JPH0467344U - - Google Patents

Info

Publication number
JPH0467344U
JPH0467344U JP11094590U JP11094590U JPH0467344U JP H0467344 U JPH0467344 U JP H0467344U JP 11094590 U JP11094590 U JP 11094590U JP 11094590 U JP11094590 U JP 11094590U JP H0467344 U JPH0467344 U JP H0467344U
Authority
JP
Japan
Prior art keywords
sheet
holding ring
semiconductor wafer
dicing
sloped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11094590U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11094590U priority Critical patent/JPH0467344U/ja
Publication of JPH0467344U publication Critical patent/JPH0467344U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP11094590U 1990-10-23 1990-10-23 Pending JPH0467344U (US07923587-20110412-C00022.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11094590U JPH0467344U (US07923587-20110412-C00022.png) 1990-10-23 1990-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11094590U JPH0467344U (US07923587-20110412-C00022.png) 1990-10-23 1990-10-23

Publications (1)

Publication Number Publication Date
JPH0467344U true JPH0467344U (US07923587-20110412-C00022.png) 1992-06-15

Family

ID=31858352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11094590U Pending JPH0467344U (US07923587-20110412-C00022.png) 1990-10-23 1990-10-23

Country Status (1)

Country Link
JP (1) JPH0467344U (US07923587-20110412-C00022.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048884A (ja) * 2005-08-09 2007-02-22 Shin Etsu Polymer Co Ltd 半導体ウェーハのダイシング用フレーム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007048884A (ja) * 2005-08-09 2007-02-22 Shin Etsu Polymer Co Ltd 半導体ウェーハのダイシング用フレーム
JP4693542B2 (ja) * 2005-08-09 2011-06-01 信越ポリマー株式会社 半導体ウェーハのダイシング用フレーム

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