JPH0461507B2 - - Google Patents

Info

Publication number
JPH0461507B2
JPH0461507B2 JP60213720A JP21372085A JPH0461507B2 JP H0461507 B2 JPH0461507 B2 JP H0461507B2 JP 60213720 A JP60213720 A JP 60213720A JP 21372085 A JP21372085 A JP 21372085A JP H0461507 B2 JPH0461507 B2 JP H0461507B2
Authority
JP
Japan
Prior art keywords
external
external lead
welding
contact
external terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60213720A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6273750A (ja
Inventor
Naomasa Sugita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60213720A priority Critical patent/JPS6273750A/ja
Publication of JPS6273750A publication Critical patent/JPS6273750A/ja
Publication of JPH0461507B2 publication Critical patent/JPH0461507B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60213720A 1985-09-27 1985-09-27 半導体装置 Granted JPS6273750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60213720A JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60213720A JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS6273750A JPS6273750A (ja) 1987-04-04
JPH0461507B2 true JPH0461507B2 (enExample) 1992-10-01

Family

ID=16643877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60213720A Granted JPS6273750A (ja) 1985-09-27 1985-09-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6273750A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3112113B2 (ja) * 1992-03-09 2000-11-27 三菱電機株式会社 半導体装置
JP5041798B2 (ja) 2006-12-15 2012-10-03 三菱電機株式会社 半導体装置
JP5182355B2 (ja) * 2010-12-10 2013-04-17 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JPS6273750A (ja) 1987-04-04

Similar Documents

Publication Publication Date Title
US5206188A (en) Method of manufacturing a high lead count circuit board
US5151771A (en) High lead count circuit board for connecting electronic components to an external circuit
JP3519300B2 (ja) パワーモジュールのパッケージ構造
US6215174B1 (en) Lead frame, mold for producing a resin-sealed semiconductor device, resin-sealed semiconductor device using such a lead frame
JPH0318010A (ja) ヒューズ付きコンデンサ及びその組立に使用されるリードフレーム
KR920006264B1 (ko) 반도체장치의 전극접합부 구조
JPH0461507B2 (enExample)
JP2510376Y2 (ja) イグナイタ
KR0175417B1 (ko) 반도체 장치 및 그의 제조 방법
US3422302A (en) Lamp lead wire terminal
JP2666988B2 (ja) リード接続方法
JPH08250620A (ja) 半導体装置
JP2712228B2 (ja) 半導体装置
JPS61139054A (ja) 半導体装置
JPH0436105Y2 (enExample)
JPH0440855B2 (enExample)
JPH02224348A (ja) 半導体装置
JPS6318139Y2 (enExample)
JPH10340716A (ja) 熱電池のカバー端子
JPS6138193Y2 (enExample)
JPS6120780Y2 (enExample)
JP3317185B2 (ja) 半導体圧力センサの製造方法
JPH0529870A (ja) チツプ型表面波デバイス
JPH0682774B2 (ja) 半導体パッケージ
JPH0237757A (ja) 半導体装置