JPH0462816A - Chip-type electronic parts - Google Patents
Chip-type electronic partsInfo
- Publication number
- JPH0462816A JPH0462816A JP16706990A JP16706990A JPH0462816A JP H0462816 A JPH0462816 A JP H0462816A JP 16706990 A JP16706990 A JP 16706990A JP 16706990 A JP16706990 A JP 16706990A JP H0462816 A JPH0462816 A JP H0462816A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- external electrode
- solder
- chip
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 13
- 239000007772 electrode material Substances 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 239000004020 conductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種の電子回路を構成するチップ型電子部品
に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to chip-type electronic components constituting various electronic circuits.
従来の技術と課題
従来、第６図に示すように、チップ型電子部品の外部電
極３０は、部品本体３１の両端部に異けられ、実装面、
端面及び上面を被覆していた。この電子部品は、第７図
に示すように、外部電極３０にて半田３４を介して印刷
配線板３２に取り付けられる。Conventional techniques and problems Conventionally, as shown in FIG. 6, external electrodes 30 of a chip-type electronic component are disposed at both ends of a component body 31, and the external electrodes 30 are located on the mounting surface,
The end and top surfaces were covered. As shown in FIG. 7, this electronic component is attached to a printed wiring board 32 at external electrodes 30 via solder 34.
ところで、外部電極３０のうち、本体３１の」二面に設
けた部分については、外部電極としての本質的役割、即
ち、電子部品を印刷配線板３２の所定の位置に固定し、
かつ、本体３１に収納された機能素子と印刷配線板３２
上に配設された導体バクーン３３とを電気的に接続する
という役割には何ら関与していない。本体３１の上面に
外部電極３０を延在するのは、主として自動実装時に電
子部品の上下のづ５向を揃える必要がない等、製造上取
り扱い易いからである。従って、外部電極３０のうち、
本体３１の上面に設けた部分は、外部電極としての木質
的役割の面からみると、無駄な部分であって、電極材料
のコストが高くなっていた原因の一つであった。By the way, the portion of the external electrode 30 provided on the second surface of the main body 31 fulfills its essential role as an external electrode, that is, to fix electronic components at predetermined positions on the printed wiring board 32.
In addition, the functional elements housed in the main body 31 and the printed wiring board 32
It is not involved in any role of electrically connecting the conductor barcoon 33 disposed above. The reason why the external electrode 30 is extended on the upper surface of the main body 31 is that it is easy to handle in manufacturing, such as not having to align the top and bottom of the electronic components during automatic mounting. Therefore, among the external electrodes 30,
The portion provided on the upper surface of the main body 31 is a wasteful portion from the perspective of the wood's role as an external electrode, and is one of the reasons for the high cost of the electrode material.
また、実装の際に供給きれる半田３４が上面部分にまで
広がるため、半田３４の供給量を多くしなければならな
い等の不具合いがあった。Further, since the solder 34 that is completely supplied during mounting spreads to the upper surface portion, there is a problem that the amount of solder 34 that can be supplied must be increased.
そこで、本発明の課題は、外部電極材料の使用量や半田
の供給量が少なくてすむチップ型電子部品を提供するこ
とにある。Therefore, an object of the present invention is to provide a chip-type electronic component that requires less external electrode material and less solder.
課題を解決するための手段
以−にの課題を解決するため、本発明に係るチッブ型電
子部品は、外部電極が、電子部品の実装面に設けた取付
は部及び電子部品の側面に設けた引出し部のみからなる
ことを特徴とする。Means for Solving the Problem In order to solve the problem, the chip-type electronic component according to the present invention has an external electrode provided on the mounting surface of the electronic component and a mounting surface provided on the side surface of the electronic component. It is characterized by consisting only of a drawer part.
作用
外部電極のうち、電子部品の側面に設けた引出し部は、
部品本体に収納された機能素子より引き出され、部品本
体の側面に及ぶ内部パターンに接し、電子部品の実装面
に設けた取付は部は印刷配線板」二の導体パターンに取
り付けられる。これにより、部品本体の実装面及び側面
にのみ設けた外部電極は、電子部品を印刷配線板の所定
の位置に固定し、かつ、部品本体に収納きれて前記外部
に引き出された内部パターンに接続されている機能素子
と印刷配線板上の導体パターンとを電気的に接続する働
きをする。Among the working external electrodes, the drawer part provided on the side of the electronic component is
The mounting section, which is drawn out from the functional element housed in the component body and is in contact with the internal pattern extending over the side surface of the component body, provided on the mounting surface of the electronic component, is attached to the second conductor pattern of the printed wiring board. As a result, the external electrodes provided only on the mounting surface and side surfaces of the component body can fix the electronic component in a predetermined position on the printed wiring board, and connect to the internal pattern that can be accommodated in the component body and drawn out to the outside. It serves to electrically connect the functional elements on the printed wiring board and the conductor pattern on the printed wiring board.
実施例
以下、本発明に係るチップ型電子部品の一実施例を添付
図面を参照して説明する。EXAMPLE Hereinafter, an example of a chip-type electronic component according to the present invention will be described with reference to the accompanying drawings.
第１図は、２端子のチップ型電子部品の外観を示す。部
品本体１の両端部に外部電極２が設（りられている。外
部電極２は、本体１の側面に設けた引出し部２ａと本体
１の実装面に設けた取付は部２ｂとからなる。引出し部
２ａと取付は部２ｂは一体的に形成されている。本体１
には圧電共振子等の機能素子が収納されており、この機
能素子より引き出される内部パターンは、さらに本体１
の側面にまで及んでいる。前記引出し部２ａは内部バク
ーンに接し、機能素子と外部電極２とは電気的に接続し
ている。外部電極２は本体１上面には延在していないの
で、従来の外部電極に比較して電極材料の使用量が少な
くてすむ。FIG. 1 shows the appearance of a two-terminal chip-type electronic component. External electrodes 2 are provided at both ends of the component body 1. The external electrodes 2 consist of a drawer part 2a provided on the side surface of the main body 1 and a mounting part 2b provided on the mounting surface of the main body 1. The drawer part 2a and the mounting part 2b are integrally formed.Main body 1
A functional element such as a piezoelectric resonator is housed in the main body 1, and the internal pattern extracted from this functional element is further
It extends to the sides. The drawn-out portion 2a is in contact with the internal backing, and the functional element and the external electrode 2 are electrically connected. Since the external electrode 2 does not extend over the top surface of the main body 1, the amount of electrode material used can be reduced compared to conventional external electrodes.
第２図に、この電子部品を印刷配線板に実装した状態を
示す。印刷配線板５の上面には導体パターン６が配設き
れている。電子部品は、導体パターン６の上に半田７を
介して、その外部電極２の取付は部２ｂにて固定され、
電気的に接続されている。このとき、半田７は本体１の
上面に広がらないので、半田供給量は少なくてすむ。FIG. 2 shows a state in which this electronic component is mounted on a printed wiring board. A conductive pattern 6 is completely disposed on the upper surface of the printed wiring board 5. The electronic component is fixed on the conductor pattern 6 via the solder 7, and the external electrode 2 is fixed at the part 2b.
electrically connected. At this time, since the solder 7 does not spread over the upper surface of the main body 1, the amount of solder supplied can be small.
こうして、電子部品を印刷配線板５の所定の位置に固定
し、かつ、本体１に収納された機能素子と印刷配線板５
−１−に配設された導体パターン６とを電気的に接続す
るという役割を損なうことなく、電極材料の使用量や半
田の供給量が少なくてすむチップ型電子部品が得られる
。In this way, the electronic components are fixed at predetermined positions on the printed wiring board 5, and the functional elements housed in the main body 1 and the printed wiring board 5 are fixed.
A chip-type electronic component can be obtained that requires less electrode material and less solder without impairing the role of electrically connecting the conductor pattern 6 disposed on -1-.
なお、本発明に係るチップ型電子部品は前記実施例に限
定するものではなく、その要旨の範囲内で種々に変形す
ることができる。特に、外部電極の形状、数及び位置等
については任意であって、例えは、第３図、第４図、第
５図に示すものでもよい。第３図に示すチップ型電子部
品は、部品本体１５の４箇所の隅部に外部電極１６を設
けている。Note that the chip-type electronic component according to the present invention is not limited to the above embodiments, and can be modified in various ways within the scope of the gist. In particular, the shape, number, position, etc. of the external electrodes may be arbitrary, and may be as shown in FIGS. 3, 4, and 5, for example. The chip type electronic component shown in FIG. 3 has external electrodes 16 provided at four corners of the component body 15.
第４図に示すチップ型電子部品は、部品本体２０の４辺
の中央部に外部電極２１を設けている。第５図に示すチ
ップ型電子部品は部品本体２５の両端及び中央部に外部
電極２６を設けている。The chip type electronic component shown in FIG. 4 has external electrodes 21 provided at the center of the four sides of the component body 20. The chip-type electronic component shown in FIG. 5 has external electrodes 26 provided at both ends and the center of a component body 25.
発明の効果
本発明は、外部電極を実装面と側面にのみ設げたため、
電極材料の使用量や半田の供給量が少なくてすみ、コス
トダウンが可能なチップ型電子部品が得られる。しかも
、この電子部品を製造する場合、上面に外部電極を形成
する必要がないので、生産性が高いものとなる。Effects of the Invention Since the present invention provides external electrodes only on the mounting surface and side surfaces,
A chip-type electronic component can be obtained that requires less electrode material and less solder, and can reduce costs. Furthermore, when manufacturing this electronic component, there is no need to form external electrodes on the top surface, resulting in high productivity.
第１図及び第２図は本発明に係るチップ型電子部品の第
１実施例を示すもので、第１図は外観の斜視図、第２図
は取付は状態を示す正面図である。
第３図、第４図、第５図はそれぞれ外部電極の変形例を
示す斜視図である。第６図及び第７図は従来のチップ型
電子部品を示すもので、第６図は外観の斜視図、第７図
は取付は状態を示す正面図である。
１・・・部品本体、２・・・外部電極、２ａ・・弓１出
し部、２ｂ・・・取付げ部、１５．２０．２５・・・部
品本体、１６．２１．２６・・・外部電極。
特許出願人 株式会社村田製作所1 and 2 show a first embodiment of a chip-type electronic component according to the present invention. FIG. 1 is a perspective view of the external appearance, and FIG. 2 is a front view showing the installed state. FIG. 3, FIG. 4, and FIG. 5 are perspective views showing modified examples of external electrodes, respectively. FIGS. 6 and 7 show a conventional chip-type electronic component, with FIG. 6 being a perspective view of the external appearance, and FIG. 7 being a front view showing the installation state. DESCRIPTION OF SYMBOLS 1... Part main body, 2... External electrode, 2a... Bow 1 extension part, 2b... Mounting part, 15.20.25... Part main body, 16.21.26... External electrode. Patent applicant Murata Manufacturing Co., Ltd.
Claims (1)
び電子部品の側面に設けた引出し部のみからなることを
特徴とするチップ型電子部品。1. A chip-type electronic component comprising an external electrode, wherein the external electrode consists of only a mounting portion provided on a mounting surface of the electronic component and a draw-out portion provided on a side surface of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16706990A JPH0462816A (en) | 1990-06-25 | 1990-06-25 | Chip-type electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16706990A JPH0462816A (en) | 1990-06-25 | 1990-06-25 | Chip-type electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0462816A true JPH0462816A (en) | 1992-02-27 |
Family
ID=15842832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16706990A Pending JPH0462816A (en) | 1990-06-25 | 1990-06-25 | Chip-type electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0462816A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008219094A (en) * | 2007-02-28 | 2008-09-18 | Kyocera Kinseki Corp | Piezoelectric oscillator |
-
1990
- 1990-06-25 JP JP16706990A patent/JPH0462816A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008219094A (en) * | 2007-02-28 | 2008-09-18 | Kyocera Kinseki Corp | Piezoelectric oscillator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0625951Y2 (en) | Electronic parts | |
| JPH0462816A (en) | Chip-type electronic parts | |
| JPH044779U (en) | ||
| JPH0323965U (en) | ||
| JP3099492B2 (en) | Composite electronic components | |
| JPH0113411Y2 (en) | ||
| JPH0615420Y2 (en) | Mounting structure for lug terminals for printed circuit boards | |
| JP2636332B2 (en) | Printed board | |
| JPH0645494A (en) | Package for semiconductor integrated circuit | |
| JPH0536305Y2 (en) | ||
| JPS62180973U (en) | ||
| JPS6020300Y2 (en) | printed wiring board | |
| JPH0334202U (en) | ||
| JPH0323968U (en) | ||
| JPH01137072U (en) | ||
| JPH0397999U (en) | ||
| JPS6149495U (en) | ||
| JPS646029U (en) | ||
| JPH0244264U (en) | ||
| JPH03117893U (en) | ||
| JPH0359642U (en) | ||
| JPH0350370U (en) | ||
| JPH0459162U (en) | ||
| JPH0399467U (en) | ||
| JPS59101463U (en) | Grounding structure of electronic components |