JPH0459952U - - Google Patents
Info
- Publication number
- JPH0459952U JPH0459952U JP10239190U JP10239190U JPH0459952U JP H0459952 U JPH0459952 U JP H0459952U JP 10239190 U JP10239190 U JP 10239190U JP 10239190 U JP10239190 U JP 10239190U JP H0459952 U JPH0459952 U JP H0459952U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- punch
- forming
- die
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10239190U JPH0459952U (hu) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10239190U JPH0459952U (hu) | 1990-09-28 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459952U true JPH0459952U (hu) | 1992-05-22 |
Family
ID=31846610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10239190U Pending JPH0459952U (hu) | 1990-09-28 | 1990-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459952U (hu) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013000795A (ja) * | 2011-06-22 | 2013-01-07 | Yazaki Corp | 金属導線の加工方法及び加工装置 |
-
1990
- 1990-09-28 JP JP10239190U patent/JPH0459952U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013000795A (ja) * | 2011-06-22 | 2013-01-07 | Yazaki Corp | 金属導線の加工方法及び加工装置 |
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