JPH0163167U - - Google Patents
Info
- Publication number
- JPH0163167U JPH0163167U JP1987157979U JP15797987U JPH0163167U JP H0163167 U JPH0163167 U JP H0163167U JP 1987157979 U JP1987157979 U JP 1987157979U JP 15797987 U JP15797987 U JP 15797987U JP H0163167 U JPH0163167 U JP H0163167U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- tip
- covered
- soldering land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 241000277284 Salvelinus fontinalis Species 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987157979U JPH0163167U (fr) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987157979U JPH0163167U (fr) | 1987-10-15 | 1987-10-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0163167U true JPH0163167U (fr) | 1989-04-24 |
Family
ID=31437896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987157979U Pending JPH0163167U (fr) | 1987-10-15 | 1987-10-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0163167U (fr) |
-
1987
- 1987-10-15 JP JP1987157979U patent/JPH0163167U/ja active Pending