JPH0426552U - - Google Patents
Info
- Publication number
- JPH0426552U JPH0426552U JP6832490U JP6832490U JPH0426552U JP H0426552 U JPH0426552 U JP H0426552U JP 6832490 U JP6832490 U JP 6832490U JP 6832490 U JP6832490 U JP 6832490U JP H0426552 U JPH0426552 U JP H0426552U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- die
- punch
- bending device
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 4
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6832490U JPH0426552U (hu) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6832490U JPH0426552U (hu) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426552U true JPH0426552U (hu) | 1992-03-03 |
Family
ID=31602664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6832490U Pending JPH0426552U (hu) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426552U (hu) |
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1990
- 1990-06-26 JP JP6832490U patent/JPH0426552U/ja active Pending