JPH0464741U - - Google Patents
Info
- Publication number
- JPH0464741U JPH0464741U JP10826890U JP10826890U JPH0464741U JP H0464741 U JPH0464741 U JP H0464741U JP 10826890 U JP10826890 U JP 10826890U JP 10826890 U JP10826890 U JP 10826890U JP H0464741 U JPH0464741 U JP H0464741U
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- groove
- semiconductor pressure
- unit
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Measuring Fluid Pressure (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Pressure Sensors (AREA)
Description
第１図はこの考案の一実施例を示す半導体圧力
センサユニツトの断面図、第２図はその一部であ
るケーシング溝部の拡大断面図、第３図は従来の
半導体圧力センサユニツトを示す断面図である。
図中、１１はケーシング、１１ｃは溝部、１１
ｄは内側部縁、１２は半導体圧力センサ、１４は
基板、１６は接着剤である。なお、図中同一符号
は同一又は相当部分を示す。
Fig. 1 is a sectional view of a semiconductor pressure sensor unit showing an embodiment of this invention, Fig. 2 is an enlarged sectional view of a part of the casing groove, and Fig. 3 is a sectional view of a conventional semiconductor pressure sensor unit. It is. In the figure, 11 is a casing, 11c is a groove, 11
d is an inner edge, 12 is a semiconductor pressure sensor, 14 is a substrate, and 16 is an adhesive. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
を収納し、半導体圧力センサの信号を外部に出力
するユニツトにおいて、ユニツトのケーシング外
周部に接着剤を注入する溝部を設け、この溝部の
ケーシング内側部の縁の上に上記基板を載設した
ことを特徴とする半導体圧力センサユニツトの組
立構造。 In the board on which the semiconductor pressure sensor is mounted and the unit that houses this board and outputs the signal of the semiconductor pressure sensor to the outside, a groove for injecting adhesive is provided on the outer periphery of the casing of the unit, and a groove on the inside of the casing of this groove is provided. An assembly structure of a semiconductor pressure sensor unit, characterized in that the above-mentioned substrate is mounted on the edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990108268U JP2507648Y2 (en) | 1990-10-15 | 1990-10-15 | Semiconductor pressure sensor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990108268U JP2507648Y2 (en) | 1990-10-15 | 1990-10-15 | Semiconductor pressure sensor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0464741U true JPH0464741U (en) | 1992-06-03 |
| JP2507648Y2 JP2507648Y2 (en) | 1996-08-14 |
Family
ID=31855174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990108268U Expired - Lifetime JP2507648Y2 (en) | 1990-10-15 | 1990-10-15 | Semiconductor pressure sensor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2507648Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63177733U (en) * | 1987-05-09 | 1988-11-17 |
-
1990
- 1990-10-15 JP JP1990108268U patent/JP2507648Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63177733U (en) * | 1987-05-09 | 1988-11-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2507648Y2 (en) | 1996-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |