JPH046361U - - Google Patents
Info
- Publication number
- JPH046361U JPH046361U JP4270390U JP4270390U JPH046361U JP H046361 U JPH046361 U JP H046361U JP 4270390 U JP4270390 U JP 4270390U JP 4270390 U JP4270390 U JP 4270390U JP H046361 U JPH046361 U JP H046361U
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- soldering device
- filter
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270390U JPH046361U (fr) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4270390U JPH046361U (fr) | 1990-04-20 | 1990-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH046361U true JPH046361U (fr) | 1992-01-21 |
Family
ID=31554479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4270390U Pending JPH046361U (fr) | 1990-04-20 | 1990-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046361U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006100899A1 (fr) * | 2005-03-18 | 2006-09-28 | Senju Metal Industry Co., Ltd | Cuve d’ejection de soudure |
| JP2011124453A (ja) * | 2009-12-11 | 2011-06-23 | Senju Metal Ind Co Ltd | 噴流はんだ槽 |
-
1990
- 1990-04-20 JP JP4270390U patent/JPH046361U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006100899A1 (fr) * | 2005-03-18 | 2006-09-28 | Senju Metal Industry Co., Ltd | Cuve d’ejection de soudure |
| JP2011124453A (ja) * | 2009-12-11 | 2011-06-23 | Senju Metal Ind Co Ltd | 噴流はんだ槽 |