JPH0461106A - Manufacture of laminated capacitor - Google Patents
Manufacture of laminated capacitorInfo
- Publication number
- JPH0461106A JPH0461106A JP2164433A JP16443390A JPH0461106A JP H0461106 A JPH0461106 A JP H0461106A JP 2164433 A JP2164433 A JP 2164433A JP 16443390 A JP16443390 A JP 16443390A JP H0461106 A JPH0461106 A JP H0461106A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- external electrode
- sintered body
- ceramic sintered
- electrode layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 52
- 239000000919 ceramic Substances 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 238000007789 sealing Methods 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229910052718 tin Inorganic materials 0.000 description 9
- 238000005470 impregnation Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は、積層コンデンサの製造方法に関し、特に、外
部電極形成方法が改良された積層コンデンサの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a multilayer capacitor, and particularly to a method for manufacturing a multilayer capacitor in which the method for forming external electrodes is improved.
従来の積層コンデンサの製造方法では、先ず、複数の内
部電極がセラミック層を介して重なり合うように配置さ
れており、かつ交互に両端面に引出されている構造を有
するセラミック焼結体が用意される０次に、該セラミッ
ク焼結体の両端面にＡｇペーストのような導電ペースト
を印調し、焼付けることにより第１の外部電極層が形成
される。In a conventional manufacturing method for a multilayer capacitor, first, a ceramic sintered body is prepared, which has a structure in which a plurality of internal electrodes are arranged so as to overlap each other with ceramic layers interposed therebetween, and are alternately drawn out on both end faces. Next, a first external electrode layer is formed by applying a conductive paste such as Ag paste to both end faces of the ceramic sintered body and baking it.
次に、第１の外部電極層上に、Ｎｉをめっきし、さらに
Ｎｆめっき層上に、はんだ付は性に優れたＳｎまたはＳ
ｎ ／ Ｐ ｂ合金をめっきすることにより、外部電
極を形成していた。すなわち、外部電極は、Ａｇからな
る第１の外部電極層、Ｎｉがらなる第２の外部電極層及
びＳｎまたはＳ ｎ ／ Ｐ ｂからなる第３の外部電
極層を有するように構成されていた。Next, Ni is plated on the first external electrode layer, and Sn or S, which has excellent soldering properties, is further plated on the Nf plating layer.
The external electrode was formed by plating n/Pb alloy. That is, the external electrode was configured to have a first external electrode layer made of Ag, a second external electrode layer made of Ni, and a third external electrode layer made of Sn or Sn/Pb.
従って、従来の外部電極形成方法では、Ａｇ含有ペース
トを焼付けた後に、二度のめ３っきＪ稈を実施しなけれ
ばならなかった。他方、Ａｇペーストを焼付けて構成さ
れる第１の外部電極層は、焼付けられた状態でその内部
に多数の細孔を有する。Therefore, in the conventional method for forming external electrodes, it was necessary to perform double plating and third plating after baking the Ag-containing paste. On the other hand, the first external electrode layer formed by baking Ag paste has a large number of pores therein in the baked state.
従って、第１の外部を極層を焼付けにより形成ｊ、。Therefore, the first exterior is formed by baking the polar layer.
た後に、二度のめっき工程を実施した場合、めっき液が
該細孔からセラミック焼結体内虹侵入するという問題が
あった。このめっき液の侵入は、特に、内部電極が引出
されている焼結体端面部分において顕著に現れ、すなわ
ち内部電極が引出されている部分から内部電極の主面に
沿ってセラミック焼結体内に入りがちであった。その結
果、めっき液の侵入により、セラミック焼結体の層剥が
れやデラミネーシゴンが生しがちであるという問題があ
った。When the plating process is performed twice after the plating process is performed, there is a problem that the plating solution enters the inside of the ceramic sintered body through the pores. This penetration of the plating solution is particularly noticeable at the end face portion of the sintered body from which the internal electrodes are drawn out; that is, it enters the ceramic sintered body from the portion where the internal electrodes are drawn out along the main surface of the internal electrodes. It was common. As a result, there is a problem in that the ceramic sintered body tends to peel off and delaminate due to the intrusion of the plating solution.
上記のような問題を解消するものとし７で、特公平１−
５３４９７号には、Δｇベーストを焼イ・ｊりた後に、
嫌気外接ｔｉ剖を第１の夕（部；極層に含浸させる方法
が開示さ第１といる。The above-mentioned problems should be resolved in Section 7,
In No. 53497, after baking the Δg base,
The first method disclosed is a method of impregnating the polar layer with anaerobic circumcision.
また、特公平１ ５５５６６号には、第１の外部電極層
に含浸させる薬剤どし７て、溶剤で溶解された熱硬化性
合成樹脂を用いる方法が開示されている。Furthermore, Japanese Patent Publication No. 155566 discloses a method in which a thermosetting synthetic resin dissolved in a solvent is used as the chemical agent 7 to impregnate the first external electrode layer.
しかしながら、特公平１−５３４９７号に開示されてい
る方法では、嫌気性接着剤が常温で硬化してしまうため
、第１の外部電極層内への嫌気性接着剤の含浸を４℃程
度の低温で行わねばならなかった。また、含浸後に余分
な量の嫌気性接着剤を隨去するのに、有機溶剤を用いな
ければならず、よって該有機溶剤による作業環境の悪化
が問題となっていた。さらに、嫌気性であるため、接着
剤が細孔の途中で硬化することが多く、完全に細孔部分
をシールすることが困難であった。のみならず、嫌気性
接着剤の保管のために、エアレーシッン等の特別な装置
が必要であるという問題もあっ他力、特公平１−５５５
６６号に開示されている方法では、含浸剤が溶剤タイプ
の熱硬化性接着剤よりなるため、硬化に際しての体積収
縮が大きい。従って、細孔に含浸させたとＬ７ても、体
積収縮により密封性が損なわれ、１分なシールを行い得
ないという問題があった。さらに、熱硬化性接着剤中に
溶剤としてガソリンが含有されており、また含浸後の洗
浄剤としてガソリンを含むものが用いられるため、取り
扱いに特別の注意を払う必要があった。However, in the method disclosed in Japanese Patent Publication No. 1-53497, since the anaerobic adhesive hardens at room temperature, the anaerobic adhesive is impregnated into the first external electrode layer at a low temperature of about 4°C. I had to do it. In addition, an organic solvent must be used to remove the excess amount of anaerobic adhesive after impregnation, resulting in a problem of deterioration of the working environment due to the organic solvent. Furthermore, since it is anaerobic, the adhesive often hardens in the middle of the pores, making it difficult to completely seal the pores. In addition, there is also the problem that special equipment such as air lacing is required to store anaerobic adhesives.
In the method disclosed in No. 66, since the impregnating agent is made of a solvent-type thermosetting adhesive, the volume shrinkage is large upon curing. Therefore, even if the pores were impregnated with L7, the sealing performance was impaired due to volumetric contraction, and there was a problem that a one-minute seal could not be achieved. Furthermore, the thermosetting adhesive contains gasoline as a solvent, and a detergent containing gasoline is used as a cleaning agent after impregnation, so special care must be taken in handling.
よって、本発明の目的は、導電ペーストを焼付けること
により形成された第１の外部電極層中の細孔を簡単にか
つ確実に封止し得る工程を備えた積層コンデンサの製造
方法を提供することにある。Therefore, an object of the present invention is to provide a method for manufacturing a multilayer capacitor, which includes a process for easily and reliably sealing pores in a first external electrode layer formed by baking a conductive paste. There is a particular thing.
本発明の積層コンデンサの製造方法は、下記の工程を少
な（とも備えることを特徴とする。The method for manufacturing a multilayer capacitor according to the present invention is characterized by comprising the following steps.
すなわち、複数の内部電極がセラミック層を介して重な
り合うように配置されており、かつ両端面に交互に引出
された構造をイイするセラミンク焼結体を用意するｒ稈
と、このセラミック焼結体の両端面に導電ベース［・を
印調し、焼付りることＶより第１の外部電極層を形成す
る工程と、Ｊ−記第１の外部電極層が形成された焼結体
を水溶性の熱硬化性樹脂のモノマー液中に浸漬し、真空
吸引し。In other words, a ceramic sintered body is prepared in which a plurality of internal electrodes are arranged so as to overlap each other via ceramic layers, and the ceramic sintered body has a structure in which they are drawn out alternately on both end faces, and this ceramic sintered body is A step of forming a first external electrode layer by stamping a conductive base [. Immerse it in a thermosetting resin monomer solution and vacuum it.
た後に加圧する工程と、加圧停止後に熱硬化性樹脂エノ
マー液からセラミンク焼結体を取り出し洗浄する工程と
、洗浄されたセラミック焼結体を加熱することにより、
第１の外部電極層中に含浸された熱硬化性樹脂を重合・
硬化させる工程と、第１の外部電極層上に第２の外部電
極層をめっきする工程を備える。The ceramic sintered body is removed from the thermosetting resin enomer liquid after the pressurization is stopped, the ceramic sintered body is removed and washed, and the cleaned ceramic sintered body is heated.
Polymerize the thermosetting resin impregnated into the first external electrode layer.
The method includes a curing step and a step of plating a second external electrode layer on the first external electrode layer.
本発明の製造方法では、導電ペーストを焼付けることに
より形成された第１の外部電極層の封止に、熱硬化性樹
脂モノマー液が用いられる。しかも、熱硬化性樹脂のモ
ノマー液中に浸漬された状態で加圧することにより該熱
硬化性接着剤ツマ−が含浸されるものであるため、細孔
の途中で硬化せず、細孔の奥の方まで熱硬化性樹脂千ノ
°・・〜が含浸される。In the manufacturing method of the present invention, a thermosetting resin monomer liquid is used to seal the first external electrode layer formed by baking the conductive paste. Furthermore, since the thermosetting adhesive is impregnated by applying pressure while immersed in the monomer liquid of the thermosetting resin, it does not harden in the middle of the pores, and is applied deep inside the pores. The thermosetting resin is impregnated up to 1,000 degrees.
また、熱硬化性樹脂モノマー液を用いるものであるため
、真空吸引及び加圧を常温で行うことができる。よって
、特別な冷却装置を必要としない。Furthermore, since a thermosetting resin monomer liquid is used, vacuum suction and pressurization can be performed at room temperature. Therefore, no special cooling device is required.
さらに、水溶性の熱硬化性樹脂モノマー液を用いるもの
であるため、洗浄を水で行うことができ、有害な有機溶
剤の使用を省略することができる。Furthermore, since a water-soluble thermosetting resin monomer liquid is used, cleaning can be performed with water, and the use of harmful organic solvents can be omitted.
Ｌ７かも、熱水等により加熱するだけで、含浸された熱
硬化性樹脂モノマーが簡単に重合され、か一つ硬化され
る。In the case of L7, the impregnated thermosetting resin monomer is easily polymerized and cured by simply heating with hot water or the like.
また、真空吸引及び加圧を併用することにより熱硬化性
樹脂上ツマー液を含浸させるものであるため、第１の外
部電極層に形成された細孔が複雑な形状であっても、該
細孔内に熱硬化性樹脂モノマー液が確実に含浸される。In addition, since the thermosetting resin is impregnated with Zimmer's liquid by using vacuum suction and pressure in combination, even if the pores formed in the first external electrode layer have a complicated shape, the pores can be easily absorbed. The thermosetting resin monomer liquid is reliably impregnated into the holes.
以下、図面を参照しつつ、本発明の一実施例の製造方法
を説明する。Hereinafter, a manufacturing method according to an embodiment of the present invention will be described with reference to the drawings.
まず、第１図に断面図で示すように、内部電極２ｄへ・
２ｄがセラミック層を介し７で重なり合うように配置さ
れたセラミンク焼結体１を用意する。First, as shown in the cross-sectional view in FIG.
A ceramic sintered body 1 is prepared in which the ceramic layers 2d and 2d are arranged to overlap each other at 7 with a ceramic layer interposed therebetween.
内部電極２ａ〜２ｄば、セラミック焼結体１の端面１ａ
、１ｂに交互に引出されζいる。このようなセラミック
焼結体Ｉは、積層コンデンサの周知の製造方法に従って
用意される。Internal electrodes 2a to 2d, end surface 1a of ceramic sintered body 1
, 1b are drawn out alternately. Such a ceramic sintered body I is prepared according to a well-known manufacturing method for multilayer capacitors.
次に、第１図に示すように、セラミνり焼結体１の端面
１ａ、ｌｂに、Ａｇを含有する導電ベストを印調し、焼
付けることにより第１の外部電極層３ａ、３ｈを形成す
る。焼付けにより、通常、第１の外部電極層３ａ、３ｂ
内には、多数の細孔４が形成されている。ごの細孔４が
、前述したように、積層コンデンサの気密性を損ない、
かつめっき後にセラミック層の層側がれ等をもたらす原
因となるものである。Next, as shown in FIG. 1, a conductive vest containing Ag is stamped on the end surfaces 1a and 1b of the ceramic sintered body 1 and baked to form the first external electrode layers 3a and 3h. Form. By baking, the first external electrode layers 3a, 3b are usually
A large number of pores 4 are formed inside. As mentioned above, the pores 4 impair the airtightness of the multilayer capacitor,
Moreover, it causes the ceramic layer to peel off after plating.
本実施例では、上記のようにして用意されたセラミック
焼結体ｌを、第２図に示すように、常温で水溶性の熱硬
化性樹脂モノマー液５内に浸漬する。なお、６は槽を示
し、内部に熱硬化性樹脂モノマー液５が貯留されている
。水溶性の熱硬化性樹脂モノマー液としこは、常温で液
体であり、加熱することにより重合・固化されるものが
用いられる。このような熱硬化性樹脂としては、例えば
第−化成工業株式会社製、商品名；シールファーストＧ
Ｅ−１０のようなアクリル系熱硬化性樹脂が用いられる
。In this example, the ceramic sintered body l prepared as described above is immersed in a water-soluble thermosetting resin monomer liquid 5 at room temperature, as shown in FIG. Note that 6 indicates a tank, and a thermosetting resin monomer liquid 5 is stored inside. The water-soluble thermosetting resin monomer liquid used is one that is liquid at room temperature and can be polymerized and solidified by heating. As such a thermosetting resin, for example, Seal Fast G manufactured by Dai-Kasei Kogyo Co., Ltd.
An acrylic thermosetting resin such as E-10 is used.
第２図に示すように、セラミック焼結体ｌを熱硬化性樹
脂モノマー液５内に浸漬する。そして、浸漬された状態
で、１５分間真空ポンプで吸引し、しかる後大気圧以上
の圧力に加圧する。この加圧により、熱硬化性樹脂上ツ
マー液５が第１の外部電極層３ａ、３ｈの細孔４に含浸
される。この加圧は、熱硬化性樹脂上ツマー液５の粘度
や加圧する圧力の大きさにもよるが、約５公租度行われ
る。As shown in FIG. 2, the ceramic sintered body 1 is immersed in a thermosetting resin monomer liquid 5. Then, in the immersed state, suction is applied using a vacuum pump for 15 minutes, and then the pressure is increased to above atmospheric pressure. Due to this pressurization, the pores 4 of the first external electrode layers 3a and 3h are impregnated with the thermosetting resin upper Zimmer liquid 5. This pressurization is performed for about 5 degrees, depending on the viscosity of the thermosetting resin topper liquid 5 and the magnitude of the pressure applied.
次に、加圧を停止し、常圧に戻した後に、浸漬されてい
たセラミック焼結体１を熱硬化性樹脂モノマー液５から
取り出す、しかる後、セラミック焼結体１の表面に付着
している余分な熱硬化性樹脂モノマー液を水で洗浄する
ことにより除去する。Next, after stopping the pressurization and returning to normal pressure, the immersed ceramic sintered body 1 is taken out from the thermosetting resin monomer liquid 5. Remove any excess thermosetting resin monomer liquid by washing with water.
なお、水で洗浄する際に、セラミック焼結体１や第１の
外部電極層３ａ、３ｂの表面に付着している余分の熱硬
化性樹脂上ツマー液は除去されるが、細孔４内に含浸さ
れた熱硬化性樹脂モノンー液はその表面張力により除去
されない。すなわち、細孔４内に未硬化の熱硬化性樹脂
上ツマー液が充填された状態に維持される。Note that when cleaning with water, excess thermosetting resin solution adhering to the surfaces of the ceramic sintered body 1 and the first external electrode layers 3a and 3b is removed, but the inside of the pores 4 is removed. The thermosetting resin monone liquid impregnated with the resin is not removed due to its surface tension. In other words, the pores 4 are maintained in a state filled with the uncured thermosetting resin coating solution.
しかる後、セラミック焼結体１を、９０℃の熱水に１５
分間浸漬して加熱し、充填されていた熱硬化性樹脂上ツ
マ−を重合・硬化させる。しかる後、熱水中からセラミ
ック焼結体ｌを取り出す。After that, the ceramic sintered body 1 was soaked in hot water at 90°C for 15 minutes.
It is immersed for a minute and heated to polymerize and harden the filled thermosetting resin upper layer. After that, the ceramic sintered body l is taken out from the hot water.
このようにして、第３図及び第４図に示すように、第１
の外部電極層３ａ、３ｂの細孔内に熱硬化性樹脂７が充
填された構造を得ることができる。熱硬化性樹脂７は、
熱水中に浸漬することにより硬化されるが、熱水に浸漬
する方法に代えて、１２０℃程度の恒温槽中にセラミッ
ク焼結体Ｉを投入し、加熱硬化してもよい、もっとも、
熱水中に浸漬した方が、より速やかに細孔内に含浸され
ている未硬化の熱硬化性モノマー液を硬化させることが
できる。In this way, as shown in FIGS. 3 and 4, the first
A structure in which the thermosetting resin 7 is filled into the pores of the external electrode layers 3a and 3b can be obtained. The thermosetting resin 7 is
Although it is hardened by immersing it in hot water, instead of immersing it in hot water, the ceramic sintered body I may be placed in a constant temperature bath of about 120°C and hardened by heating.
Immersion in hot water can more quickly cure the uncured thermosetting monomer liquid impregnated into the pores.
次に、第１の外部電極Ｊｉｉ３ａ、３ｂ土に、Ｎ。Next, N was applied to the first external electrodes Jii3a and 3b.
を電解めっきし、第２の外部電極層８ａ、８ｂを形成す
る（第５図参照）。are electrolytically plated to form second external electrode layers 8a and 8b (see FIG. 5).
さらに、Ｎｉよりなる第２の外部電極層の形成に続いて
、第６図に示すように、ＳｎまたはＳｎ／ｌ’ｂからな
る第３の外部電極層９ａ、９ｂをめっきにより形成する
。Furthermore, following the formation of the second external electrode layer made of Ni, as shown in FIG. 6, third external electrode layers 9a and 9b made of Sn or Sn/l'b are formed by plating.
第２．第３の外部電極層Ｂａ、８ｂ、９ａ、９ｂの形成
は、従来より周知の外部電極形成方法に従って行われる
。Second. The third external electrode layers Ba, 8b, 9a, and 9b are formed according to a conventionally well-known external electrode forming method.
本実施例の製造方法では、第２．第３の外部電極層８ａ
、８ｂ、９ａ、９ｂをめっきにより形成するに先立って
、第１の外部電極層３ａ、３ｂ中の細孔４が熱硬化性樹
脂７で封止されているため、めっき液中に浸漬したとし
ても、該めっき液が第１の外部電極層３ａ、３ｂを通っ
てセラミック焼結体１内に侵入するといった事故が確実
に防止される。In the manufacturing method of this embodiment, the second. Third external electrode layer 8a
, 8b, 9a, 9b by plating, the pores 4 in the first external electrode layers 3a, 3b are sealed with the thermosetting resin 7. Also, an accident in which the plating solution penetrates into the ceramic sintered body 1 through the first external electrode layers 3a, 3b is reliably prevented.
しかも、水溶性の熱硬化性樹脂上ツマー液を用いるもの
であるため、上記のような熱硬化性樹脂モノマー液−・
の浸漬、洗浄等の作業を開学に行うことができる。また
、熱硬化性モノマー液５の細孔４内への含浸についても
、セラミック焼結体１を熱硬化性モノマー液５内に浸漬
した状態で吸引・加圧することにより行われる。従って
、細孔４内に熱硬化性樹脂モノマー液５を確実に含浸さ
せることができる。In addition, since it uses a water-soluble thermosetting resin monomer solution, the above-mentioned thermosetting resin monomer liquid
Works such as soaking and washing can be carried out on-site. Further, impregnation of the thermosetting monomer liquid 5 into the pores 4 is also carried out by suctioning and pressurizing the ceramic sintered body 1 immersed in the thermosetting monomer liquid 5. Therefore, the thermosetting resin monomer liquid 5 can be reliably impregnated into the pores 4.
上記実施例の製造方法に従って、積層コンデンサを製造
したところ、セラミック焼結体１の長さ方向における圧
縮強度は、下記の第１表に示すとおりであった。また、
比較のために、第１の外部電極層３ａ、３ｂに熱硬化性
樹脂７を含浸させていないことを除き、他は同様にして
作製した従来品についても、同様に厚み方向の圧縮強度
を測定したところ、下記の第１表に示す結果が得られた
。When a multilayer capacitor was manufactured according to the manufacturing method of the above example, the compressive strength in the longitudinal direction of the ceramic sintered body 1 was as shown in Table 1 below. Also,
For comparison, the compressive strength in the thickness direction was similarly measured for a conventional product manufactured in the same manner except that the first external electrode layers 3a and 3b were not impregnated with the thermosetting resin 7. As a result, the results shown in Table 1 below were obtained.
（以下、余白）
第 １ 表
第１表から明らかなように、従来例では、第１の外部電
極層を形成した後の圧ｍ強度に比べて、第２．第３の外
部ＩＥ８ｉを形成した後（すなわち、めっき後）の圧縮
強度が大きく低下しているのに対し、本実施例の積層コ
ンデンサでは、圧縮強度は低下するどころか、むしろ高
められていることがわかる。(Hereinafter, blank space) Table 1 As is clear from Table 1, in the conventional example, the pressure m strength after forming the first external electrode layer is lower than the second. While the compressive strength after forming the third external IE8i (that is, after plating) is significantly reduced, in the multilayer capacitor of this example, the compressive strength is increased rather than reduced. Recognize.
また、上記従来例の積層コンデンサではＱ値が２０００
程度であったのに対し、熱硬化性樹脂モノマー液を含浸
し硬化させた実施例の積層コンデンサではＱ値は１００
００以上であった。すなわち、熱硬化性樹脂上ツマー液
を含浸させることにより、Ｑ値の低下を防止し得ること
がわかる。In addition, the above conventional multilayer capacitor has a Q value of 2000.
On the other hand, the multilayer capacitor of the example impregnated with thermosetting resin monomer liquid and cured had a Q value of 100.
It was over 00. That is, it can be seen that by impregnating the thermosetting resin with Zimmer's solution, a decrease in the Q value can be prevented.
さらに、上記実施例及び従来例の積層コンデンサを多数
試作したところ、従来例の積層コンデンサでは１０００
個当たり２個の割合でＹラミネーソゴンが発生していた
のに対し、実施例の積層コンデンサではデラミネーショ
ンの発生は皆無であった。Furthermore, when we produced a large number of prototype multilayer capacitors of the above embodiment and the conventional example, we found that the conventional multilayer capacitor
While two Y-laminate sogons were generated per capacitor, no delamination occurred in the multilayer capacitor of the example.
上記実施例では、第１の外部電極層を形成するのにＡｇ
含有ペーストを用いたが、Ａｇに代えて他の導電性金属
、例えばＡ、 ｇ−Ｐ ｄを含有させたｓｉ１ペースト
を用いてもよい。In the above embodiment, Ag is used to form the first external electrode layer.
Although the paste containing Ag was used, a si1 paste containing other conductive metals such as A and g-Pd may be used instead of Ag.
また、上記実施例では、Ｎｉからなる第２の外部電極層
を形成した後に、ＳｎまたはＳ ｎ ／ Ｐ ｂからな
る第３の外部電極層をめっきにより形成した。しかしな
がら、場合によっては、直接第２の外部電極層として、
ＳｎまたはＳ ｎ ／ Ｐ ｂ層を形成してもよい。Further, in the above example, after forming the second external electrode layer made of Ni, the third external electrode layer made of Sn or Sn/Pb was formed by plating. However, in some cases, directly as the second external electrode layer,
A Sn or Sn/Pb layer may be formed.
なお、本発明における上記説明では、第１の外部電極層
に熱硬化性樹脂モノマーを含浸させるとしているが、焼
結体の外表面からも含浸させることを妨げるものではな
い。In the above description of the present invention, it is assumed that the first external electrode layer is impregnated with the thermosetting resin monomer, but this does not preclude impregnation from the outer surface of the sintered body.
本発明によれば、水溶性の熱硬化性樹脂モノマ−液に浸
漬し、加圧することにより第１の夕）都電極層の細孔に
熱硬化性樹脂モノマー液を含浸さゼるものであるため、
第１の外部電極層中の細孔乙こ確実に熱硬化性樹脂モノ
マー液を充填することができ、後工程で加熱するだけで
細孔を封止することができる。しかも、水溶性の熱硬化
性樹脂上ツマー液を含浸剤として用いるものであるため
、取扱に特別に注意を払う必要がない。また、嫌気性接
着剤を用いた従来法では低温で処理する必要があるため
冷却装置が必要であり、保管にエアレージジン装置等の
特別な装置が必要であり、さらにガソリン含有熱硬化性
接着剤を用いた従来例では溶削としてガソリンを使用す
るため取扱に注意を払う必要があり、かつ安全性の点で
も問題があったのに対し、本発明の製造方法では、水溶
性の熱硬化性樹脂モノマー液を用いるため、このような
特別な装置を必要としない、また作業環境の悪化も招か
ない、さらに、含浸後の表面の洗浄も水で行い得るため
、含浸及び洗浄の全工程が速やかに行われ得る。According to the present invention, the pores of the electrode layer are impregnated with the thermosetting resin monomer liquid by immersing it in a water-soluble thermosetting resin monomer liquid and applying pressure. For,
The pores in the first external electrode layer can be reliably filled with the thermosetting resin monomer liquid, and the pores can be sealed simply by heating in a subsequent step. Moreover, since a water-soluble thermosetting resin top solution is used as an impregnating agent, there is no need to pay special attention to handling. In addition, conventional methods using anaerobic adhesives require processing at low temperatures, which requires a cooling device and special equipment such as an airage gin device for storage. In contrast, in the conventional method, gasoline was used for cutting, which required careful handling and caused problems in terms of safety. Since a monomer liquid is used, such special equipment is not required, and the working environment will not be degraded.Furthermore, the surface can be cleaned with water after impregnation, so the entire process of impregnation and cleaning can be completed quickly. It can be done.
（Ｋ−９て、本発明に、Ｊ、れば、特別な装置を必要と
せずに、かつ極めて簡単な工程により信頼性に優れた積
層コンデンサを量産することが可能となる。(K-9) According to the present invention, multilayer capacitors with excellent reliability can be mass-produced without the need for special equipment and through an extremely simple process.
第１図は本発明の一実施例の製造方法において第１の外
部電極層を形成した状態を示す断面図、第２図は水溶性
熱硬化性モノマー液に浸漬する］程を説明するための断
面図、第３図は細孔に含浸された熱硬化性樹脂上ツマ−
が硬化された状態を示す断面図、第４図は第３図の要部
を拡大して示す部分切欠断面図、第５図は第２の外部電
極層を形成した状態を示す断面図、第６図は第３の外部
電極層を形成した状態を示す断面図である。
図において、１はセラミック焼結体、２ａ〜２ｄは内部
電極、３ａ、３ｂは外部電極、４は細孔、５は水溶性熱
硬化性樹脂モノマー液、７は熱硬化性樹脂、８ａ、８ｂ
は第２の外部電極層、９ａ９ｂは第３の外部電極層を示
す。FIG. 1 is a cross-sectional view showing the state in which the first external electrode layer is formed in a manufacturing method according to an embodiment of the present invention, and FIG. Cross-sectional view, Figure 3 shows the thermosetting resin upper part impregnated into the pores.
4 is a partially cutaway sectional view showing an enlarged main part of FIG. 3. FIG. 5 is a sectional view showing a state in which the second external electrode layer is formed. FIG. 6 is a cross-sectional view showing a state in which the third external electrode layer is formed. In the figure, 1 is a ceramic sintered body, 2a to 2d are internal electrodes, 3a and 3b are external electrodes, 4 is a pore, 5 is a water-soluble thermosetting resin monomer liquid, 7 is a thermosetting resin, 8a and 8b
indicates the second external electrode layer, and 9a9b indicates the third external electrode layer.
Claims (1)
うように配置されており、かつ両端面に交互に引出され
た構造を有するセラミック焼結体を用意する工程と、 前記セラミック焼結体の両端面に導電ペーストを印調し
焼付けることにより第１の外部電極層を形成する工程と
、 前記第１の外部電極層が形成されたセラミック焼結体を
水溶性の熱硬化性樹脂モノマー液中に浸漬し、真空吸引
した後に加圧する工程と、 加圧停止後に、熱硬化性樹脂モノマー液からセラミック
焼結体を取出し、洗浄する工程と、前記セラミック焼結
体を加熱することにより、第１の外部電極層内に含浸さ
れた熱硬化性樹脂モノマーを重合・硬化させる工程と、 前記第１の外部電極層上に第２の外部電極層をめっきす
る工程とを備えることを特徴とする積層コンデンサの製
造方法。(1) A step of preparing a ceramic sintered body having a structure in which a plurality of internal electrodes are arranged so as to overlap each other via ceramics and are drawn out alternately on both end faces, and both end faces of the ceramic sintered body. forming a first external electrode layer by imprinting and baking a conductive paste; and placing the ceramic sintered body on which the first external electrode layer is formed in a water-soluble thermosetting resin monomer liquid. A step of immersing the ceramic sintered body and applying pressure after vacuum suction; a step of taking out the ceramic sintered body from the thermosetting resin monomer liquid after stopping the pressurization and washing it; and heating the ceramic sintered body, the first step is performed. A multilayer capacitor comprising the steps of: polymerizing and curing a thermosetting resin monomer impregnated into the external electrode layer; and plating a second external electrode layer on the first external electrode layer. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2164433A JPH07123097B2 (en) | 1990-06-22 | 1990-06-22 | Manufacturing method of multilayer capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2164433A JPH07123097B2 (en) | 1990-06-22 | 1990-06-22 | Manufacturing method of multilayer capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0461106A true JPH0461106A (en) | 1992-02-27 |
| JPH07123097B2 JPH07123097B2 (en) | 1995-12-25 |
Family
ID=15793070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2164433A Expired - Lifetime JPH07123097B2 (en) | 1990-06-22 | 1990-06-22 | Manufacturing method of multilayer capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07123097B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04250607A (en) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | Chip-shaped electronic parts and their manufacture |
| GB2344222A (en) * | 1998-11-27 | 2000-05-31 | Taiyo Yuden Kk | An electronic component with a ceramic body and terminals which include a synthetic resin |
| CN102893349A (en) * | 2010-05-21 | 2013-01-23 | 株式会社村田制作所 | Ceramic body and method for producing same |
| JP5195921B2 (en) * | 2008-12-25 | 2013-05-15 | 株式会社村田製作所 | Manufacturing method of ceramic body |
| JP2016072485A (en) * | 2014-09-30 | 2016-05-09 | 株式会社村田製作所 | Multilayer ceramic capacitor |
| US20200105478A1 (en) * | 2018-09-06 | 2020-04-02 | Samsung Electro-Mechanics Co., Ltd. | Ceramic electronic component |
| JP2020161734A (en) * | 2019-03-27 | 2020-10-01 | 株式会社村田製作所 | Laminated ceramic electronic component |
-
1990
- 1990-06-22 JP JP2164433A patent/JPH07123097B2/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0656824B2 (en) * | 1991-01-25 | 1994-07-27 | 太陽誘電株式会社 | Chip-shaped electronic component and manufacturing method thereof |
| JPH04250607A (en) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | Chip-shaped electronic parts and their manufacture |
| GB2344222A (en) * | 1998-11-27 | 2000-05-31 | Taiyo Yuden Kk | An electronic component with a ceramic body and terminals which include a synthetic resin |
| US6252481B1 (en) | 1998-11-27 | 2001-06-26 | Taiyo Yuden Co. Ltd. | Chip type electronic part and method for the manufacture thereof |
| GB2344222B (en) * | 1998-11-27 | 2003-06-04 | Taiyo Yuden Kk | Chip type electronic part and method for the manufacture thereof |
| JP5195921B2 (en) * | 2008-12-25 | 2013-05-15 | 株式会社村田製作所 | Manufacturing method of ceramic body |
| US8448313B2 (en) | 2008-12-25 | 2013-05-28 | Murata Manufacturing Co., Ltd. | Method for producing ceramic body |
| US20130076203A1 (en) * | 2010-05-21 | 2013-03-28 | Murata Manufacturing Co., Ltd. | Ceramic body and method for producing the same |
| CN102893349A (en) * | 2010-05-21 | 2013-01-23 | 株式会社村田制作所 | Ceramic body and method for producing same |
| JP2016072485A (en) * | 2014-09-30 | 2016-05-09 | 株式会社村田製作所 | Multilayer ceramic capacitor |
| US20200105478A1 (en) * | 2018-09-06 | 2020-04-02 | Samsung Electro-Mechanics Co., Ltd. | Ceramic electronic component |
| US10886068B2 (en) * | 2018-09-06 | 2021-01-05 | Samsung Electro-Mechanics Co., Ltd. | Ceramic electronic component |
| JP2020161734A (en) * | 2019-03-27 | 2020-10-01 | 株式会社村田製作所 | Laminated ceramic electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07123097B2 (en) | 1995-12-25 |
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