JPS6373947U - - Google Patents

Info

Publication number
JPS6373947U
JPS6373947U JP1986168766U JP16876686U JPS6373947U JP S6373947 U JPS6373947 U JP S6373947U JP 1986168766 U JP1986168766 U JP 1986168766U JP 16876686 U JP16876686 U JP 16876686U JP S6373947 U JPS6373947 U JP S6373947U
Authority
JP
Japan
Prior art keywords
lead
electronic component
forming device
presses
bending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986168766U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986168766U priority Critical patent/JPS6373947U/ja
Publication of JPS6373947U publication Critical patent/JPS6373947U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Processing (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP1986168766U 1986-10-31 1986-10-31 Pending JPS6373947U (hu)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986168766U JPS6373947U (hu) 1986-10-31 1986-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986168766U JPS6373947U (hu) 1986-10-31 1986-10-31

Publications (1)

Publication Number Publication Date
JPS6373947U true JPS6373947U (hu) 1988-05-17

Family

ID=31101948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986168766U Pending JPS6373947U (hu) 1986-10-31 1986-10-31

Country Status (1)

Country Link
JP (1) JPS6373947U (hu)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541156U (ja) * 1991-11-06 1993-06-01 ローム株式会社 発光ダイオードにおけるリードの曲げ加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541156U (ja) * 1991-11-06 1993-06-01 ローム株式会社 発光ダイオードにおけるリードの曲げ加工装置

Similar Documents

Publication Publication Date Title
JPS6373947U (hu)
JPH0262721U (hu)
JPS6449317U (hu)
JPS61112650U (hu)
JPH0295251U (hu)
JPS60181350U (ja) 石ケン圧着器
JPS6256230U (hu)
JPS6441146U (hu)
JPS61168646U (hu)
JPH0426552U (hu)
JPH029447U (hu)
JPS647570U (hu)
JPH0331018U (hu)
JPS5858760U (ja) トリムカバ−におけるオ−ナメント類の取付構造
JPH03106210U (hu)
JPS61125124U (hu)
JPS6142068U (ja) ハ−ネスコネクタ
JPS60146524U (ja) 薄板用成形金型
JPS61186175U (hu)
JPS6351431U (hu)
JPH0252354U (hu)
JPS6424854U (hu)
JPS6037019U (ja) 加締装置
JPS63196318U (hu)
JPS632521U (hu)