JPH0465849A - Semiconductor pellet mounter - Google Patents

Abstract

PURPOSE:To mount only acceptable pellets by checking characteristics of semiconductor pellets which are supplied from a pellet supplying stage and carried on a mounting stage. CONSTITUTION:A characteristics checking electrode needle 5 retreats from a check position at the time of moving operation of a pellet. At the time of checking characteristics, the pin 5 comes into contact with an electrode 11 on the pellet 1 surface and with a characteristics checking stage 4. Pellet characteristics are checked between the characteristics checking electrode pin 5 and the pellet characteristics checking stage 4. At the time of checking pellet characteristics, positioning equipments 6 whose tips are made of ceramics pinch the pellet 1 from the diagonal line direction and perform positioning. Hence the deviation of contact position between the electrode on the pellet surface and the characteristics checking electrode pin 5 and the deviation of the next mounting position are prevented. The pellet after characteristics are checked is mounted on a lead frame 8 on a mounting stage 9 by second pick-up arm 7. Unacceptable pellets in the characteristic check are not mounted and abandoned.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor pellet mounter, and more particularly to a semiconductor pellet mounter with a pellet characteristic checking stage.

[Prior Art] A conventional semiconductor pellet mounter includes a pellet supply stage that supplies semiconductor pellets bonded onto an adhesive tape, a mount stage that bonds the semiconductor pellets onto a lead frame, and a mount stage that mounts the semiconductor pellets from the pellet supply stage. It has a pickup arm that moves to the stage.

The method for adhering semiconductor pellets onto adhesive tape is to attach the semiconductor wafer to the adhesive tape, then fix the adhesive tape, and cut the pellets on the adhesive tape using a dicing process in which the semiconductor wafer is cut with a diamond blade. There is.

[Problems to be Solved by the Invention] In this conventional semiconductor pellet mounter, the semiconductor pellets on the adhesive tape are directly mounted on the lead frame, and the characteristics are not checked in between, so the semiconductor wafer is not cut into semiconductor pellets. There is a problem in that semiconductor pellets with a liquid layer epitaxial bonding structure, in which characteristics are difficult to check, are mounted on a lead frame without any characteristics being checked in the pellet state.

As an example of a semiconductor having a liquid layer epitaxial junction structure, FIG. 2 shows a structure in which pellets are cut from a wafer of a diode having a liquid layer epitaxial junction structure. Second
In the figure, 11 is a surface electrode.

12 is a P-type epitaxial layer, 13 is an N-type epitaxial layer, 14 is an N-type substrate, 15 is a back electrode, 16 is an adhesive tape, and 17 is a cutting groove. As shown in Figure 2,
In a diode with a liquid layer epitaxial junction structure, the entire wafer forms a diode in the wafer state, and the characteristics of each pellet can be confirmed by checking the characteristics in the wafer state. That is impossible. Furthermore, since the adhesive tape 16 is an insulator, the pellet characteristics cannot be checked unless the pellet is peeled off from the adhesive tape 16, but if it is peeled off, the pellet will fall apart and it will be difficult to feed the pellet with a mounter.

The purpose of this invention is to check the pellet mount just before
To provide a semiconductor pellet mounter which mounts only pellets that pass the test.

[Means to solve the problem]

In order to achieve the above object, a semiconductor pellet mounter according to the present invention includes a pellet supply stage, a mounting stage, a pellet characteristic check stage, and a pickup arm, wherein the pellet supply stage has an adhesive base. It supplies semiconductor pellets pasted on tape, the mount stage joins the semiconductor pellets onto the lead frame, and the pellet characteristic check stage is located between the pellet supply stage and the mount stage. , the characteristics of the semiconductor pellets supplied from the pellet supply stage and carried onto the mounting stage are checked, and the pickup arm is used to transport the semiconductor pellets between each stage.

[Effect]

The semiconductor pellets supplied from the pellet supply stage 2 are once carried onto the pellet characteristic checking stage 4, and the characteristics of the semiconductor pellets are checked. Thereafter, only semiconductor pellets that have passed the characteristic test are carried onto a mounting stage and mounted on a lead frame.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) FIG. 1 is a configuration diagram showing a first embodiment of the present invention.

In the figure, the semiconductor pellet mounter according to the present invention includes a pellet supply stage 2, a mounting stage 9,
It has a pellet characteristic check stage 4 and pickup arms 3 and 7. The pellet supply stage 2 is a second
As shown in the figure, the cutting groove 1 is pasted on the adhesive tape 16.
7 to supply individually separated semiconductor pellets (diode pellets having a liquid layer epitaxial structure in the embodiment).

The mounting stage 9 is used to mount the semiconductor pellet IO on the lead frame 8.

The pellet characteristic check stage 4 is provided between the pellet supply stage 2 and the mount stage 9 to check the characteristics of the semiconductor pellet 1, and has a positioning device 6 and a characteristic check electrode needle 5.

The semiconductor pellets 1 lined up on the adhesive tape 16 are sucked by the first pickup arm 3 from the pellet supply stage 2 and transferred to the pellet characteristic check stage 4. The characteristic checking electrode needle 5 escapes from the checking position during pellet movement and comes into contact with the contact characteristic checking stage 4 on the electrode 11 on the surface of the pellet 1 during characteristic checking. The properties of the pellet are checked between the property check electrode needle 5 and the pellet property check stage 4. When checking the characteristics of the pellet, a positioning device 6 having a ceramic tip positions the pellet 1 by sandwiching it in the diagonal direction of the pellet, thereby preventing deviation of the contact position between the electrode on the pellet surface and the characteristic check electrode needle 5 and the next mounting position. The pellet whose characteristics have been checked is transferred to the second pickup arm 7.
is mounted on the lead frame 8 on the mounting stage 9. Pellets that fail the characteristic check on pellet characteristic check stage 4 are not mounted and are discarded. By checking all pellet properties in this way, the final product yield was 86.7%.
We were able to significantly increase the rate from 99.2% to 99.2%.

(Example 2) FIG. 3 is an explanatory diagram showing a second embodiment of the present invention.

In this embodiment, one pickup arm 3a is used to move the pellet from the pellet supply stage 2 to the pellet characteristic check stage 4, and to move the pellet characteristic check stage 4.
Since the movement to the mount stage 9 is also carried out, there is an advantage that the mechanism can be simplified compared to the first embodiment.

[Effects of the Invention] As explained above, the present invention checks pellets for which it is difficult to check pellet characteristics in the wafer state immediately before pellet mounting, and mounts only those pellets that pass the test, thereby reducing the final product yield by 86%. .7% to 99.
It has the effect of making hair thicker by 2%.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the structure of a liquid layer epitaxial junction diode, and FIG. 3 is a block diagram showing a second embodiment of the present invention. 2... Pellet supply stage 3, 3a, 7... Pick up arm 4... Pellet characteristic check stage 5... Characteristic check electrode needle 6... Positioning device 8... Lead frame 9... Mount stage

Claims (1)

[Claims] (1) A pellet supply stage, a mount stage,
A semiconductor pellet mounter having a pellet characteristic check stage and a pickup arm, the pellet supply stage supplies the semiconductor pellets attached to the adhesive tape, and the mounting stage supplies the semiconductor pellets onto the lead frame. The pellet characteristic check stage is located between the pellet supply stage and the mount stage, and is used to check the characteristics of the semiconductor pellets supplied from the pellet supply stage and carried onto the mount stage. A semiconductor pellet mounter characterized in that the arm conveys semiconductor pellets between each stage.