JPH0462737A - Manufacture of temperature fuse - Google Patents

Manufacture of temperature fuse

Info

Publication number
JPH0462737A
JPH0462737A JP17392790A JP17392790A JPH0462737A JP H0462737 A JPH0462737 A JP H0462737A JP 17392790 A JP17392790 A JP 17392790A JP 17392790 A JP17392790 A JP 17392790A JP H0462737 A JPH0462737 A JP H0462737A
Authority
JP
Japan
Prior art keywords
case
chuck
sealing resin
held
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17392790A
Other languages
Japanese (ja)
Other versions
JP2832074B2 (en
Inventor
Osamu Tsumura
治 津村
Shingo Hashimoto
新吾 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP17392790A priority Critical patent/JP2832074B2/en
Publication of JPH0462737A publication Critical patent/JPH0462737A/en
Application granted granted Critical
Publication of JP2832074B2 publication Critical patent/JP2832074B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To improve yield by carrying out a process of heating a lead and a case between a process of inserting a soluble alloy with a lead welded into a case, and a process of applying a sealing resin on the opening end of the case. CONSTITUTION:A lead 2 held by a heating chuck 12 is heated by the chuck 12 to a temperature higher than the melting temperature of a soluble alloy 3, on both sides of the soluble alloys 3 held by a chuck 11, and then, each chuck 12 is brought close to one another, so as to press the front end of the lead 2 held by the chuck to both ends of the alloy 3, and to melt it thereby. After a flux is applied on the surface, the soluble alloy is inserted into a cylinder-shaped insulating case 4 held by a chuck 13, and is held by a chuck 14 in such a way that the alloy 3 is situated in the middle of the case 4. Warm air is blasted to these, which are heated to the temperature of 70-80 degrees, while the case 4 is sufficiently heated, and when a sealing resin 5 for which double-fluid epoxy resin is kneaded, is applied to its opening ends, it is ensured that the opening end is sealed, and when the resin 5 is hardened at a room temperature, a temperature fuse 1 is completed. The defective appearance or incomplete sealing can thus be prevented accurately.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、過熱時に回路を遮断し・て機器等の保護を行
う温度ヒユーズの製造方法に間する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a temperature fuse that protects equipment by cutting off a circuit when overheated.

〔従来の技術〕[Conventional technology]

温度ヒユーズ1は、第2図に示すように、向かい合った
2本のり一ト線2,2間に可溶合金3を溶接した可溶合
金タイプのものかある。この可溶合金3;よ、筒状のセ
ラミックス等からなる絶縁ケース4内に挿入されている
。そし・て、絶縁ケース4の両開口端をエポキシ樹脂等
からなる封口樹脂δ、5ζこよって圭」化する二と;こ
より、リート線2゜2のみを二の封口樹脂5.5から突
出させて、可溶合金3を内部に密封している。二のよう
な構造の温度ヒユーズ1は、設定された温度以上の高温
に曝された場合に、可溶合金3が溶融してリート線2.
2間を切り離すことにより回路を遮断する二とかできる
As shown in FIG. 2, the temperature fuse 1 is of a fusible alloy type, in which a fusible alloy 3 is welded between two facing single-tooth wires 2, 2. This fusible alloy 3 is inserted into a cylindrical insulating case 4 made of ceramics or the like. Then, both open ends of the insulating case 4 are sealed with sealing resins δ and 5ζ made of epoxy resin, etc., so that only the wire wire 2°2 protrudes from the second sealing resin 5.5. The fusible alloy 3 is sealed inside. When the temperature fuse 1 having the structure shown in 2 is exposed to a high temperature higher than a set temperature, the fusible alloy 3 melts and the Riet wire 2.
By separating the two, it is possible to break the circuit.

上記温度ヒユーズ1の製造方法を第3図に基ついて説明
する。まず、同図(イ)に示すように、可溶合金3の両
側:こ2本のり−ト線2.2を向かい合わせて配置する
。次に、このり−ト線2.2を加熱しつつ互いに接近さ
せて、先端を可溶合金3に押圧する。すると、同図(ロ
)に示すように、可溶合金3の両端部が溶融してリート
線2.2に溶接される。二のようにして可溶合金3にリ
ート線2,2が溶接されると、この可溶合金3の表面;
こフラックスを塗布してから、同図(ハ);こ示すよう
:こ、筒状の絶縁ケース4内に挿入する。そして、二の
絶縁ケース4の両開口端部にエポキシ樹脂等からなる封
口樹脂5を塗布しこれを硬化させれ;ま、前記第2図に
示した温度ヒユーズ1か完成ずろ。
A method of manufacturing the temperature fuse 1 will be explained with reference to FIG. First, as shown in FIG. 3A, the two grate wires 2.2 on both sides of the fusible alloy 3 are placed facing each other. Next, the wires 2.2 are brought close to each other while being heated, and their tips are pressed against the fusible alloy 3. Then, as shown in FIG. 2B, both ends of the fusible alloy 3 are melted and welded to the Riet wire 2.2. When the Riet wires 2, 2 are welded to the fusible alloy 3 as in step 2, the surface of the fusible alloy 3;
After applying this flux, insert it into the cylindrical insulating case 4 as shown in the same figure (c). Then, apply a sealing resin 5 made of epoxy resin or the like to both open ends of the second insulating case 4 and harden it; the temperature fuse 1 shown in FIG. 2 is now complete.

たたし、上記のよう;こ利口樹脂5を塗布したたけて;
よ、この封口樹脂5の粘度か高くり−1・線2や絶縁ケ
ース4;こ充分:こ馴染まないために、第4図に示すよ
う;こ、内部を完全に密封できない場合が生12る。ま
た、エポキシ樹脂からなる封口樹脂5は、経時的に、ま
た、温度等によっても粘度が変化するため、ある程度管
理された環境で製造を行っても夏冬の温度差や湿度等の
相違により、硬化し・た際の仕上がり状態に差が生しる
ことになる。
Then, apply the resin 5 as described above;
If the viscosity of the sealing resin 5 is too high, the wires 2 and the insulating case 4 may not be fully absorbed, as shown in Figure 4. . In addition, the viscosity of the sealing resin 5 made of epoxy resin changes over time and depending on temperature, etc., so even if it is manufactured in a somewhat controlled environment, it may change due to differences in temperature and humidity between summer and winter. There will be a difference in the finished state when it is cured.

そこで従来は、封口樹脂5の塗布後に、例えは温風を吹
き付けて80°C〜130°C程度の温度に加熱し・、
この封口樹脂5の粘度を低下させることによりリート線
2や絶縁ケース4に馴染ませるための加熱工程を施して
いた。
Conventionally, after the sealing resin 5 is applied, it is heated to a temperature of about 80°C to 130°C, for example by blowing hot air.
A heating process was performed to reduce the viscosity of the sealing resin 5 and make it fit into the Riet wire 2 and the insulating case 4.

〔発明か解決しようとする課題〕[Invention or problem to be solved]

と二ろか、上記のよう;こ封口樹脂5の塗布後に加熱を
行うと、これ;こよって封口樹脂5内部の気泡か膨張を
起こす二と2二なる。そして、ある程度硬1ヒして粘度
か高くなったときここ表面付近のス准か膨張によって破
裂すると、第5図:こ不すよう:こ、封口樹脂5の表面
:こ穴5aか開いたまま:こなり、製品の外観不良とな
る。特;こ2液温合タイプのエポキシ樹脂を使用した場
合に二のような気泡か混入し易く、外観不良も多くなる
。また、上記加熱を1テうと、封口樹脂5内部の空気か
膨張し、第6図;こ示すように、この封口樹脂5か外側
:こ押されることになる。そして、このために封口樹脂
5の肉厚か薄くなると、上記気泡を通して貫通孔5bが
生しるおそれがあり、このような場合には製品が密封不
良となる。二のため、上記従来の製造方法では、温度ヒ
ユーズ1の製造の際の歩留りが悪くなろという問題点か
生していた。
In addition, as described above, when heating is performed after coating the sealing resin 5, this causes the bubbles inside the sealing resin 5 to expand. Then, when it hardens to a certain extent and the viscosity increases, the hole 5a near the surface will rupture due to expansion. : It becomes dull and the appearance of the product becomes defective. Particularly, when using this two-component heating type epoxy resin, air bubbles like the one shown in Fig. 2 are likely to be mixed in, and there will be many defects in appearance. Further, when the above-mentioned heating is continued once, the air inside the sealing resin 5 expands, and as shown in FIG. 6, the sealing resin 5 is pushed outward. For this reason, if the thickness of the sealing resin 5 becomes thin, there is a risk that a through hole 5b will be formed through the air bubbles, and in such a case, the product will be poorly sealed. For this reason, the above-mentioned conventional manufacturing method has had the problem of poor yield when manufacturing the temperature fuse 1.

〔課題を解決するための手段〕[Means to solve the problem]

上記問題を解決するために、本発明は、リート線;こ溶
接された可溶合金をケース内;こ挿入すると共:こ、二
のケースの開口端:こ封口樹脂を塗布して硬化させろこ
とにより内部を封止する温度ヒユーズの製造方法におい
て、リート線か溶接された可溶合金をケース内に挿入す
る工程と二のケースの開一端二二月口樹脂を塗布する工
程との間に、リート線とケースとを加熱する工程を設け
たことを特徴とし・ている。
In order to solve the above problems, the present invention involves inserting a welded fusible alloy into the case, applying a sealing resin to the open end of the case, and hardening it. In the method for manufacturing a temperature fuse that seals the inside with It is characterized by a step of heating the Riet wire and the case.

〔作 用〕[For production]

上記構成ここより、リート線を溶接された可溶合金がケ
ース内:こ挿入され、これらリート線とケースとか加熱
されてから、二のケースの開口端に封口樹脂か塗布され
る。すると、封口樹脂は、加熱されたリート線とケース
に接触した部分が熱を受けて粘度を低下させる。このた
め、封口樹脂のり−ト線やケースへの濡れ性が高くなり
よく馴染むようになるので、従来のように封口樹脂の塗
布後に加熱を行う必要がなくなる。し・かも、封口樹脂
:ま、塗布時乙こ部分的に熱せられるたけて塗布後に加
熱が行われないため、内部に混入された気泡か膨張して
破裂したり、ケース内の空気か膨張して二の封口樹脂を
外側:こ押し出すようなことがなくなる。
From this point on, the fusible alloy with the Riet wire welded to it is inserted into the case, the Riet wire and the case are heated, and then a sealing resin is applied to the open end of the second case. Then, the portion of the sealing resin that is in contact with the heated Riet wire and the case receives heat and reduces its viscosity. For this reason, the sealing resin has a high wettability to the glue wire and the case, and is well adapted to the sealing resin, so there is no need to heat the sealing resin after applying it as in the conventional case. Moreover, since the sealing resin is partially heated during application and is not heated after application, air bubbles mixed inside may expand and burst, or air inside the case may expand. There is no need to push out the second sealing resin to the outside.

〔実施例〕〔Example〕

以下、図面を参照しなから、本発明の実施例を詳述する
Embodiments of the present invention will be described in detail below with reference to the drawings.

第1図(イ)〜(ニ)は本発明の一実施例を示すもので
あって、それぞれ温度ヒユーズの製造方法の各工程を示
す縦断面図である。なお、第2図及び第3図乃至第6図
に示した温度ヒユーズと同様の機能を有する構成部材に
は同し番号を付記する。
FIGS. 1(A) to 1(D) show one embodiment of the present invention, and are longitudinal cross-sectional views showing each step of a method for manufacturing a temperature fuse. Components having the same functions as the temperature fuses shown in FIGS. 2 and 3 to 6 are given the same numbers.

本実施例の温度ヒユーズの製造方法は、まず第1図(イ
)に示すよう:こ、適当な長さに切断されチャック11
て保持された可溶合金3の両側に、これも適当な長さ:
こ切断され加熱チャック12゜12に保持されたり一ト
線2,2を配置する。二の際、リート線2,2は、加熱
チャック12.12によって可溶合金3の溶融温度より
も高い温度に加熱される。次に、加熱チャック12.1
2を互いに接近するよう;こ移動させる二とここより、
(呆持したり一ト線2,2の先端をそれぞれ可溶合金3
の両端に押圧させる。すると、同図(ロ);こ示すよう
;こ、可溶合金3のり−)・線2,2ここ押圧された部
分が溶融し、二のり一ト線2−12間:こ溶接される二
とになる。
The method for manufacturing the temperature fuse of this embodiment is as shown in FIG.
On both sides of the fusible alloy 3 held in place, also a suitable length:
This is cut and held in a heating chuck 12° 12, and a tow wire 2, 2 is placed thereon. At the second time, the Riet wires 2, 2 are heated by the heating chuck 12.12 to a temperature higher than the melting temperature of the fusible alloy 3. Next, the heating chuck 12.1
Move 2 closer to each other; from here,
(Hold the tips of the wires 2 and 2 with the fusible alloy 3
Press it on both ends. Then, as shown in Figure (b); here, the pressed part of the fusible alloy 3 glue -) wires 2 and 2 melts, and the two welded It becomes.

二のようにして、可溶合金3がリート線2,2二二溶接
されろと、この可溶合金3の表面;こフラックスを塗布
してから、同図(ハ)!こ示すように、チャック13;
こ保持された筒状の絶縁ケース4内;こ挿入し、チャッ
ク14ここよって可溶合金3か絶縁ケース4内の中央こ
こ位置するように保持する。
As shown in Figure 2, the fusible alloy 3 is welded to the Riet wires 2, 2, 2 and 2 by applying flux to the surface of the fusible alloy 3. As shown, the chuck 13;
This is inserted into the cylindrical insulating case 4 in which it is held, and the chuck 14 is used to hold the fusible alloy 3 so that it is located at the center of the insulating case 4.

この絶縁ケース4は、絶縁性と耐熱性を有するセラミッ
クス等からなる。また、このようミニして可溶合金3が
溶接されたり一ト線2,2と絶縁ケース4とが保持され
ると、これらに例えは温風Aを吹き付ける二とにより、
70°C〜80°C程度の温度に加熱する。可溶合金3
は、通常は融点が80°Cより高い温度となるので、二
のリート線2.2と絶縁ケース4の加熱によって溶融す
るおそれ:よない。
This insulating case 4 is made of ceramics or the like having insulating properties and heat resistance. In addition, when the fusible alloy 3 is welded in this way, or when the tow wires 2, 2 and the insulating case 4 are held, for example, by blowing hot air A onto them,
Heat to a temperature of about 70°C to 80°C. Fusible alloy 3
Usually has a melting point higher than 80°C, so there is a risk that the second Riet wire 2.2 and the insulating case 4 will melt due to heating.

上言己のよう;こしてリート線2.2や絶縁ケース4か
充分:こ加熱されると、同図(ニ):こ示すように、二
の絶縁ケースJの開口両端:こ2液性のエポキン樹脂を
混練した封口樹脂δを塗布する。すると、二の圭10樹
■旨5のリート線2,2や絶縁ケースJに接触した部分
力)適度な熱を受けて精度か低下する。二のため、圭1
0樹脂5;ま、これらリート線2.2や絶縁ケース1へ
の濡れ性か高くなり、よく馴染むようになるので、図示
のように開口端を確実に封止する二とかできる。そして
、常温で二の封口@詣5を硬jヒさせれは、前記第2図
;こ示した温度ヒユーズ1が完成する。
As I said above, when the Riet wire 2.2 and the insulating case 4 are sufficiently heated, the same figure (d): As shown in this figure, both opening ends of the second insulating case J: This two liquid Apply a sealing resin δ prepared by kneading Epoquin resin. Then, the precision will decrease due to moderate heat (partial force in contact with the Riet wires 2, 2 and the insulating case J). For two, Kei 1
0 Resin 5: Well, since the wettability to these wires 2.2 and the insulating case 1 becomes high and they blend well, the open end can be reliably sealed as shown in the figure. Then, by hardening the second seal 5 at room temperature, the temperature fuse 1 shown in FIG. 2 is completed.

以上説明し・た本実施例の製造方法によれは、圭J口樹
脂5が塗布の際に部分的に熱せられるたけなので、塗布
後に加熱されて封口樹脂5内部の電池が膨張したり絶縁
ケース4内の空気が膨張するようなことがなくなる。従
って、封口樹脂5の硬化の際に表面付近の気泡が破裂し
て六が開き製品か外観不良になったり、この封口樹脂5
が絶縁ケース4内の空気に押されて肉厚が薄くなり貫通
孔が開いて密封不良を生しるような二とがなくなる。
The problem with the manufacturing method of this embodiment explained above is that the resin 5 is only partially heated during coating, so the battery inside the sealing resin 5 may expand due to heating after coating, and the insulation case may be heated. This prevents the air inside 4 from expanding. Therefore, when the sealing resin 5 hardens, the air bubbles near the surface may burst and open, resulting in poor appearance of the product or the sealing resin 5.
is pushed by the air inside the insulating case 4, the wall thickness becomes thinner, a through hole opens, and there is no possibility of sealing failure.

上記実施例による製造方法と従来の製造方法と:こより
実際に温度ヒユーズ1を製造し・た結果、従来の方法で
は、製品の外観不良やi!封不良か0゜5%程度発生し
たのに対して、本実施例の方法によれは、これらの不良
を0.2%まで低減する二とかできた。
The manufacturing method according to the above embodiment and the conventional manufacturing method: As a result of actually manufacturing the temperature fuse 1, it was found that the conventional method caused poor appearance of the product and i! While sealing defects occurred in about 0.5%, the method of this embodiment was able to reduce these defects to 0.2%.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明かなようここ、本発明によれば、封口
樹脂を塗布する前にリート線やケースか加熱されるので
、この封口樹脂かり一ト線やケースによく馴染み、塗布
後の加熱を行わなくても確実に内部を封止することがで
きるようになる。し・かも、封口樹脂は、リート線やケ
ースに接触し・た部分のみが熱せられるので、内部に混
入された気泡が膨張して破裂したり、ケース内の空気か
#張してこの封口樹脂を外側に押し出し貫通孔が開くよ
うなことがなくなる。
As is clear from the above description, according to the present invention, the Riet wire and the case are heated before the sealing resin is applied, so that the sealing resin is well adapted to the wire and the case, and heating after application is prevented. Even if this is not done, the interior can be reliably sealed. Moreover, the sealing resin heats only the parts that come into contact with the wire and the case, so the air bubbles mixed inside may expand and burst, or the air inside the case may expand and cause the sealing resin to heat up. This eliminates the possibility of pushing out the through hole and opening the through hole.

従って、本発明の温度ヒユーズの製造方法は、封口樹脂
によってケース内部を安定して宝封すると共:こ、二の
封口樹脂の外観不良や密封不良を確実ここ防止する二と
かできろという効果を奏する。
Therefore, the method for manufacturing a temperature fuse of the present invention not only stably seals the inside of the case with the sealing resin, but also has the following effects: play.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(イ)〜(ニ)は本発明の一実施例を示すもので
あって、それぞれ温度ヒユーズの製造方法の各工程を示
す縦断面図である。第2図は温度ヒユーズの構造を示す
縦断面図である。第3図乃至第6図は従来例を示すもの
であって、第3図(イ)〜(ハ);よそれぞれ温度ヒユ
ーズの製造方法の各工程を示す縦断面図、第4図は利口
樹脂の塗布後の状態を示す温度ヒユーズの縦断面図、第
5図;ま封口樹脂;こ穴か開いたために外観不良となっ
た温度ヒユーズの部分縦断面図、第6図は月日樹脂:こ
貫通孔が開いたために密封不良となった温度ヒユーズの
部分縦断面図である。 1・・・温度ヒユーズ、 2・・・リート線、 3・・・可溶合金、 4・・・絶縁ケース(ケース)、 5・・・圭J口相脂。 特 許 出 願 人 関西日本電気株式会社 第4図 今 M5図
FIGS. 1(A) to 1(D) show one embodiment of the present invention, and are longitudinal cross-sectional views showing each step of a method for manufacturing a temperature fuse. FIG. 2 is a longitudinal sectional view showing the structure of the temperature fuse. 3 to 6 show conventional examples, and FIGS. 3(a) to 3(c) are vertical cross-sectional views showing each step of the method for manufacturing a temperature fuse, respectively, and FIG. 4 is a clever resin resin. Fig. 5 is a vertical cross-sectional view of the temperature fuse showing the state after application of the sealing resin; FIG. 2 is a partial vertical cross-sectional view of a thermal fuse that has failed in sealing due to an open through hole. 1...Temperature fuse, 2...Leet wire, 3...Fusible alloy, 4...Insulation case (case), 5...Kei J mouth fat. Patent applicant Kansai NEC Co., Ltd. Figure 4 Now M5

Claims (1)

【特許請求の範囲】[Claims] (1)リード線に溶接された可溶合金をケース内に挿入
すると共に、このケースの開口端に封口樹脂を塗布して
硬化させろことにより内部を封止する温度ヒューズの製
造方法において、 リード線に溶接された可溶合金をケース内に挿入する工
程とこのケースの間口端に封口樹脂を塗布する工程との
間に、リード線とケースとを加熱する工程を設けたこと
を特徴とする温度ヒューズの製造方法。
(1) A method for manufacturing a thermal fuse in which a fusible alloy welded to a lead wire is inserted into a case, and a sealing resin is applied to the open end of the case and cured to seal the inside. A process of heating the lead wire and the case is provided between the process of inserting the fusible alloy welded to the case into the case and the process of applying sealing resin to the front end of the case. Method of manufacturing fuses.
JP17392790A 1990-06-29 1990-06-29 Thermal fuse manufacturing method Expired - Lifetime JP2832074B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17392790A JP2832074B2 (en) 1990-06-29 1990-06-29 Thermal fuse manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17392790A JP2832074B2 (en) 1990-06-29 1990-06-29 Thermal fuse manufacturing method

Publications (2)

Publication Number Publication Date
JPH0462737A true JPH0462737A (en) 1992-02-27
JP2832074B2 JP2832074B2 (en) 1998-12-02

Family

ID=15969655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17392790A Expired - Lifetime JP2832074B2 (en) 1990-06-29 1990-06-29 Thermal fuse manufacturing method

Country Status (1)

Country Link
JP (1) JP2832074B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7884698B2 (en) * 2003-05-08 2011-02-08 Panasonic Corporation Electronic component, and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7884698B2 (en) * 2003-05-08 2011-02-08 Panasonic Corporation Electronic component, and method for manufacturing the same

Also Published As

Publication number Publication date
JP2832074B2 (en) 1998-12-02

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