JPH0462066A - Lead wire connecting structure - Google Patents
Lead wire connecting structureInfo
- Publication number
- JPH0462066A JPH0462066A JP16772590A JP16772590A JPH0462066A JP H0462066 A JPH0462066 A JP H0462066A JP 16772590 A JP16772590 A JP 16772590A JP 16772590 A JP16772590 A JP 16772590A JP H0462066 A JPH0462066 A JP H0462066A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- hole
- covering
- printed board
- print plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Impact Printers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
ドツトプリンタにおけるムービングコイル型印字ヘッド
の如く、揺動する部品のリード線をプリント板に接続す
る構造に関し、
リード線とプリント板との接続部における断線防止と作
業性の向上を目的とし、
プリント板の所定箇所に被覆が付いたままのリード線を
嵌入出来るテーパー付き貫通孔を穿設し、前記貫通孔に
前記リード線を被覆ごと嵌入した状態で当該被覆を貫通
孔内に接着材で固定すると共に、前期リード線の芯線を
貫通孔裏側のパターンに半田付けしたことを特徴とする
。[Detailed Description of the Invention] [Summary] Regarding the structure for connecting the lead wire of a swinging component, such as a moving coil type print head in a dot printer, to a printed board, prevention of disconnection at the connection between the lead wire and the printed board and work In order to improve performance, a tapered through-hole is drilled in a predetermined location of the printed board into which the lead wire with the covering attached can be inserted, and the lead wire is inserted with the covering into the through-hole and the covering is removed. It is characterized in that it is fixed in the through hole with an adhesive and the core wire of the first half lead wire is soldered to the pattern on the back side of the through hole.
〔産業上の利用分野］
本発明は、ドツトプリンタにおけるムービングコイル型
印字ヘッドの如く、揺動する部品のリード線をプリント
板に接続する構造に関する。[Industrial Application Field] The present invention relates to a structure for connecting a lead wire of a swinging component, such as a moving coil print head in a dot printer, to a printed board.
本発明が適用される例えば高速印字用のラインプリンタ
には、印字ヘッドを往復移動させて印字を行う形式のシ
ャトルプリンタが用いられている。For example, a line printer for high-speed printing to which the present invention is applied uses a shuttle printer that performs printing by moving a print head back and forth.
このシャトルプリンタにはムービングコイル型印字ヘッ
ドが用いられているが、印字ヘッドのリード線が振動の
為にプリント板との接続部において断線することがあり
、対策が要望されている。This shuttle printer uses a moving coil type print head, but the lead wires of the print head may break at the connection to the printed board due to vibration, and countermeasures are required.
（従来の技術）
リード線に所定の長さを持って、先端部の被覆が剥離さ
れて芯線だけがプリント板の貫通孔に挿入され、貫通孔
裏側のパターンに半田付けで接続されている。(Prior Art) A lead wire of a predetermined length is stripped of its coating at its tip, and only the core wire is inserted into a through hole of a printed board and connected to a pattern on the back side of the through hole by soldering.
（発明が解決しようとする問題点３
以上のように印字ヘッドは往復運動して印字を行う。こ
れに伴ってリード線が振動し、芯線が波動を直接受けて
プリント板との接続部において断線する問題がある。(Problem to be Solved by the Invention 3) As described above, the print head performs printing by reciprocating.As a result, the lead wire vibrates, and the core wire receives the waves directly, causing the wire to break at the connection with the printed board. There is a problem.
本発明は、リード線のプリント板との接続部に於ける断
線防止を目的とするものである。The object of the present invention is to prevent wire breakage at the connection portion between the lead wire and the printed board.
上記問題は第１図に示す如く、プリント板１０の所定箇
所に被覆が付いたままのリード線１７を成人出来るテー
パー付き貫通孔１を穿設し、前記貫通孔１に前記リード
線１７を被覆ごと嵌入した状態で当該被覆を貫通孔１内
に接着材１３で固定すると共に、前期リード線の芯線１
５を貫通孔１裏側のパターン１１に半田付けしたことを
特徴とするリード線の接続構造を提供できる。As shown in FIG. 1, the above problem is solved by drilling a tapered through hole 1 into which the lead wire 17 can be inserted with the sheath still attached at a predetermined location of the printed board 10, and then inserting the sheath into the through hole 1. The covering is fixed in the through hole 1 with the adhesive 13 in the state where it is completely inserted, and the core wire 1 of the lead wire is
5 is soldered to the pattern 11 on the back side of the through hole 1.
〔作 用］
プリント板の貫通孔にリード線を被覆ごと挿入し、被覆
をプリント板に接着材で固定することでリード線の振動
に依る屈曲は接着した被覆の部分で受けることになる。[Function] By inserting the lead wire with its covering into the through hole of the printed board and fixing the covering to the printed board with an adhesive, the bending caused by the vibration of the lead wire will be borne by the bonded part of the covering.
そして貫通孔裏側のパターンに半田付けした芯線が波動
を直接受けなくなる。The core wire soldered to the pattern on the back side of the through hole is no longer directly exposed to wave motion.
以下、本発明に係る実施例につき説明する。 Examples according to the present invention will be described below.
第１図は揺動部品のリード線とプリント板の接続方法を
示す断面図である。１は円錐形状の貫通孔、１０はプリ
ント板、１１はパターン、１２は半田、１３は接着剤、
１４は被覆、１５は芯線、１６は円錐形状の貫通孔とリ
ード線との間隙、１７はリード線、Ｄｌはプリント板の
上面の穴径、Ｄ２は下面の穴径、ｄｌはリード線の被覆
を含む外径を示す。FIG. 1 is a sectional view showing a method of connecting a lead wire of a swinging component and a printed board. 1 is a conical through hole, 10 is a printed board, 11 is a pattern, 12 is solder, 13 is an adhesive,
14 is the coating, 15 is the core wire, 16 is the gap between the conical through hole and the lead wire, 17 is the lead wire, Dl is the hole diameter on the top surface of the printed board, D2 is the hole diameter on the bottom surface, and dl is the coating of the lead wire Indicates the outer diameter including
プリント板にテーパー付きの貫通孔１を、例えば円錐形
状の貫通孔１を所定位置に穿設する。形状の詳細はプリ
ント板の上面の穴径Ｄ１とし下面の穴径Ｄ２として、Ｄ
Ｉ＞Ｄ２となる円錐形状で、リード線の被覆を含む外径
ｄ１でｄｌ’＝Ｄ２となる円錐形状の貫通孔をプリント
板に穿設している。A tapered through hole 1, for example a conical through hole 1, is bored at a predetermined position in a printed board. The details of the shape are the hole diameter D1 on the top surface of the printed board and the hole diameter D2 on the bottom surface.D
A conical through hole with an outer diameter d1 including I>D2 and dl'=D2 is bored in the printed board.
そしてプリント板１０の円錐形状の貫通孔１に被覆１４
の付いたままのリード線１７を挿入する。Then, the conical through hole 1 of the printed board 10 is covered with a coating 14.
Insert the lead wire 17 with .
被覆１４が下面の穴径Ｄ２と同等大のためにプリント板
１０下面に突当たる。そして芯線１５をプリント板１０
下面のパターン１１に半田１２付けする。プリント板１
０上面および円錐形状の貫通孔１とリード線１７との間
隙１６に接着剤１３を塗布してリード線１７の被覆１４
とプリント板１０を接着する。Since the covering 14 is as large as the hole diameter D2 on the lower surface, it abuts against the lower surface of the printed board 10. Then, connect the core wire 15 to the printed board 10.
Solder 12 is attached to the pattern 11 on the lower surface. Printed board 1
0 upper surface and the gap 16 between the conical through hole 1 and the lead wire 17 to coat the lead wire 17 with adhesive 13.
and the printed board 10 are glued together.
以上本発明の１実施例について説明したが、第２図に本
発明の他の実施例を示す。One embodiment of the present invention has been described above, and FIG. 2 shows another embodiment of the present invention.
第２図の他の実施例につき説明するが、前記第１図の実
施例とは貫通孔の形状が異なるだけなので、かかる差異
についてだけ説明する。Another embodiment shown in FIG. 2 will be explained, but since the only difference from the embodiment shown in FIG. 1 is the shape of the through hole, only this difference will be explained.
第２図は円錐形状の貫通孔１の代わりに段付つきの貫通
孔２を用いたものである。段付つきの貫通孔２をプリン
ト板１０の所定位置に穿設する。In FIG. 2, a stepped through hole 2 is used instead of the conical through hole 1. A stepped through hole 2 is bored at a predetermined position in a printed board 10.
形状の詳細はプリント板の上面の穴径をＤＩ、プリント
板の下面の穴径をＤ２、リード線の被覆を含む外径をｄ
ｌ、リード線の芯線径をｄ２の場合、プリント板の上面
の穴径Ｄ１とリード線の被覆を含む外径ｄ１の大小関係
はＤＩ＞ｄｉである。このためプリント板の上面の穴径
Ｄｉとリード線１７の間に間隙４が形成される。リード
線の被覆を含む外径ｄ１とプリント板の下面の穴径Ｄ２
とリード線の芯線径ｄ２の大小関係はｄｉ＞Ｄ２＞ｄ２
である。このため貫通孔２の大略中間部に段部３が形成
される。そしてプリント板１０の段付つきの貫通孔２に
被覆１４の付いたままのリード線１７を挿入すると段部
３にリード線１７の被覆が突き当たる。そして芯線１５
をプリント板１０下面のパターン１１に半田１２付けす
る。プリント板１０の上面および段部３とリード線１７
との間隙４に接着剤１３を塗布してリード線１７の被覆
１４とプリント板１０を接着する。The details of the shape are: DI is the hole diameter on the top surface of the printed board, D2 is the hole diameter on the bottom surface of the printed board, and d is the outer diameter including the lead wire coating.
When the core wire diameter of the lead wire is d2, the size relationship between the hole diameter D1 on the top surface of the printed board and the outer diameter d1 including the lead wire covering is DI>di. Therefore, a gap 4 is formed between the hole diameter Di on the upper surface of the printed board and the lead wire 17. Outer diameter d1 including lead wire sheathing and hole diameter D2 on the bottom surface of the printed board
The relationship between the core wire diameter d2 of the lead wire and the lead wire is di>D2>d2.
It is. Therefore, a step portion 3 is formed approximately in the middle of the through hole 2 . When the lead wire 17 with the covering 14 still attached is inserted into the stepped through hole 2 of the printed board 10, the covering of the lead wire 17 abuts against the stepped portion 3. And core wire 15
is soldered 12 to the pattern 11 on the bottom surface of the printed board 10. The upper surface of the printed board 10, the stepped portion 3, and the lead wire 17
An adhesive 13 is applied to the gap 4 between the lead wire 17 and the printed board 10 to bond it to the sheath 14 of the lead wire 17.
本発明に依って印字ヘッドの揺動に依るリード線の振動
を被覆の部分で吸収することになり、芯線に直接に波動
が加わらず芯線のプリント板接続部における断線を防止
できる。According to the present invention, the vibration of the lead wire due to the swinging of the print head is absorbed by the covering portion, so that wave motion is not directly applied to the core wire, and breakage of the core wire at the printed board connection portion can be prevented.
またプリント板の下面の穴径Ｄ２とリード線の被覆を含
む外径ｄ１をｄｌ＝Ｄ２となる円錐形状の貫通孔とした
ことでリード線を挿入した時の突当てとなるため作業が
し易くなる。In addition, the hole diameter D2 on the bottom surface of the printed board and the outer diameter d1 including the lead wire sheathing are made into a conical through hole where dl = D2, which makes the work easier as it becomes abutment when the lead wire is inserted. Become.
第１図は本発明の揺動部品のリード線とプリント板の接
続方法を示す断面図、
第２図は本発明の他の実施例を示す断面図である。
■は円錐形状の貫通孔、
２は段付つきの貫通孔、
３は段部、
４は段部とリード線との間隙、
１０はプリント板、
１１はパターン、
１２は半田、
１３は接着剤、
１４は被覆、
１５は芯線、
１６は円錐形状の貫通孔とリード線との間隙、１７はリ
ード線、
ＤＩはプリント板の上面の穴径、
Ｄ２は下面の穴径、
ｄｌはリード線の被覆を含む外径を示す。
図において、FIG. 1 is a cross-sectional view showing a method of connecting a lead wire of a swinging component and a printed board according to the present invention, and FIG. 2 is a cross-sectional view showing another embodiment of the present invention. ■ is a conical through hole, 2 is a stepped through hole, 3 is a step, 4 is the gap between the step and the lead wire, 10 is a printed board, 11 is a pattern, 12 is solder, 13 is adhesive, 14 is the coating, 15 is the core wire, 16 is the gap between the conical through hole and the lead wire, 17 is the lead wire, DI is the hole diameter on the top surface of the printed board, D2 is the hole diameter on the bottom surface, dl is the coating of the lead wire Indicates the outer diameter including In the figure,
Claims (1)
ード線（１７）を嵌入出来るテーパー付き貫通孔（１）
を穿設し、 前記貫通孔（１）に前記リード線（１７）を被覆ごと嵌
入した状態で当該被覆を貫通孔（１）内に接着材（１３
）で固定すると共に、前期リード線の芯線（１５）を貫
通孔（１）裏側のパターン（１１）に半田付けしたこと
を特徴とするリード線の接続構造。[Claims] A tapered through-hole (1) into which a lead wire (17) with the covering still attached can be inserted into a predetermined location of a printed board (10).
with the lead wire (17) inserted into the through hole (1) together with the covering, and then inserting the adhesive (13) into the through hole (1).
), and the core wire (15) of the lead wire is soldered to the pattern (11) on the back side of the through hole (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16772590A JPH0767808B2 (en) | 1990-06-25 | 1990-06-25 | Lead wire connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16772590A JPH0767808B2 (en) | 1990-06-25 | 1990-06-25 | Lead wire connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0462066A true JPH0462066A (en) | 1992-02-27 |
| JPH0767808B2 JPH0767808B2 (en) | 1995-07-26 |
Family
ID=15855011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16772590A Expired - Fee Related JPH0767808B2 (en) | 1990-06-25 | 1990-06-25 | Lead wire connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767808B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021525973A (en) * | 2018-08-03 | 2021-09-27 | ウォーカー マイロンWALKER, Myron | Flexible and cutable radial bath and bus mount bead device |
-
1990
- 1990-06-25 JP JP16772590A patent/JPH0767808B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021525973A (en) * | 2018-08-03 | 2021-09-27 | ウォーカー マイロンWALKER, Myron | Flexible and cutable radial bath and bus mount bead device |
| JP2021185634A (en) * | 2018-08-03 | 2021-12-09 | ウォーカー マイロンWALKER, Myron | Flexible, interruptible radial bus and bus-mounted bead device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0767808B2 (en) | 1995-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |