. The difference from the conventional burn-in board is that it incorporates an electrically writable non-volatile memory bag W2. The write circuit 5 for this nonvolatile memory device is built into the main body of the burn-in device.
バーンインボード1はバーンインチャンバ3の中に設置
され、バーンインテスト回路4でテストが実行されその
テスト結果がバーンイン制御回路6の内部記憶装置に記
憶されている。テスト終了後、テスト結果は、バーンイ
ン制御回路6より書込回路5を通じてバーンインボード
上の不揮発性記憶装置1i!2へ記憶される。The burn-in board 1 is installed in a burn-in chamber 3, a burn-in test circuit 4 executes a test, and the test results are stored in an internal storage device of a burn-in control circuit 6. After the test is completed, the test results are sent from the burn-in control circuit 6 to the non-volatile memory device 1i on the burn-in board through the write circuit 5! 2.
バーンインボード上の不揮発性記憶装置2は高温による
データ破壊防止の為、バーンインチャンバ外に配置しで
ある。The nonvolatile storage device 2 on the burn-in board is placed outside the burn-in chamber to prevent data destruction due to high temperatures.
テスト結果としては、例えば不良(又は良)の半導体装
置の製造番号やバーンインボード上のアドレスなどを利
用すればよい。不揮発性記憶装置には、バーンインボー
ドの登録番号も記憶させることができ、テストプログラ
ムとバーンインボードとの対応を確認しバーンインボー
ドの使用ミスを防止できる。As the test result, for example, the serial number of the defective (or good) semiconductor device, the address on the burn-in board, etc. may be used. The registration number of the burn-in board can also be stored in the non-volatile storage device, and the correspondence between the test program and the burn-in board can be checked to prevent mistakes in using the burn-in board.
以上説明したように本発明は、バーンインボード上に不
揮発性記憶装置を内蔵させ、バーンイン装置本体中に不
揮発性記憶装置ヘバーンイン中のテスト結果を書き込む
書込回路を装備することにより、被テスト用の半導体装
置とそのテスト結果との不一致を避けることができる効
果がある。As explained above, the present invention incorporates a non-volatile memory device on the burn-in board, and equips the burn-in device with a write circuit for writing test results during burn-in to the non-volatile memory device. This has the effect of avoiding discrepancies between the semiconductor device and its test results.
第1図は本発明の一実施例の構成図である。
1・・・バーンインボード、2・・・不揮発性記憶装置
、3・・・バーンインチャンバ、4・・・バーンインテ
スト回路、5・・・書込回路、6・・・バーンイン制御
回路。FIG. 1 is a block diagram of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Burn-in board, 2... Non-volatile memory device, 3... Burn-in chamber, 4... Burn-in test circuit, 5... Write circuit, 6... Burn-in control circuit.
Claims (1)
半導体装置を内蔵し、被テスト用の半導体装置を搭載す
るバーンインボートと、前記不揮発性半導体記憶装置へ
情報を書き込む書込回路とを有することを特徴とするバ
ーンイン装置。The present invention is characterized by having a built-in electrically writable non-volatile semiconductor device for writing test results, a burn-in board for mounting a semiconductor device under test, and a write circuit for writing information into the non-volatile semiconductor memory device. burn-in equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18101390A JPH0467645A (en) | 1990-07-09 | 1990-07-09 | Burn-in device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18101390A JPH0467645A (en) | 1990-07-09 | 1990-07-09 | Burn-in device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0467645A true JPH0467645A (en) | 1992-03-03 |
Family
ID=16093226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18101390A Pending JPH0467645A (en) | 1990-07-09 | 1990-07-09 | Burn-in device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0467645A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100272712B1 (en) * | 1996-04-22 | 2000-12-01 | 가네꼬 히사시 | Semiconductor device on semiconductor wafer having simple wiring for test and capable of being tested in a short time |
US8604022B2 (en) | 2006-12-21 | 2013-12-10 | Astrazeneca Ab | N-[5-[2-(3,5-dimethoxyphenyl)ethyl]-1h-pyrazol-3-yl]-4-(3,4-dimethylpiperazin-1-yl)benzamide and salts thereof |
US10420764B2 (en) | 2012-12-21 | 2019-09-24 | Astrazeneca Ab | Pharmaceutical formulation of N-[5-[2-(3,5-dimethoxyphenyl)ethyl]-2H-pyrazol-3-YL]-4-[(3R,5S)-3 ,5-dimethylpiperazin-1-YL] benzamide |
-
1990
- 1990-07-09 JP JP18101390A patent/JPH0467645A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100272712B1 (en) * | 1996-04-22 | 2000-12-01 | 가네꼬 히사시 | Semiconductor device on semiconductor wafer having simple wiring for test and capable of being tested in a short time |
US8604022B2 (en) | 2006-12-21 | 2013-12-10 | Astrazeneca Ab | N-[5-[2-(3,5-dimethoxyphenyl)ethyl]-1h-pyrazol-3-yl]-4-(3,4-dimethylpiperazin-1-yl)benzamide and salts thereof |
US9688640B2 (en) | 2006-12-21 | 2017-06-27 | Astrazeneca Ab | Methods of treating cancer with a pyrazole derivative |
US10420764B2 (en) | 2012-12-21 | 2019-09-24 | Astrazeneca Ab | Pharmaceutical formulation of N-[5-[2-(3,5-dimethoxyphenyl)ethyl]-2H-pyrazol-3-YL]-4-[(3R,5S)-3 ,5-dimethylpiperazin-1-YL] benzamide |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7269765B1 (en) | Method and apparatus for storing failing part locations in a module | |
US6182262B1 (en) | Multi bank test mode for memory devices | |
EP0291283A3 (en) | Memory test method and apparatus | |
KR100319733B1 (en) | Non-volatile semiconductor memory ic and method of burn-in test of the same | |
JP2004040103A (en) | Permanent chip id using ferroelectric random access memory | |
KR100458357B1 (en) | Test device for testing a memory | |
JP3871384B2 (en) | Defect analysis memory for semiconductor memory test equipment | |
US5555249A (en) | Non-destructive memory testing in computers | |
JPH03209601A (en) | Disk device | |
JPH02255925A (en) | Method and device for memory test | |
JPH0467645A (en) | Burn-in device | |
KR100274710B1 (en) | Testing system for semiconductor device without influence of defective device and testing method used therein | |
US6810492B2 (en) | Apparatus and system for recovery of useful areas of partially defective direct rambus RIMM components | |
KR20010013920A (en) | Storage cell system and method for testing the function of storage cells | |
JPH0574878A (en) | Test method of wafer | |
EP0805459A1 (en) | Method and apparatus for testing DRAM memory units | |
JPH05258543A (en) | Optical disk device | |
JPS61261900A (en) | Semiconductor integrated circuit device | |
JPS6047679B2 (en) | Semiconductor memory inspection method | |
JPH0357979A (en) | Inspecting device for memory | |
JPH0420876A (en) | Burn-in board for measuring semiconductor device | |
JPS6011400B2 (en) | IC test equipment | |
JPH07192498A (en) | Non-volatile memory and its test method | |
JPH06139154A (en) | Memory card device | |
JP2004110950A (en) | Test device for ferroelectric memory, test method, control program, and recording medium |