JPH02136376U

JPH02136376U -

Info

Publication number: JPH02136376U
Application number: JP4526789U
Authority: JP
Priority date: 1989-04-17
Filing date: 1989-04-17
Publication date: 1990-11-14
Anticipated expiration: 2004-04-17
Also published as: JPH0644139Y2

Description

[Brief explanation of the drawing]

第１図はこの考案の第１実施例を示す部分断面
図、第２図は第１図に使用される電子部品の外観
図でイは正面図、ロは側面図、第３図はこの考案
に使用されるＯリングの斜視図、第４図はこの考
案の第２実施例を示す部分断面図、第５図は第４
図に使用される電子部品の外観図でイは正面図、
ロは側面図である。 Fig. 1 is a partial sectional view showing the first embodiment of this invention, Fig. 2 is an external view of the electronic components used in Fig. 1, A is a front view, B is a side view, and Fig. 3 is this invention. 4 is a partial sectional view showing the second embodiment of this invention, and FIG. 5 is a perspective view of the O-ring used in the
In the external view of the electronic components used in the figure, A is a front view;
B is a side view.

Claims

[Claims for Utility Model Registration] An electronic component mounting device in which an electronic component having an operating shaft is mounted on a panel whose inner side is sealed with the operating shaft inside, wherein the panel has an outer peripheral shape of the electronic component. Similar mounting holes are formed, the electronic component is fitted into the mounting hole with its operating shaft inside, and a ring-shaped groove is formed on the outer peripheral surface of the electronic component opposite to the inner peripheral surface of the mounting hole, An O-ring is fitted into the ring-shaped groove, and the O-ring makes elastic contact with the inner circumferential surface of the mounting hole, and the mounting portion formed protruding from the outer circumferential surface of the electronic component comes into contact with the panel surface. A mounting device for electronic components.