JPH0462989A - Confirming method for printing deviation on flexible printed wiring board - Google Patents

Abstract

PURPOSE:To facilitate accurate judgement of propriety of a printed pattern by forming first and second marks of first and second scale lines of the same width aligned at an equal interval in parallel, and setting to slightly increase or decrease the aligning interval of the second scale line as compared with the first scale line. CONSTITUTION:A first mark 10-1 is printed simultaneously with a first wiring pattern 14 on a flexible board 12. A second mark 16-1 is printed simultaneously with a second wiring pattern 18 on the board 12. The marks 10-1, 10-2 are formed of first and second scale lines 20, 22 of the same width aligned at an equal interval in parallel. The aligning interval of scale line 22 is set to be slightly increased or decreased as compared with the line 20. When any of the line 22 is superposed with any of the lines 20, one and the other of the marks 10-1, 10-2 are operated as functions of main and sub scales to quantitatively read the printed deviation of the patterns 14, 18.

Description

[Detailed Description of the Invention] [Table of Contents Overview Industrial Application Fields Prior Art Problems to be Solved by the Invention Means for Solving the Problems Effects of the Invention [Summary Regarding a method for confirming the misalignment of a wiring pattern from the overlapping error of marks printed at the same time, the purpose of the present invention is to provide a method that makes it possible to easily and accurately judge whether the printed pattern is good or bad. A second mark is printed simultaneously with the first wiring pattern on the flexible substrate, a second mark is printed simultaneously with the second wiring pattern on the flexible substrate, and the printing misalignment between the first wiring pattern and the second wiring pattern is caused by the difference between the first mark and the second wiring pattern. In this method, the first mark and the second mark are each formed by a first scale line and a second scale line of the same width that are arranged in parallel at equal intervals, and the first mark and the second mark are In comparison, the alignment interval of the second scale lines is set to be slightly increased or decreased, and one of the second scale lines is superimposed on one of the first scale glands.

[Industrial Application Field] The present invention relates to a method in which the misalignment of each wiring pattern printed on a flexible substrate is confirmed from the overlapping error of each mark printed at the same time.

Flexible printed wiring boards are manufactured by repeatedly printing a wiring pattern on a flexible substrate, and are used in combination machines and facsimile machines.

Widely used in keyboards for mobile telephones, computer-controlled machine tools, etc.

[Prior Art] In the wiring pattern printing process, errors occur in the positioning of the flexible substrate, and the flexible substrate expands and contracts due to heat, so when pattern printing is repeated, printing misalignment occurs between the wiring patterns.

It is preferable that intermediate products whose printing misalignment exceeds the allowable limit be detected early as defective products and removed from the production line.

Therefore, predetermined patterns are printed at the same time as the wiring patterns, and are superimposed on the flexible substrate.

Conventionally, the marks 40 shown in FIG. 4 are printed at the same position on the flexible substrate 12, and these marks 40
At this time, it was determined whether the wiring was printed well or not by visually recognizing the overlapping state of the marks 40. At this time, products with large misalignment of the marks 40 were judged to be defective products, and defective intermediate products were removed from the production line.

Only those products with good viscosity are processed through the flexible printed wiring board manufacturing process.

[Problems to be Solved by the Invention] However, in the past, the quality of the printed pattern was determined based on the overlapping state of the printed marks 40, which made the limits of good and defective products vague, making it difficult to make accurate decisions efficiently. The present invention has been made in view of the above-mentioned conventional problems.
The purpose is to provide a method that makes it possible to easily and accurately judge the quality of a printed pattern.

[Means for Solving the Problems] In order to achieve the above object, the method shown in FIG. 1 is adopted in the present invention.

In FIG. 2A, a first mark 10-1 is printed simultaneously with the first wiring pattern 14 on the flexible substrate 12 (step 100).

Further, as shown in FIG. 2B, a second mark 16-1 is printed on the flexible substrate 12 at the same time as the second wiring pattern 18 (step 102).

As shown in FIG. 2C, the printing misalignment between the first wiring pattern 14 and the second wiring pattern 18 is read from the overlapping error of the second mark 16-1 with respect to the first mark 10-1.

Here, as shown in the same figure (D), the first mark 10-1 and the second mark
The marks 16-1 are each formed by a first scale line 20 and a second scale line 22 having the same width and arranged in parallel at equal intervals.

Then, the alignment interval of the second scale lines 22 is set to be slightly increased or decreased compared to the first scale lines 20.

Further, in the figure, any of the second scale lines 22 is superimposed on any of the first scale lines 20. In the figure, the second scale line 22 at the center in the alignment direction is superimposed on the first scale line 20 at the center in the alignment direction. Ru.

[Operation] In the present invention, the first mark 10-1 and the second mark 16-1
are formed by a first scale line 20 and a second scale line 22 of the same width that are arranged in parallel at equal intervals, and the alignment interval of the second scale line 22 is set to be slightly increased or decreased compared to the gourd 1 scale line 20,
Since either of the second scale lines 22 is superimposed on either of the first scale lines 20, one and the other of the first mark 10-1 and the second mark 16-1 can function as a main scale and a vernier scale, respectively. .

Therefore, it becomes possible to quantitatively read the printing misalignment between the first wiring pattern 14 and the second wiring pattern 18.

[Example] Hereinafter, a preferred example of the method according to the present invention will be described based on the drawings.

In FIG. 2, the manufacturing process of the wiring board product 30 is explained, and in FIG. 3, the wiring pattern 300 printed on the wiring board product 30 is explained.

In step 200 of FIG. 2, a sheet made of polyester, polyimide, polyether, etc. is prepared as the flexible substrate 12 and subjected to heat annealing treatment.

When the thermal deformation of the flexible substrate 12 is sufficiently suppressed by the heat annealing treatment, the conductive pattern 14-
1. 14-2 is the flexible substrate 1 in the next step 202
2 is printed on.

In this embodiment, conductive patterns 14-1. 14-2 as well as marks 10-1 for measuring pattern printing deviation.
10-2 is printed at 4 m locations around the pattern printing area, avoiding the pattern printing area.

The mark 10-1 is formed by scale lines 20 of the same width arranged in parallel at equal intervals as shown in FIG. It is formed by scale lines 24.

However, these scale lines 20 and 24 extend in directions perpendicular to each other.

Note that the number of scale lines 20.24 is selected from a range of 5 to 20, and their line width is set to about 0.2 mm.

In the next step 204, the pattern 1 on the flexible substrate 12 is
4-1. 14-2 (and mark 10-1°10-2)
When dried, conductive patterns 18-1, 18-2 become patterns 14-1. 14-2 is overprinted in step 206.

At this time, conductive pattern 18-1. 18-2 as well as marks 16-1 for measuring pattern printing deviation. 1
6-2 is printed at four locations around the pattern printing area, avoiding the pattern printing area.

As shown in FIG. 1(D), the mark 16-1 is formed by scale lines 22 of the same width that are arranged in parallel at equal intervals (here, 9 lines), and the mark 16-2 is also formed by the same 9 lines. It is formed by the scale lines 26 of the book.

However, these scale lines 22 and 26 extend in directions perpendicular to each other.

In addition, the scale lines 22 and 26 located at the center in the alignment direction are similar to the scale line 22 and 26 located at the center in the alignment direction, as shown in FIG. 1(D).
．． 24 are printed overlapping each other.

Furthermore, mark 16-1. Scale line 2 at 16-2
The alignment interval of 2.26 is set to be slightly decreased compared to the scale line 20.24 at mark 10-1.10-2.

The number of scale lines 22 and 26 is also selected from the range of 5 to 20 (usually 1 to 20 from marks 10-1 and 10-2).
2 less), their line width is mark 10-1. 10
-2 is approximately 0.2 mm.

Also, the same as the scale lines 22 and 26 located at the end of the alignment direction (
It is also possible to print the scale lines 20 and 24 at the ends in the alignment direction so as to overlap each other.

Then, in the next step 208, mark 10-1, I
F5-1 and Mark 10-2. 16-2, a printing misalignment inspection is performed to check the dripping state.

In this embodiment, the scale tlA20.24. Scale line 24
26 extend in directions perpendicular to each other, and a scale line 22.26 positioned at the center in the alignment direction is printed overlapping with a scale line 20.24 also located at the center in the alignment direction, and the scale line 22.26
Since the alignment interval of the marks 10 and 24 is set to be slightly decreased compared to the scale lines 20 and 24, the marks 10-
1. 1, O-2 and Mark 113-1. 16-2 are used as the main scale and vernier scale, respectively, and the wiring patterns 14-1, 14-2 and 18-1 in both directions.
18-2 is quantitatively measured.

Intermediate products determined to be defective are removed from the production line (step 210), and only intermediate products determined to be good are left on the production line (step 212).

When this good product is dried in step 214, another pattern is printed overlappingly in step 216 if necessary, and the main part of the pattern is covered with an insulating material in step 218.

Furthermore, once the insulating film is dried in step 220, the area of the pattern printing is punched out with a press in step 222.

Two lower sheets obtained by punching 32-1.32
-2, circuit components such as diodes are mounted in step 224, these lower sheets 32-1, 32-2 and another upper sheet 34 are bonded together in step 226 to obtain the desired wiring board product 30. It will be done.

Further, the remaining portion of the press punching is stored (step 228), and the marked portion is used to measure the thickness of the printed pattern, and is also used as investigation material if a problem is discovered later.

As explained above, according to this embodiment, the marks 10-1. 10-2/16-1.
16-2 is the corresponding wiring pattern 14-1, 14-2/
18-1. 18-2, the amount of deviation in pattern printing can be quantitatively measured in both orthogonal directions, and therefore the quality of the intermediate product can be easily and accurately judged without requiring any skill.

Therefore, it becomes possible to make the inspection work for printing misalignment more efficient.

A second embodiment is illustrated in FIG. 5, in which the second scale line 22 is one less than the first scale line 20.
Of these scale lines 20 and 22, those at both left and right ends are superimposed.

In FIG. 6, a case is explained in which a printing deviation occurs in the second embodiment, and here a printing deviation corresponding to twice the line width occurs.

Furthermore, a third embodiment is explained in FIG. 7, and in this example, the number of second scale lines 22 is two fewer than the first scale lines 20, and both left and right ends of the scale lines 20 are excluded (one and two scale lines 22).
are superimposed.

8, 9, and 10 illustrate the case where printing misalignment occurs in the third embodiment, and in FIG. 8, a printing misalignment equivalent to one half of the line width occurs. .

Further, in FIG. 9, a printing deviation equivalent to one line width has occurred, and in FIG. 10, a printing deviation equivalent to twice the line width has occurred.

[Effects of the Invention] As explained above, according to the present invention, the main and vernier marks are printed at the same time as the wiring pattern and are superimposed, so it is possible to quantify the printing deviation of the wiring pattern from both marks. to ensure that good and defective products are correctly identified (reliably).
Moreover, it can be done efficiently.

[Brief explanation of the drawing]

Figure 1 explains the principle of the invention Figure 2 explains the manufacturing process of the embodiment Figure 3 explains the wiring pattern of the product Figure 4 explains the prior art A Figure 5 shows the markings in the second embodiment Explanation A Fig. 6 is an explanatory diagram of the printing misalignment confirmation function in the second embodiment, Fig. 7 is an explanatory diagram of marks in the third embodiment, Fig. 8,
FIGS. 9 and 10 are explanations A of confirmation of printing deviation in the third embodiment. 14-2...First wiring pattern...Second mark...Fourth mark 18-2...Second wiring pattern, first scale line, second scale line, third scale line, fourth scale line・Final manufacturing of flexible printed wiring board 14-1゜16-l ・Engineer 6-20 18-1゜20 22 points ・24 ・ ・ 26 ・ ・ 30 points ・ Product 10-1...1st mark 10- 2...Third mark 12...Flexible printed wiring board Fig. 4 Fig. 7;

Claims (6)

[Claims] (1). A first mark (10-1) is printed simultaneously with the first wiring pattern (14) on the flexible substrate (12) (step 10).
0), a second mark (16-1) on the flexible substrate (12)
) is printed simultaneously with the second wiring pattern (18) (step 1
02), first wiring pattern (14) and second wiring pattern (18)
In the method in which the printing misalignment of is confirmed from the overlapping error of the second mark (16-1) with respect to the first mark (10-1), the first mark (10-1) and the second mark (16-1) are
each formed by a first scale line (20) and a second scale line (22) of the same width that are aligned in parallel at equal intervals, and the alignment of the second scale line (22) relative to the first scale line (20); A method for checking printing deviation on a flexible printed wiring board, characterized in that the interval is set to be slightly increased or decreased, and one of the second scale lines (22) is superimposed on one of the first scale lines (20). (2). Printing on a flexible printed wiring board according to claim (1), characterized in that a first scale line (20) at the center in the alignment direction is superimposed on a second scale line (22) at the center in the alignment direction. How to check the deviation. (3). A third mark (10-2) formed by third scale lines (24) of the same width, each extending in a direction perpendicular to the scale line (20) of the first mark (10-1) and aligned in parallel at equal intervals. is printed at the same time as the first mark (10-1) and the first wiring pattern (14), and the scale line (2) of the second mark (16-1) is printed simultaneously.
The fourth mark (16-2) formed by the fourth scale lines (26) of the same width extending in the direction perpendicular to the second mark (16-1) and the second mark (16-1) and the second The third scale line (24) is printed at the same time as the wiring pattern (18).
The alignment interval of the fourth scale line (26) is set to be slightly increased or decreased compared to the above, and one of the fourth scale lines (26) is superimposed on one of the third scale lines (24). A method for checking printing misalignment of a flexible printed wiring board according to claim (1). (4). The first mark (10-1) and the second mark (16-1) are connected to the first wiring pattern (1) on the flexible substrate (12).
4) and a position outside the printing area of the second wiring pattern (18), respectively.The method for checking printing deviation on a flexible printed wiring board according to claim 1, wherein the printing is performed at a position outside the printing area of the second wiring pattern (18). (5). Printing deviation of the flexible printed wiring board according to claim (1), characterized in that the number of second scale lines (22) is set to decrease by one with respect to the first scale line (20). Confirmation method. (6). A method for checking printing deviation on a flexible printed wiring board, characterized in that the number of first scale lines (20) and second scale lines (22) are set to be the same.