JPH0453389U - - Google Patents
Info
- Publication number
- JPH0453389U JPH0453389U JP9591190U JP9591190U JPH0453389U JP H0453389 U JPH0453389 U JP H0453389U JP 9591190 U JP9591190 U JP 9591190U JP 9591190 U JP9591190 U JP 9591190U JP H0453389 U JPH0453389 U JP H0453389U
- Authority
- JP
- Japan
- Prior art keywords
- sensor head
- casing
- holding surface
- housing
- matching layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Description
第１図は、本考案に係る超音波センサヘツドの
一実施例を示す断面図、第２図は、本考案に係る
超音波センサヘツドの他の実施例を示す断面図、
第３図は、従来の超音波センサヘツドを示す断面
図である。
２……筐体、４……音響整合層、６……超音波
素子、２ａ……固定凹部、２Ｈ……保持面。
FIG. 1 is a sectional view showing one embodiment of the ultrasonic sensor head according to the present invention, and FIG. 2 is a sectional view showing another embodiment of the ultrasonic sensor head according to the present invention.
FIG. 3 is a sectional view showing a conventional ultrasonic sensor head. 2... Housing, 4... Acoustic matching layer, 6... Ultrasonic element, 2a... Fixing recess, 2H... Holding surface.
Claims (1)
て固定された超音波素子、 熱硬化性樹脂によつて形成され、筐体の前記保
持面の外面に固定された音響整合層、 を備えたことを特徴とする超音波センサヘツド。 (2) 請求項１の超音波センサヘツドにおいて、 筐体の保持面の外面には固定凹部が設けられて
おり、 固定凹部の中に音響整合層が位置している、 ことを特徴とする超音波センサヘツド。[Scope of Claim for Utility Model Registration] (1) A casing made of thermoplastic resin, an ultrasonic element located inside the casing and fixed in contact with the inner surface of the holding surface of the casing, and a thermosetting resin. An ultrasonic sensor head comprising: an acoustic matching layer formed of resin and fixed to the outer surface of the holding surface of the housing. (2) The ultrasonic sensor head according to claim 1, wherein a fixing recess is provided on the outer surface of the holding surface of the housing, and an acoustic matching layer is located in the fixing recess. sensor head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9591190U JPH0453389U (en) | 1990-09-10 | 1990-09-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9591190U JPH0453389U (en) | 1990-09-10 | 1990-09-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0453389U true JPH0453389U (en) | 1992-05-07 |
Family
ID=31835025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9591190U Pending JPH0453389U (en) | 1990-09-10 | 1990-09-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453389U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009005383A (en) * | 2008-08-04 | 2009-01-08 | Panasonic Corp | Ultrasonic wave transmitting/receiving apparatus |
-
1990
- 1990-09-10 JP JP9591190U patent/JPH0453389U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009005383A (en) * | 2008-08-04 | 2009-01-08 | Panasonic Corp | Ultrasonic wave transmitting/receiving apparatus |
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