JPH0463142U - - Google Patents

Info

Publication number
JPH0463142U
JPH0463142U JP10488090U JP10488090U JPH0463142U JP H0463142 U JPH0463142 U JP H0463142U JP 10488090 U JP10488090 U JP 10488090U JP 10488090 U JP10488090 U JP 10488090U JP H0463142 U JPH0463142 U JP H0463142U
Authority
JP
Japan
Prior art keywords
wafer
ring
vacuum suction
suction
small diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10488090U
Other languages
English (en)
Japanese (ja)
Other versions
JP2565673Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990104880U priority Critical patent/JP2565673Y2/ja
Publication of JPH0463142U publication Critical patent/JPH0463142U/ja
Application granted granted Critical
Publication of JP2565673Y2 publication Critical patent/JP2565673Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1990104880U 1990-10-02 1990-10-02 ウエハの保持装置 Expired - Lifetime JP2565673Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990104880U JP2565673Y2 (ja) 1990-10-02 1990-10-02 ウエハの保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990104880U JP2565673Y2 (ja) 1990-10-02 1990-10-02 ウエハの保持装置

Publications (2)

Publication Number Publication Date
JPH0463142U true JPH0463142U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-29
JP2565673Y2 JP2565673Y2 (ja) 1998-03-18

Family

ID=31850332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990104880U Expired - Lifetime JP2565673Y2 (ja) 1990-10-02 1990-10-02 ウエハの保持装置

Country Status (1)

Country Link
JP (1) JP2565673Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006276084A (ja) * 2005-03-28 2006-10-12 Orc Mfg Co Ltd 露光テーブルおよび露光装置
JP2019096907A (ja) * 2019-03-04 2019-06-20 三菱電機株式会社 真空チャックステージおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178341A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Wafer sucking device
JPS60109859U (ja) * 1983-12-28 1985-07-25 株式会社　デイスコ 半導体ウエ−ハ表面研削装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178341A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Wafer sucking device
JPS60109859U (ja) * 1983-12-28 1985-07-25 株式会社　デイスコ 半導体ウエ−ハ表面研削装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006276084A (ja) * 2005-03-28 2006-10-12 Orc Mfg Co Ltd 露光テーブルおよび露光装置
JP2019096907A (ja) * 2019-03-04 2019-06-20 三菱電機株式会社 真空チャックステージおよび半導体装置の製造方法

Also Published As

Publication number Publication date
JP2565673Y2 (ja) 1998-03-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term