JPH0462119A - Preparation of resin molding with electrically conductive layer - Google Patents
Preparation of resin molding with electrically conductive layerInfo
- Publication number
- JPH0462119A JPH0462119A JP16579190A JP16579190A JPH0462119A JP H0462119 A JPH0462119 A JP H0462119A JP 16579190 A JP16579190 A JP 16579190A JP 16579190 A JP16579190 A JP 16579190A JP H0462119 A JPH0462119 A JP H0462119A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- projection
- cavity
- conductive layer
- aluminum foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 52
- 239000011347 resin Substances 0.000 title claims abstract description 52
- 238000000465 moulding Methods 0.000 title abstract description 12
- 238000002360 preparation method Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 15
- 239000011888 foil Substances 0.000 abstract description 14
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 abstract description 8
- 238000001746 injection moulding Methods 0.000 abstract description 3
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 241000345998 Calamus manan Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000012950 rattan cane Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14983—Bursting or breakthrough of the insert by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、片面に導電層が一体に設けられ、かつその面
にボス等の立体的な突起が形成されている樹脂成形体の
製造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for manufacturing a resin molded article having a conductive layer integrally provided on one side and three-dimensional protrusions such as bosses formed on that side. It is related to.
樹脂成形体をモールド成形する際に、金型内に導電性フ
ィルムをセットして、樹脂のモールド成形時に樹脂成形
体と導電性フィルムを一体化させる方法がある。この場
合、樹脂成形体の導電性フィルム側の面にボス等の立体
的な突起が必要なときは、導電性フィルムの突起相当箇
所に小径の貫通孔を形成しておき、この貫通孔を通して
導電性フィルムの裏面に樹脂を流入させ、ボス等の立体
的な突起を成形することが提案されている （特願平１
−３２４２５１号）。When molding a resin molding, there is a method in which a conductive film is set in a mold and the resin molding and the conductive film are integrated during resin molding. In this case, if a three-dimensional protrusion such as a boss is required on the conductive film side of the resin molding, a small-diameter through hole is formed at the location corresponding to the protrusion on the conductive film, and the conductive film is passed through the through hole. It has been proposed to form three-dimensional protrusions such as bosses by flowing resin into the back side of the adhesive film (Patent Application No. 1999).
-324251).
しかし上舵の方法では、導電性フィルムの突起相当箇所
に小径の貫通孔を形成する工程が必要であり、手間がか
かるばかりでなく、この導電性フィルムを金型内面にセ
ットするときに、小径貫通孔を金型の突起形成凹部に合
致させるための位置決め作業が必要となり、作業が面倒
になるという問題がある。However, Ujidashi's method requires the process of forming small-diameter through-holes at locations corresponding to the protrusions of the conductive film, which is not only time-consuming, but also involves the process of forming small-diameter through-holes when setting the conductive film on the inner surface of the mold. There is a problem in that positioning work is required to match the through hole with the protrusion forming recess of the mold, making the work cumbersome.
本発明は、上記の課題を解決した導電層付き樹脂成形体
の製造方法を提供するもので、その構成は、一方の金型
がキャビティ内面に所望形状の突起形成凹部を有する一
対の金型を用い、前記一方の金型のキャビティ内面に突
起形成凹部を覆うように導電性フィルムをセットし、一
対の金型を閉した後、キャビティ内に溶融樹脂を充填し
て樹脂成形体を形成し、かつそのときの樹脂圧力で突起
形成凹部に位置する導電性フィルムを破り、突起形成凹
部に樹脂を流入させて樹脂成形体と一体に突起を形成す
ると同時に、樹脂成形体と導電性フィルムとを一体化さ
せることを特徴とするものである。The present invention provides a method for manufacturing a resin molded body with a conductive layer that solves the above-mentioned problems, and is comprised of a pair of molds, one of which has a protrusion-forming recess of a desired shape on the inner surface of the cavity. a conductive film is set on the inner surface of the cavity of the one mold so as to cover the protrusion forming recess, and after closing the pair of molds, the cavity is filled with molten resin to form a resin molded body, At that time, the resin pressure breaks the conductive film located in the protrusion forming recess, and the resin flows into the protrusion forming recess to form the protrusion integrally with the resin molded body, and at the same time, the resin molded body and the conductive film are integrated. It is characterized by causing
本発明では上記のようにキャビティ内に溶融樹脂を充填
するとき、その樹脂圧力により導電性フィルムを破り、
突起を形成するようにしたので、導電性フィルムに予め
小径貫通孔を形成しておく必要がなくなる。In the present invention, when filling the cavity with molten resin as described above, the conductive film is broken by the pressure of the resin,
Since the protrusions are formed, there is no need to previously form small-diameter through holes in the conductive film.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
図−１および図−２は、本発明の一実施例を示している
。FIG. 1 and FIG. 2 show an embodiment of the present invention.
ここで用いる一対の金型１１ａ、ｌｌｂは、一方の金型
１１ａがキャビティ内面１３ａに所望形状の突起形成凹
部１５を有し、他方の金型１１ｂが樹脂注入孔１９を有
するものである。まず、金型１１ａ、ｌｌｂを開いた状
態で、一方の金型のキャビティ内面１３ａに、突起形成
凹部１５を覆うように厚さ２００μｍのアルミ箔１７を
セットする。その後金型１１ａ、ｌｌｂを閉し、キャビ
ティ内に樹脂注入孔１９から溶融されたＡＢＳ樹脂（ア
クリルニトリル−ブタジェン−スチレン共重合体）を２
５０ｋＪ／′−の圧力で注入し、射出成形する。この圧
力で射出成形すると、突起形成凹部１５の入口のアルミ
箔１７はＡＢＳ樹脂の圧力によって破られ、その破られ
た所を通ってＡＢＳ樹脂が突起形成凹部１５に流入する
ため、図２（ｂ）に示すように樹脂成形体２０と一体に
突起２１を形成することができる。アルミ箔１７の破れ
片１７ａは突起２１の中に埋め込まれた状態となる。ま
たアルミ箔１７は樹脂成形体２０と一体となり、図−２
のような導電層付き樹脂成形体２３を得ることができる
。In the pair of molds 11a and llb used here, one mold 11a has a protrusion forming recess 15 of a desired shape on the cavity inner surface 13a, and the other mold 11b has a resin injection hole 19. First, with the molds 11a and llb open, aluminum foil 17 with a thickness of 200 μm is set on the inner surface 13a of the cavity of one of the molds so as to cover the projection forming recess 15. After that, the molds 11a and llb are closed, and molten ABS resin (acrylonitrile-butadiene-styrene copolymer) is poured into the cavity through the resin injection hole 19.
It is injected and injection molded at a pressure of 50 kJ/'-. When injection molding is carried out under this pressure, the aluminum foil 17 at the entrance of the protrusion forming recess 15 is broken by the pressure of the ABS resin, and the ABS resin flows into the protrusion forming recess 15 through the broken part. ), the protrusion 21 can be formed integrally with the resin molded body 20. The torn piece 17a of the aluminum foil 17 is embedded in the protrusion 21. In addition, the aluminum foil 17 is integrated with the resin molded body 20, and
A resin molded body 23 with a conductive layer can be obtained.
図−３および図−４は本発明の他の実施例を示している
。3 and 4 show other embodiments of the present invention.
この実施例は一方の金型１１ａの突起形成凹部１５の中
央に、先端のとがつた丸ビン２５を形成した点が前記実
施例と異なっている。前記実施例と同様の手順・方法に
よって溶融された樹脂を射出成形すると、アルミ箔１７
はまず丸ビン２５の先端によって破られ、その後破れが
拡大し、その破られた所を通って樹脂が突起形成凹部１
５内に侵入し、図−４山）に示すような突起２１が形成
される。この場合は突起２１内にビン穴２７ができるが
、それ以外は前記実施例と同じである。This embodiment differs from the previous embodiment in that a round bottle 25 with a sharp tip is formed in the center of the protrusion forming recess 15 of one of the molds 11a. When the molten resin is injection molded by the same procedure and method as in the above embodiment, aluminum foil 17 is formed.
is first broken by the tip of the round bottle 25, and then the break expands, and the resin passes through the broken part and enters the protrusion-forming recess 1.
5, and a protrusion 21 as shown in Fig. 4 (mountain 4) is formed. In this case, a bottle hole 27 is formed in the protrusion 21, but other than that, it is the same as the previous embodiment.
この実施例によると、アルミ箔１７の破れ始める所が一
箇所となり、破れた後の状態が一様になる。According to this embodiment, the aluminum foil 17 begins to tear at only one place, and the state after tearing becomes uniform.
図−５および図−６は本発明のさらに他の実施例を示し
ている。5 and 6 show still other embodiments of the present invention.
この実施例は、金型１１ｂ側のキャビティ内面Ｉ３ｂの
、突起形成凹部１５の中心に対向する位置に、先端がプ
ラスドライバーのような形をした十字ビン２９を形成し
たものである。In this embodiment, a cross pin 29 whose tip is shaped like a Phillips screwdriver is formed on the inner surface I3b of the cavity on the side of the mold 11b at a position facing the center of the protrusion forming recess 15.
このような金型１１ａ、ｌｌｂを使用すると、一対の金
型１１ａ、ｌｌｂを閉じたときに、アルミ箔１７が十字
ビン２９によって破られる。その破られた所を樹脂が遺
り、破れが拡大されて図−６（ｂ）に示すような突起２
１が形成される。アルミ箔１７の破れ片１７ａは突起２
１の根元外周に密着した状態となる。この場合は樹脂成
形体２０側に十字ビン穴３１ができる。When such molds 11a and llb are used, the aluminum foil 17 is torn by the cross pin 29 when the pair of molds 11a and llb are closed. Resin remains in the broken area, and the break is enlarged to form a protrusion 2 as shown in Figure 6(b).
1 is formed. The torn piece 17a of the aluminum foil 17 is the protrusion 2
It is in close contact with the outer periphery of the root of 1. In this case, a cross bottle hole 31 is formed on the resin molded body 20 side.
この実施例では金型１１ｂのキャビティ内面１３ｂの所
定位置に十字ビン２９を形成したが、十字ビン２９の代
わりに丸ビンを使用することもできる。In this embodiment, a cross bottle 29 is formed at a predetermined position on the inner surface 13b of the cavity of the mold 11b, but a round bottle may be used instead of the cross bottle 29.
また図−３で説明した実施例においても、丸ビン２５の
代わりに十字ビンを使用することもできる。Also in the embodiment described in FIG. 3, a cross-shaped bottle can be used instead of the round bottle 25.
なお本発明に用いられる導電性フィルムの材質は、アル
ミに限定されるものではなく、銅、鉄、ニッケル、ステ
ンレス等の金属を使用することができる。また、これら
の導電性基材の表面に金属メツキが施されているもので
も、導電性基材の表面にＰＥＴ （ポリエチレンテレフ
タレート）等の高分子フィルムがラミネートされている
ものでも良い、さらに、銀や銅の導電性徴粉末が有機バ
インダー中に分散された導電性ペーストを、高分子フィ
ルム上に印刷して導電性フィルムとしたものでも良く、
高分子フィルム上に藤着やスパツタリング等で金属のＦ
ｉｌ膜層を設けたものでも良い。Note that the material of the conductive film used in the present invention is not limited to aluminum, and metals such as copper, iron, nickel, and stainless steel can be used. Furthermore, the surface of these conductive base materials may be plated with metal, or the surface of the conductive base material may be laminated with a polymer film such as PET (polyethylene terephthalate). A conductive paste in which a conductive powder of copper or copper is dispersed in an organic binder may be printed on a polymer film to form a conductive film.
Metal F is coated on a polymer film using rattan, sputtering, etc.
A structure provided with an il film layer may also be used.
その厚さは樹脂圧力で破れる厚さで、３００μｍ以下の
ものであれば使用可能である。The thickness is such that it can be torn by resin pressure, and it can be used as long as it is 300 μm or less.
また成形用の樹脂はＡＢＳ樹脂に限定されるものではな
く、筐体に要求される品質に応じてＰＯＭ（ポリオキシ
メチレン） 、ＰＡ （ナイロン）、ＰＰ（ポリプロピ
レン）、ＰＰ５（ポリフェニレンサルファイド）、ＰＣ
（ポリカーボネート）等の熱可塑性樹脂や、フェノール
樹脂、エポキシ樹脂、不飽和ポリエステル樹脂等の熱硬
化性樹脂も適宜選択使用することができる。In addition, the resin for molding is not limited to ABS resin, but depending on the quality required for the casing, POM (polyoxymethylene), PA (nylon), PP (polypropylene), PP5 (polyphenylene sulfide), PC
Thermoplastic resins such as (polycarbonate) and thermosetting resins such as phenol resins, epoxy resins, and unsaturated polyester resins can also be appropriately selected and used.
さらに成形法も射出成形に限定されるものではなくトラ
ンスファー成形、真空注型等も適用可能である。Further, the molding method is not limited to injection molding, and transfer molding, vacuum casting, etc. are also applicable.
以上説明したように本発明は、導電層付き樹脂成形体を
製造する際に、金型のキャビティ内に溶融樹脂を充填す
るとき、その樹脂圧力により導電性フィルムを破って突
起を形成するようにしたので、導電性フィルムに予め小
径貫通孔を形成しておく必要がなくなり、また導電性フ
ィルムのキャビテイ面へのセットも極めて容易になる。As explained above, the present invention has a method in which when a molten resin is filled into a cavity of a mold when manufacturing a resin molded article with a conductive layer, the pressure of the resin breaks the conductive film to form protrusions. Therefore, there is no need to previously form small-diameter through holes in the conductive film, and setting of the conductive film on the cavity surface becomes extremely easy.
したがって突起の付いた導電層付き樹脂成形体を効率よ
く、低コストで製造できる効果がある。Therefore, there is an effect that a resin molded body with a conductive layer provided with projections can be manufactured efficiently and at low cost.
図−１は本発明に係る導電層付き樹脂成形体の製造方法
の一実施例で使用した金型の断面図、図−２ｆａｔ（ｂ
）はそれによつて製造された導電層付き樹脂成形体の正
面図および断面図、図−３は本発明の他の実施例で使用
した金型の断面図、図−４（ａ）（ｂｌはそれによって
製造された導電層付き樹脂成形体の正面図および断面図
、図−５（ａ）は本発明のさらに他の実施例で使用した
金型の断面図、同図［ｂ）は（ａ＋の■−ｖ線における
断面図、図−６（ａ）〜）はそれによって製造された導
電層付き樹脂成形体の正面図および断面図である。
１１ａ、 ｌｌｂ ニ一対の金型
１３ａ、１３ｂ ：キャビティ内面
１５：突起形成凹部
１７：アルミ箔
１７ａ；アルミ箔の破れ片
１９ ： ４１脂注入孔
２０；樹脂成形体
２１：突起
２３；導電層付き樹脂成形体
２５：丸ビン
２７：丸ビン穴
２９：十字ビン
３１：十字ビン大
図−
図−２
（ａ）
（ｂ）
図−３
図−４
（ａ）
（ｂ）
手続補正書（自発）
平成３年 ３月２９日Figure 1 is a sectional view of a mold used in an embodiment of the method for manufacturing a resin molded body with a conductive layer according to the present invention, and Figure 2
) is a front view and a sectional view of a resin molded body with a conductive layer manufactured thereby, FIG. 3 is a sectional view of a mold used in another example of the present invention, and FIG. 4(a) (bl is A front view and a sectional view of the resin molded body with a conductive layer manufactured thereby, FIG. Figures 6(a) to 6(a) are a front view and a sectional view of a resin molded body with a conductive layer manufactured thereby. 11a, llb Pair of molds 13a, 13b: Cavity inner surface 15: Protrusion forming recess 17: Aluminum foil 17a; Torn piece of aluminum foil 19: 41 fat injection hole 20; Resin molded body 21: Protrusion 23; Resin with conductive layer Molded body 25: Round bottle 27: Round bottle hole 29: Cross bottle 31: Cross bottle large diagram - Figure 2 (a) (b) Figure 3 Figure 4 (a) (b) Procedural amendment (voluntary) Heisei March 29, 3rd year
Claims (1)
を有する一対の金型を用い、前記一方の金型のキャビテ
ィ内面に突起形成凹部を覆うように導電性フィルムをセ
ットし、一対の金型を閉じた後、キャビティ内に溶融樹
脂を充填して樹脂成形体を形成し、かつそのときの樹脂
圧力で突起形成凹部に位置する導電性フィルムを破り、
突起形成凹部に樹脂を流入させて樹脂成形体と一体に突
起を形成すると同時に、樹脂成形体と導電性フィルムと
を一体化させることを特徴とする導電層付き樹脂成形体
の製造方法。A pair of molds is used, one of which has a protrusion-forming recess of a desired shape on the inner surface of the cavity, and a conductive film is set on the inner surface of the cavity of the one mold so as to cover the protrusion-forming recess. After closing, the cavity is filled with molten resin to form a resin molded body, and the resin pressure at that time tears the conductive film located in the protrusion forming recess.
A method for manufacturing a resin molded body with a conductive layer, characterized by flowing resin into a projection forming recess to form projections integrally with the resin molded body, and at the same time integrating the resin molded body and a conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16579190A JPH0462119A (en) | 1990-06-26 | 1990-06-26 | Preparation of resin molding with electrically conductive layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16579190A JPH0462119A (en) | 1990-06-26 | 1990-06-26 | Preparation of resin molding with electrically conductive layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0462119A true JPH0462119A (en) | 1992-02-27 |
Family
ID=15819064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16579190A Pending JPH0462119A (en) | 1990-06-26 | 1990-06-26 | Preparation of resin molding with electrically conductive layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0462119A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6103998A (en) * | 1998-06-19 | 2000-08-15 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Resin windows having electrically conductive terminals |
| WO2003097324A3 (en) * | 2002-05-15 | 2004-04-01 | Coronet Werke Gmbh | Method for the production of a bristle structure on a carrier |
| FR2877601A1 (en) * | 2004-11-10 | 2006-05-12 | Plastic Omnium Cie | Manufacturing process for thermoplastic component with electrically conducting layer, e.g. for motor vehicle, includes injection of molten plastic into mold containing aluminium foil layer with apertures |
| JP2014216627A (en) * | 2013-04-30 | 2014-11-17 | ダイキョーニシカワ株式会社 | Resin molding |
| WO2016059927A1 (en) * | 2014-10-16 | 2016-04-21 | 日本写真印刷株式会社 | Molded article, electrical component sheet, and method for manufacturing molded article and electrical product |
| JP2017126756A (en) * | 2017-01-30 | 2017-07-20 | ダイキョーニシカワ株式会社 | Resin molding |
| JP2020032554A (en) * | 2018-08-28 | 2020-03-05 | 株式会社イノアックコーポレーション | Vehicle sound absorption panel component and production method of the same |
| WO2022030220A1 (en) * | 2020-08-03 | 2022-02-10 | Ｎｉｓｓｈａ株式会社 | Conductive circuit sheet-integrated molded article and method for producing same |
-
1990
- 1990-06-26 JP JP16579190A patent/JPH0462119A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6455809B1 (en) | 1998-06-19 | 2002-09-24 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Resin windows having electrically conductive terminals |
| US6103998A (en) * | 1998-06-19 | 2000-08-15 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Resin windows having electrically conductive terminals |
| US7226555B2 (en) | 2002-05-15 | 2007-06-05 | Geka Brush Gmbh | Method for the production of a bristle structure on a carrier |
| WO2003097324A3 (en) * | 2002-05-15 | 2004-04-01 | Coronet Werke Gmbh | Method for the production of a bristle structure on a carrier |
| CN100354102C (en) * | 2002-05-15 | 2007-12-12 | 歌卡刷子有限公司 | Method for the production of a bristle structure on a carrier |
| FR2877601A1 (en) * | 2004-11-10 | 2006-05-12 | Plastic Omnium Cie | Manufacturing process for thermoplastic component with electrically conducting layer, e.g. for motor vehicle, includes injection of molten plastic into mold containing aluminium foil layer with apertures |
| EP1657045A1 (en) * | 2004-11-10 | 2006-05-17 | Compagnie Plastic Omnium | Method of manufacturing a ribbed thermoplastic part with a conductive film, and part obtained by said method |
| US7320771B2 (en) | 2004-11-10 | 2008-01-22 | Compagnie Plastic Omnium | Method of making a ribbed part out of thermoplastic material covered in a conductive foil, and a ribbed part |
| JP2014216627A (en) * | 2013-04-30 | 2014-11-17 | ダイキョーニシカワ株式会社 | Resin molding |
| WO2016059927A1 (en) * | 2014-10-16 | 2016-04-21 | 日本写真印刷株式会社 | Molded article, electrical component sheet, and method for manufacturing molded article and electrical product |
| JP2017126756A (en) * | 2017-01-30 | 2017-07-20 | ダイキョーニシカワ株式会社 | Resin molding |
| JP2020032554A (en) * | 2018-08-28 | 2020-03-05 | 株式会社イノアックコーポレーション | Vehicle sound absorption panel component and production method of the same |
| WO2022030220A1 (en) * | 2020-08-03 | 2022-02-10 | Ｎｉｓｓｈａ株式会社 | Conductive circuit sheet-integrated molded article and method for producing same |
| JP2022028547A (en) * | 2020-08-03 | 2022-02-16 | Ｎｉｓｓｈａ株式会社 | Conductive circuit sheet integrated molded product and manufacturing method of the same |
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