JPH0464418A - Mold - Google Patents

Mold

Info

Publication number
JPH0464418A
JPH0464418A JP90176670A JP17667090A JPH0464418A JP H0464418 A JPH0464418 A JP H0464418A JP 90176670 A JP90176670 A JP 90176670A JP 17667090 A JP17667090 A JP 17667090A JP H0464418 A JPH0464418 A JP H0464418A
Authority
JP
Japan
Prior art keywords
heating
layers
layer
molds
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP90176670A
Other languages
Japanese (ja)
Inventor
Akira Asari
浅利 明
Satoshi Matsumoto
聰 松本
Takeshi Nagaoka
猛 長岡
Koro Takatsuka
公郎 高塚
Takao Fujikawa
隆男 藤川
Toshiaki Okumura
俊明 奥村
Yoshihiro Yamaguchi
喜弘 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP90176670A priority Critical patent/JPH0464418A/en
Priority to GB9114891A priority patent/GB2257388A/en
Priority to CA 2046729 priority patent/CA2046729A1/en
Priority to DE19914122995 priority patent/DE4122995A1/en
Publication of JPH0464418A publication Critical patent/JPH0464418A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7356Heating or cooling of the mould the temperature of the mould being near or higher than the melting temperature or glass transition temperature of the moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7393Heating or cooling of the mould alternately heating and cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To contrive shortening of a molding cycle and controlling of injection pressure by improving a quality of a molded product, by a method wherein a heat insulation layer by a heat insulation member, a heating layer by an electric conductive member and a protective film layer by a wear-resistant part are provided respectively on the inside of a cavity of a mold by a strengthened member, the top of the heat insulation layer and the top of the heating layer. CONSTITUTION:At the time of performance of injection molding by making use of molds 1, 2, heating layers 6, 7 comprised of an electric conductive member are set up at almost the same temperature as a heating and deformation temperature of a molding material by applying fixed voltage to the heating layers 6, 7 by control circuits 10, 11. Since temperatures of the heating layers 6, 7 are raised in a moment by the impression of the voltage, this becomes effective for shortening of a molding cycle. Since heat insulation layers 4, 5 are interposed among the heating layers 6, 7 and molds 1, 2, electric leakage is feared little and, moreover, the heating layers 6, 7 are kept at a uniform temperature without transfer of heat to the molds 1, 2. Further, protective film layers, 8, 9 by a wear-resistant member are provided on the top of the heating layers 6, 7.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、成形用金型に係り、樹脂を射出成形、圧縮成
形、熱成形するものに利用される。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a mold for molding, and is used for injection molding, compression molding, and thermoforming of resin.

(従来の技術) 射出成形法では通常加熱溶融した樹脂を、この樹脂の温
度より低い温度の金型内に圧入し、金型を更に冷却して
樹脂を固化させ成形する。
(Prior Art) In the injection molding method, usually heated and molten resin is press-fitted into a mold whose temperature is lower than that of the resin, and the mold is further cooled to solidify the resin and mold the resin.

この射出成形において金型の温度が低い部分では、溶融
した樹脂の粘度が上がって流動性が乏しくなるため、金
型のキャビティ内に樹脂を完全に満たすには、高い圧力
(例えば−1600気圧)で圧入し、かつ、ある時間高
い圧力で保圧する必要がある。
In injection molding, the viscosity of the molten resin increases in the lower temperature parts of the mold, resulting in poor fluidity, so in order to completely fill the mold cavity with resin, a high pressure (e.g. -1600 atmospheres) is required. It is necessary to press-fit it at high pressure and hold it at high pressure for a certain period of time.

金型内面の温度を、ショット開始時からキャビティ充満
時まで樹脂温度と同等に保持し、充満後、急速に冷却し
て樹脂を固化成形できれば、理想的であるが、現実には
金型の熱容量が大きく、金型の内面のみを急熱急冷しえ
ないのが実情である。
It would be ideal if the temperature inside the mold could be maintained at the same temperature as the resin from the start of the shot to the time the cavity is filled, and after filling, the resin could be solidified and molded by rapid cooling, but in reality, the heat capacity of the mold The reality is that it is not possible to rapidly heat and cool only the inner surface of the mold.

そこで、特開昭60−174624  号公報等で開示
されているように、金型の成形空間(キャビティ)に臨
む表面又は表面付近に加熱手段を設けた成形用金型が提
案されている。
Therefore, as disclosed in Japanese Unexamined Patent Publication No. 174624/1984, a molding die has been proposed in which a heating means is provided at or near the surface facing the molding space (cavity) of the mold.

(発明が解決しようとする課題) 前述公報記載の従来技術は、成形品の品質を向上し、か
つ成形サイクルを短縮できる等それなりの有用性が認め
られるけれども、通電加熱のための導電膜として銅箔が
用いられ、この導電膜と金型との間にセラミックスより
なる絶縁層を設けた所謂2層構造であるために、繰返し
射出成形に伴う導電膜の摩耗による欠損が生し易いとい
う問題があった。
(Problems to be Solved by the Invention) Although the conventional technology described in the above-mentioned publication is recognized to have some usefulness, such as being able to improve the quality of molded products and shorten the molding cycle, it is difficult to use copper as a conductive film for electrical heating. Because it has a so-called two-layer structure in which foil is used and an insulating layer made of ceramic is provided between the conductive film and the mold, there is a problem that the conductive film is easily damaged due to wear due to repeated injection molding. there were.

本発明は、成形空間(キャビティ)に臨む表面又は表面
付近に加熱手段を設けた成形用金型において、断熱層、
加熱層および保護膜層の所謂3層構造にすることによっ
て、前述従来技術の有用性を維持しながら、耐摩耗性を
向上して繰返し射出成形をしても耐久性に冨み、しかも
、射出圧を例えば200気圧以下にできる成形用金型を
提供することが目的である。
The present invention provides a molding die in which a heating means is provided at or near the surface facing a molding space (cavity), including a heat insulating layer,
By adopting a so-called three-layer structure consisting of a heating layer and a protective film layer, while maintaining the usefulness of the conventional technology mentioned above, it has improved wear resistance and is highly durable even after repeated injection molding. It is an object of the present invention to provide a molding die that can reduce the pressure to, for example, 200 atmospheres or less.

(課題を解決するだめの手段) 本発明は、前述の目的を達成するために次の技術的手段
を講じている。
(Means for Solving the Problem) The present invention takes the following technical means to achieve the above-mentioned object.

すなわと、本発明は、強度部材による金型1,2のキャ
ビテイ3内面に、絶縁部材による断熱層45と、該断熱
層4.5の上面に導電部材による加熱層6,7と、該加
熱層6.7の上面に耐摩耗部材による保護膜層8,9と
、を設けたものである。
In other words, the present invention includes a heat insulating layer 45 made of an insulating material on the inner surface of the cavity 3 of the molds 1 and 2 made of a strength member, a heating layer 6 and 7 made of a conductive material on the upper surface of the heat insulating layer 4. Protective film layers 8 and 9 made of wear-resistant materials are provided on the upper surface of the heating layer 6.7.

(実施例と作用) 以下、図面を参照して本発明の実施例と作用を説明する
(Embodiments and Operations) Hereinafter, embodiments and operations of the present invention will be described with reference to the drawings.

第1同は射出成形機におりる金型の断面斜視図を示して
おり、射出成形を行うために第1金型1および第2金型
2が設けられ、この第1・2金型1.2によってキャビ
ティ3が規定されている。
The first figure shows a cross-sectional perspective view of a mold that goes into an injection molding machine, in which a first mold 1 and a second mold 2 are provided for injection molding, and the first and second molds 1 The cavity 3 is defined by .2.

第1・2金型1,2は、その母材が軟綱、CrMo鋼、
工具鋼等の強度部材よりなっており、キャビティ3には
図外のスプールが連通されていて射出ノズルが接続され
ている。
The base materials of the first and second molds 1 and 2 are soft steel, CrMo steel,
It is made of a strong material such as tool steel, and a spool (not shown) is communicated with the cavity 3 to which an injection nozzle is connected.

キャビティ3の内面には絶縁部材による断熱層4.5と
、この断熱層4,5の上面に導電部材による加熱層6,
7と、該加熱層6,7の上面に耐摩耗部材による保護膜
層8.9と、を設けて成り、加熱層6゜7にはコントロ
ール回路10.IIが接続されていて所定の電圧を印加
可能とされている。
A heat insulating layer 4.5 made of an insulating material is provided on the inner surface of the cavity 3, and a heating layer 6 made of a conductive material is provided on the upper surface of the heat insulating layer 4,5.
7, and a protective film layer 8.9 made of a wear-resistant material is provided on the upper surface of the heating layers 6, 7, and a control circuit 10.9 is provided on the heating layer 6.7. II is connected so that a predetermined voltage can be applied.

第2図において、断熱層4,5としては、ガラス粉末、
ジルコニア、アルミナ等のセラミックスが採用され、数
100μmの層厚を有して設けられる。
In FIG. 2, the heat insulating layers 4 and 5 include glass powder,
Ceramics such as zirconia and alumina are used, and the layer thickness is several 100 μm.

具体的には、ガラス粉末のときは、粉末塗布後に焼付、
ホウロウによって設けられ、ジルコニアのときは溶射、
溶射後にHIP処理をすることによって設けられ、溶射
たけによるときはポーラス構造とできる。アルミナのと
きは、スパンタリング又は溶射手段によって設けられる
。なお、ジルコニアを採用するときは熱伝導率が小さく
、熱膨張率が鋼に近くでき、又、アルミナを採用すると
きは、高硬度にできる。
Specifically, when using glass powder, baking and
It is provided by enamel, and when it is made of zirconia, it is sprayed,
It is provided by HIP treatment after thermal spraying, and when thermal spraying is used, it can have a porous structure. In the case of alumina, it is provided by sputtering or thermal spraying means. Note that when zirconia is used, it has a low thermal conductivity and a coefficient of thermal expansion close to that of steel, and when alumina is used, it can be made to have high hardness.

加熱層6.7としては、N1−P、ニクロム、TiN、
TiC等の電気抵抗が小さな導電部材が採用され、数1
0μm〜100μmの層厚を有して設けられる。
As the heating layer 6.7, N1-P, nichrome, TiN,
A conductive material with low electrical resistance such as TiC is used, and the number of
It is provided with a layer thickness of 0 μm to 100 μm.

具体的には、N i −Pのときは無電解メンキ手段に
よって設けられ、ニクロムのときは、HIP接合によっ
て設けられ、TiN 、 TiCのときは物理的蒸着(
PVD)、化学的蒸着(CVD)ニよって5〜20μm
の層厚で設けられる。
Specifically, Ni-P is provided by electroless coating, nichrome is provided by HIP bonding, and TiN and TiC are provided by physical vapor deposition (
PVD), chemical vapor deposition (CVD) 5-20μm
It is provided with a layer thickness of .

他の延性のある金属材料の藻膜またはシートを加熱層と
して用いる場合には爆着によって所定のの層厚の加熱層
を設けることができる。
When using an algal membrane or sheet of other ductile metal material as the heating layer, the heating layer can be provided with a predetermined thickness by explosive bonding.

保護MN8.9としては、前記断熱層4,5よりも熱伝
導率が良好でかつ前記加熱層6,7よりも電気抵抗が大
きな耐摩耗部材であるCr、 TiN 、 TiCが採
用され、hloumO層厚を有して設けられる。
As the protective MN8.9, Cr, TiN, and TiC, which are wear-resistant members having better thermal conductivity than the heat insulating layers 4 and 5 and higher electrical resistance than the heating layers 6 and 7, are used, and the hloumO layer It is provided with a thickness.

具体的にはCrのときは電解メツキ手段により、又、T
iN 、 TiCのときはPVD、CVDによる。
Specifically, in the case of Cr, electrolytic plating means or T
For iN and TiC, PVD and CVD are used.

なお、保護膜層8,9としてTiN 、 TiCを採用
するときは、加熱層6,7は、TiN 、 TiC以外
のN i −P、ニクロム等が採用される。
Note that when TiN or TiC is used as the protective film layers 8 and 9, the heating layers 6 and 7 are made of Ni-P, nichrome, or the like other than TiN or TiC.

以上のように構成された金型1,2を用いて射出成形す
るにあたっては、コントロール回路10.11によって
所定の電圧を印加して、導電部材よりなる加熱層6,7
を成形材料の加熱変形温度とは−等しい温度に設定する
。この電圧印加によって加熱N6,7は瞬時に温度が上
昇するため、成形サイクルの短縮に有効となる。また、
加熱層6,7と金型1.2との間には、断熱層4,5が
介在されることによって、漏電のおそれが少な(しかも
加熱層6,7は金型1,2に熱を奪われることな(均一
な温度に保たれる。
When performing injection molding using the molds 1 and 2 configured as described above, a predetermined voltage is applied by the control circuit 10.11, and the heating layers 6 and 7 made of conductive members are
is set to a temperature equal to -the heating deformation temperature of the molding material. This voltage application causes the temperature of heating N6 and N7 to rise instantaneously, which is effective in shortening the molding cycle. Also,
Since the heat insulating layers 4 and 5 are interposed between the heating layers 6 and 7 and the molds 1.2, there is little risk of electrical leakage (in addition, the heating layers 6 and 7 do not transfer heat to the molds 1 and 2). It will not be taken away (it will maintain a uniform temperature).

更に、加熱層6,7の上面に耐摩耗部材による保護膜層
8,9が設けられることによって、繰返し射出成形を実
施しても加熱層6,7の摩耗による欠損は防止される。
Furthermore, by providing the protective film layers 8 and 9 made of wear-resistant materials on the upper surfaces of the heating layers 6 and 7, damage to the heating layers 6 and 7 due to wear is prevented even if injection molding is repeatedly performed.

次に、射出成形のサイクルタイムについて説明すると、
射出開始時間t1、射出終了時間t2、冷却開始時間t
3、冷却終了時間t4および成形品取出時間t5を1サ
イクルとして射出成形される。
Next, let's talk about injection molding cycle time.
Injection start time t1, injection end time t2, cooling start time t
3. Injection molding is performed with cooling end time t4 and molded product removal time t5 as one cycle.

前記時間t1からt2の間において、射出ノズルからス
プールを介して熱可塑性材料がキャビティ3内に射出さ
れる。
Between the time t1 and t2, thermoplastic material is injected into the cavity 3 from the injection nozzle via the spool.

このとき、キャビティ3の表面、即ち発熱状態にある加
熱層6,7によって、溶融した成形材料は第1・2金型
1,2に熱を奪われることなく充填される。このように
金型1,2の温度を低(設定する一方、キャビティ3の
表面温度のみを高く設定することによって成形収縮のア
ンバランスがなくなり、良質の成形品を得ることができ
る。時間t2において、コントロール回路10.11に
よって加熱層6.7の電圧印加を解除する。このとき加
熱層6,7は金型1,2全体に比べて熱容量が小さいの
で、予め成形材料の固化温度に設定されている金型1,
2とは−等と7い温度にまで瞬時に下降する。
At this time, the molten molding material is filled into the first and second molds 1 and 2 without losing heat due to the surfaces of the cavity 3, that is, the heating layers 6 and 7 which are in a heat-generating state. In this way, by setting the temperatures of the molds 1 and 2 to a low level while setting only the surface temperature of the cavity 3 to a high level, the unbalance of molding shrinkage is eliminated and a high-quality molded product can be obtained.At time t2 , the control circuit 10.11 releases the voltage application to the heating layer 6.7.At this time, since the heating layers 6 and 7 have a smaller heat capacity than the whole of the molds 1 and 2, they are set in advance to the solidification temperature of the molding material. mold 1,
2 means -, etc. The temperature drops instantly to 7.

時間t3からt4の間では、金型1,2内に射出された
熱可塑性材料がキャビティ3内で冷却、固化されて成形
品となる。
Between time t3 and t4, the thermoplastic material injected into the molds 1 and 2 is cooled and solidified within the cavity 3 to form a molded product.

時間t4からt5の間では、金型1,2の型開きを行っ
て成形品を取出し、その後コントロール回路1011に
よって再び加熱層6.7に電圧を印加してキャビティ3
の表面温度を上昇して上記動作を繰り返す。
Between time t4 and t5, the molds 1 and 2 are opened to take out the molded product, and then the control circuit 1011 applies voltage to the heating layer 6.7 again to heat the cavity 3.
Raise the surface temperature and repeat the above operation.

このようにキャビティ3の表面温度を瞬時に上昇、下降
することによって、成形サイクルの短縮を図ることがで
きる。また射出開始時間から射出終了時間の間において
、キャビティ3の表面を成形材料の溶融温度にまで上昇
しておくことによって、熱可塑性材料の成形収縮のバラ
ンスが保たれ良質の成形品を得ることができる。
By instantaneously raising and lowering the surface temperature of the cavity 3 in this way, it is possible to shorten the molding cycle. Furthermore, by raising the surface of the cavity 3 to the melting temperature of the molding material between the injection start time and the injection end time, the molding shrinkage of the thermoplastic material can be kept in balance and a high-quality molded product can be obtained. can.

第3図を参照すると、金型1,2の母材と断熱層4.5
との界面、断熱層4,5と加熱層6,7との界面、加熱
層6,7と保護膜層8,9との界面を全層にわたり又は
一部層にわたって傾斜組成材とすることによって熱膨張
差による剥離、ひび割れを防止した手段が開示されてい
る。
Referring to Figure 3, the base material of molds 1 and 2 and the heat insulating layer 4.5
By making the interfaces between the heat insulating layers 4, 5 and the heating layers 6, 7, and the interfaces between the heating layers 6, 7 and the protective film layers 8, 9 into graded composition materials over all or part of the layers. A means for preventing peeling and cracking due to differences in thermal expansion is disclosed.

第4図は加熱層に対する通電手段(コントロール回路)
の他の実施例を示しており、回では上金型1に断熱N4
、加熱層6、保護層8を設けたものを例示している。
Figure 4 shows the means for energizing the heating layer (control circuit)
Another example is shown in which the upper mold 1 is insulated with N4
, a heating layer 6 and a protective layer 8 are illustrated.

第4図に示すコントロール回路10は、キャビティの面
方向には望ましくはそれぞれ独立し2〜3系統にわけら
れている加熱層(ヒータ材)6に電極10A、1.OB
を介してサイリスクIOCから加熱電力を供給制御可能
としており、この場合、望ましくは温調計10Dを設け
て熱電対10εによって金型lのある点の温度を区分し
た区画ごとに測定し、局所的な温度制御を可能にしてい
る。
The control circuit 10 shown in FIG. 4 includes electrodes 10A, 1. OB
In this case, it is preferable to provide a temperature controller 10D to measure the temperature at a certain point in the mold l for each section using a thermocouple 10ε, and locally control the heating power from the Cyrisk IOC. This enables temperature control.

また、金型内面の均熱加熱を確認、改善するには、金型
1,2を開放状態として、サイリスクIOCを介して通
電加熱し、内面(表面)の温度分布を走査形の赤外線温
度計でモニターして、電極10A。
In addition, in order to check and improve the uniform heating of the inner surface of the mold, molds 1 and 2 are opened, heated with electricity through the Cyrisk IOC, and the temperature distribution on the inner surface (surface) is measured using a scanning infrared thermometer. Monitor with electrode 10A.

10Bの取付装置を最適にすることもできる。10B mounting arrangement can also be optimized.

第5図は傾斜組成材のより望ましい具体例を示している
FIG. 5 shows a more desirable example of a graded composition material.

すなわち、強度部材よりなる金型1,2と断熱層4.5
の部分が最も剥離し易いと考えられることがら、鋼材、
CrMo@等の強度部材よりなる金型1,2の表面に、
絶縁部材としてジルコニア、望ましくは部分安定化ジル
コニアよりなる断熱層4,5を設けている。
That is, the molds 1 and 2 made of strength members and the heat insulating layer 4.5
Steel materials,
On the surfaces of the molds 1 and 2 made of a strong material such as CrMo@,
Insulating layers 4 and 5 made of zirconia, preferably partially stabilized zirconia, are provided as insulating members.

この場合、断熱層4,5は容射による表面から銅粉10
0重量%の第−層4A、5A 、 fA粉75重量%と
ジルコニア25重量%の第二層48.5Bと、鋼粉50
重量%とジルコニア50重量%の第三層4C,5Bと、
鋼粉25重量とジルコニア75重量%の第四層4D、5
Dと、ジルコニア100重量%の第五層4E、5Eを層
形しており、第五層4E、5Eの層厚は50〜20μm
とされそれ以外の第一〜第四層は10〜30μmとされ
、これによって施工性を良好としている。
In this case, the heat insulating layers 4 and 5 are coated with copper powder 10
0% by weight of the first layer 4A, 5A, 75% by weight of fA powder, the second layer 48.5B of 25% by weight of zirconia, and 50% by weight of steel powder.
% by weight and third layers 4C and 5B of 50% by weight of zirconia,
Fourth layer 4D, 5 of 25% steel powder and 75% zirconia by weight
D and fifth layers 4E and 5E of zirconia 100% by weight, and the thickness of the fifth layers 4E and 5E is 50 to 20 μm.
The thickness of the other first to fourth layers is 10 to 30 μm, which improves workability.

なお、溶射の方法は、気孔の発生量の少ない減圧プラズ
マ溶射が好ましく、また、緻密化させるため溶射後にH
IP処理することが望ましい。
As for the method of thermal spraying, it is preferable to use low-pressure plasma spraying, which produces fewer pores.
IP processing is desirable.

その他、金型1,2のキャビティ3側と面する部分に、
冷却用媒体の通路等を設けることは自由である。
In addition, in the part facing the cavity 3 side of the molds 1 and 2,
It is free to provide cooling medium passages, etc.

(発明の効果) 本発明は以上の通りであり、本発明によれば、成形品の
品質を向上し、成形サイクルの短縮および射出圧の抑制
を図りながら、耐久性に冨んだ成形用金型を提供できる
(Effects of the Invention) The present invention is as described above, and according to the present invention, a molding metal with high durability is produced while improving the quality of molded products, shortening the molding cycle, and suppressing injection pressure. We can provide the mold.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の実施例を示し、第1図は射出成形機の金
型を示す断面斜視図、第2図は第1図A部の拡大図、第
3図は第2図の他の実施例を示す拡大図、第4図は第1
図の他側を示す断面図、第5図は第3図の他の例を示す
拡大図である。 L2・・・第1・2金型、3・・・キャビティ、4,5
・・・断熱層、6,7・・・加熱層、8,9・・・保護
膜層。 第1
The drawings show an embodiment of the present invention; FIG. 1 is a cross-sectional perspective view showing a mold of an injection molding machine, FIG. 2 is an enlarged view of section A in FIG. 1, and FIG. 3 is an alternative embodiment of FIG. 2. Enlarged view showing an example, Figure 4 is the first
A sectional view showing the other side of the figure, and FIG. 5 is an enlarged view showing another example of FIG. 3. L2... 1st and 2nd mold, 3... Cavity, 4, 5
... Heat insulation layer, 6, 7 ... Heating layer, 8, 9 ... Protective film layer. 1st

Claims (1)

【特許請求の範囲】[Claims] (1)強度部材による金型(1)(2)のキャビティ(
3)内面に、絶縁部材による断熱層(4)(5)と、該
断熱層(4)(5)の上面に導電部材による加熱層(6
)(7)と、該加熱層(6)(7)の上面に耐摩耗部材
による保護膜層(8)(9)と、を設けたことを特徴と
する成形用金型。
(1) Cavities of molds (1) and (2) by strength members (
3) A heat insulating layer (4) (5) made of an insulating material is provided on the inner surface, and a heating layer (6) made of a conductive material is provided on the upper surface of the heat insulating layer (4) (5).
) (7); and protective film layers (8) and (9) made of a wear-resistant material are provided on the upper surfaces of the heating layers (6) and (7).
JP90176670A 1990-07-03 1990-07-03 Mold Pending JPH0464418A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP90176670A JPH0464418A (en) 1990-07-03 1990-07-03 Mold
GB9114891A GB2257388A (en) 1990-07-03 1991-07-10 Electrically heated moulding die
CA 2046729 CA2046729A1 (en) 1990-07-03 1991-07-10 Molding die
DE19914122995 DE4122995A1 (en) 1990-07-03 1991-07-11 MOLDING FORM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP90176670A JPH0464418A (en) 1990-07-03 1990-07-03 Mold

Publications (1)

Publication Number Publication Date
JPH0464418A true JPH0464418A (en) 1992-02-28

Family

ID=16017665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP90176670A Pending JPH0464418A (en) 1990-07-03 1990-07-03 Mold

Country Status (4)

Country Link
JP (1) JPH0464418A (en)
CA (1) CA2046729A1 (en)
DE (1) DE4122995A1 (en)
GB (1) GB2257388A (en)

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Also Published As

Publication number Publication date
GB2257388A (en) 1993-01-13
GB9114891D0 (en) 1991-08-28
DE4122995A1 (en) 1992-02-13
CA2046729A1 (en) 1992-01-12

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