JPH0459637A - Low-melting glass - Google Patents
Low-melting glassInfo
- Publication number
- JPH0459637A JPH0459637A JP17244190A JP17244190A JPH0459637A JP H0459637 A JPH0459637 A JP H0459637A JP 17244190 A JP17244190 A JP 17244190A JP 17244190 A JP17244190 A JP 17244190A JP H0459637 A JPH0459637 A JP H0459637A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- low
- melting glass
- water resistance
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 47
- 238000002844 melting Methods 0.000 title claims abstract description 23
- 230000008018 melting Effects 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 19
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 7
- 239000002131 composite material Substances 0.000 abstract description 5
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 abstract description 4
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract description 3
- 229910003069 TeO2 Inorganic materials 0.000 abstract description 3
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 241000238366 Cephalopoda Species 0.000 description 1
- 229910004273 TeO3 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は低融点ガラスに関し、より詳しくはコンポジッ
トタイプの磁気へ、ソドに用いられる低融点ガラスに関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a low melting point glass, and more particularly to a low melting point glass used in composite type magnetism.
［従来の技術］
従来、ハードディスクに使用される磁気へ・ソドはフェ
ライトを主体としたモノシリ・ツクタイプが主流であっ
たが、近年のハードディスクの記録密度の高度化に伴い
、モノシリツクタイプに代わってコンポジットタイプと
呼ばれるものか使用されるようになってきている。この
コンポジットタイプの磁気ヘッドは、第１図に示すよう
に一次ガラス１と呼ばれる接着用ガラスでギヤ・ツブ部
２が封着されたフェライト製のへラドチップ３を、第２
図に示すセラミックススライダー４の切り込み部５に挿
入した後、二次ガラス６と呼ばれるへ、ノドチップ固定
用ガラスをヘッドチップ上に配置して熱処理し、第３図
に示すようにヘッドチップを固定した後、所定の加工を
施すことにより作製される。[Conventional technology] Traditionally, the magnetic conductors used in hard disks were mainly of the mono-silicon type, mainly made of ferrite, but as the recording density of hard disks has become more advanced in recent years, the mono-silicon type has been replaced. A so-called composite type is increasingly being used. As shown in FIG. 1, this composite type magnetic head has a ferrite Herad chip 3 with a gear lub 2 sealed with adhesive glass called primary glass 1, and a second
After inserting into the notch 5 of the ceramic slider 4 shown in the figure, a glass for fixing the throat tip, called secondary glass 6, was placed on the head chip and heat treated to fix the head tip as shown in Fig. 3. After that, it is manufactured by performing predetermined processing.
［発明が解決しようとする問題点コ
ヘッドチップの固定に用いられる二次ガラスとしては、
ヘッドチップの材質であるフェライトに適合した熱膨張
係数を有し、しかもへラドチップ固定の際の熱処理によ
って一次ガラスか軟化流動してギャップ長が大きくなっ
たり、実効トラ・ツク幅が小さくなることがないように
、−次ガラスの屈伏点以下の温度て熱処理できる低融点
ガラスが用いられる。[Problems to be Solved by the Invention The secondary glass used for fixing the head chip is
It has a coefficient of thermal expansion that is compatible with the ferrite that is the material of the head chip, and in addition, the heat treatment when fixing the head chip will cause the primary glass to soften and flow, increasing the gap length and reducing the effective track width. To avoid this, a low melting point glass is used which can be heat treated at a temperature below the yield point of the -order glass.
しかしながらフェライトにあうような高い熱膨張係数を
有する低融点ガラスは一般に耐水性が低く、このような
ガラスをヘッドチップの固定に用いた場合、大気中の水
分と反応してガラス表面に異物が析出し、ハードディス
ク表面を損傷させる等の問題が生じる。However, low-melting glass with a high coefficient of thermal expansion that matches ferrite generally has low water resistance, and when such glass is used to fix a head chip, it reacts with moisture in the atmosphere and deposits foreign matter on the glass surface. However, problems such as damage to the hard disk surface occur.
本発明の目的は、高い熱膨張係数を有し、且つ耐水性の
良い、ヘッドチップの固定に好適な低融点ガラスを提供
することである。An object of the present invention is to provide a low melting point glass that has a high coefficient of thermal expansion, good water resistance, and is suitable for fixing a head chip.
Ｅ問題点を解決するための手段］
本発明者等は、上記目的を達成するために種々の研究を
行った結果、ＰｂＯ−８１０゜−８２０３系の低融点ガ
ラスにＴｅＯ２を含有せしめることにより、耐水性が良
好で、しかも高膨張の低融点ガラスが得られることを見
いだし、本発明として提案するものである。Means for Solving Problem E] The present inventors conducted various studies to achieve the above object, and found that by incorporating TeO2 into PbO-810°-8203-based low melting glass, It has been discovered that a low melting point glass with good water resistance and high expansion can be obtained, and this is proposed as the present invention.
即ち、本発明の低融点ガラスは、重量百分率で、ｐｂｏ
ｅｏ〜７５％、５ｉＯ３１５〜２５％、Ｂｉ２Ｏ３０
〜６％、ＴｅＯ２０，５〜１０％、７１００〜４％、Ｎ
ａ２００〜５％、ＳｒＯ０〜５％、Ｂａ００〜５％、Ｂ
ｉ２Ｏ３０〜６％％からなることを特徴とする。That is, the low melting point glass of the present invention has a pbo
eo~75%, 5iO315~25%, Bi2O30
~6%, TeO20,5~10%, 7100~4%, N
a200-5%, SrO0-5%, Ba00-5%, B
It is characterized by consisting of i2O30-6%%.
［作用］
本発明の低融点ガラスは、３０〜３００°Ｃにおける熱
膨張係数がフェライトのそれ（１００〜１３０Ｘ１０−
’／”Ｃ）にあう９０〜１２０ Ｘｌ０−７／ ’Ｃで
あり、また軟化点が４５０〜５２０℃であるため一次ガ
ラスの屈伏点（通常５５０〜５８０℃）以下である５４
０〜５７０°Ｃで熱処理することが可能である。しかも
ＴｅＯ□を含有するため耐水性が非常に優れている。[Function] The low melting point glass of the present invention has a thermal expansion coefficient at 30 to 300°C that of ferrite (100 to 130
90 to 120
It is possible to heat treat at 0-570°C. Moreover, since it contains TeO□, it has very good water resistance.
次に、本発明の低融点ガラスの組成を上記のように限定
した理由を以下に示す。Next, the reason why the composition of the low melting point glass of the present invention is limited as described above will be explained below.
ＰｂＯはガラスを低融点化させる成分であり、その含有
量は６０〜７５％である。ＰｂＯが６０％より少ないと
軟化点が高くなり、７５％より多いと耐水性か悪くなる
。PbO is a component that lowers the melting point of glass, and its content is 60 to 75%. If PbO is less than 60%, the softening point will be high, and if it is more than 75%, water resistance will be poor.
ＳＩＯ□はガラス化範囲を広げる成分であり、その含有
量は１５〜２５％である。Ｓ１０゜が１５％より少ない
と耐水性が悪くなり、２５％より多いと軟化点が高くな
り、低融点化が困難になる。SIO□ is a component that expands the vitrification range, and its content is 15 to 25%. If S10° is less than 15%, water resistance will be poor, and if it is more than 25%, the softening point will be high and it will be difficult to lower the melting point.
Ｂ２Ｏ３はガラスを安定化させる成分てあり、その含有
量は２〜６％である。Ｂ２Ｏ３が２％より少ないとガラ
スが不安定になり、６％より多いと耐水性が悪くなる。B2O3 is a component that stabilizes glass, and its content is 2 to 6%. When B2O3 is less than 2%, the glass becomes unstable, and when it is more than 6%, water resistance deteriorates.
Ｔｅ０９は鉛系ガラスの耐水性を改善する作用かあり、
その含有量は０．５〜１０％である。ＴｅＯ３が０．５
％より少ないと耐水性の改善に寄与せず、１０％より多
いと軟化点が高くなる。Te09 has the effect of improving the water resistance of lead-based glass,
Its content is 0.5-10%. TeO3 is 0.5
If it is less than 10%, it will not contribute to improving water resistance, and if it is more than 10%, the softening point will increase.
ＺｎＯはガラスの熱膨張係数を上げずに低融点化させる
成分であり、その含有量は０〜４％である。ZnO is a component that lowers the melting point of glass without increasing its coefficient of thermal expansion, and its content is 0 to 4%.
ＺｎＯが４％より多いとガラスが失透し易くなる。When the ZnO content is more than 4%, the glass tends to devitrify.
Ｎａ２Ｏ、ＳｒＯ、ＢａＯは共に熱膨張係数を高める成
分であり、その含有量は各々θ〜５％である。Ｎａ２Ｏ
，５ｒＯ１ＢａＯがそれぞれ５％を越えると耐水性が悪
くなる。Na2O, SrO, and BaO are all components that increase the coefficient of thermal expansion, and their contents are each θ to 5%. Na2O
, 5rO1BaO exceeds 5% each, the water resistance deteriorates.
Ｂｉ２Ｏ３はガラスの軟化点を下げる作用があり、その
含有量は０〜ｌＯ％である。Ｂ１゜０３の含有量が１０
％より多いとガラスが着色して不透明になり、ギャップ
深さの測定が困難になる。Bi2O3 has the effect of lowering the softening point of glass, and its content is 0 to 10%. B1゜03 content is 10
%, the glass becomes colored and opaque, making it difficult to measure the gap depth.
［実施例コ
以下、本発明の低融点ガラスを実施例に基づいて説明す
る。[Examples] The low melting point glass of the present invention will be explained below based on Examples.
法衣は本発明の実施例（試料Ｎｏ、１〜４）及び比較例
（試料Ｎｏ、５．［ｉ）を示すものである。The vestments represent examples of the present invention (sample Nos. 1 to 4) and comparative examples (sample No. 5. [i).
以 下 余 白
表のＮｏ、１〜６の各試料は次のようにして調製しまず
重量百分率で表の組成となるように調合した原料バッチ
を白金坩堝に入れ、１１００’Ｃて１時間溶融し、所定
の形状に成形して試料を作製した後、熱膨張係数、軟化
点、熱処理温度及び耐水性を測定した。Each sample No. 1 to 6 in the blank table below was prepared as follows: First, a raw material batch prepared to have the composition shown in the table in terms of weight percentage was placed in a platinum crucible and melted at 1100'C for 1 hour. After forming a sample into a predetermined shape, the thermal expansion coefficient, softening point, heat treatment temperature, and water resistance were measured.
表から明らかなように実施例であるＮ００１〜４の各試
料は熱膨張係数か９０〜１１０ Ｘｌ０−７／ ’Ｃ１
軟化点が４７０〜５０５℃、熱処理温度が５４０〜５７
０’Ｃの値を示し、また耐水性が良であった。これに対
して、比較例であるＮｏ、５．６の各試料は熱膨張係数
が１００ Ｘｌ０−７／ ’Ｃ及び１０５ Ｘｌ０−７
／ ’Ｃ，軟化軟化イカ４８０℃４８５℃、熱処理温度
が５５０”Ｃ及び５３０’Ｃであったが、耐水性はとも
に不良であった。As is clear from the table, each sample of Examples No. 001 to 4 has a thermal expansion coefficient of 90 to 110 Xl0-7/'C1
Softening point is 470-505℃, heat treatment temperature is 540-57
It showed a value of 0'C and had good water resistance. On the other hand, samples No. 5.6, which are comparative examples, have thermal expansion coefficients of 100 Xl0-7/'C and 105 Xl0-7
/'C, softened squid at 480°C and 485°C, and heat treatment temperatures at 550''C and 530'C, but water resistance was poor in both cases.
これらの事実は、本発明が高い熱膨張係数を何する低融
点ガラスであり、しがも耐水性が良好であることを示し
ている。These facts indicate that the present invention is a low melting point glass with a high coefficient of thermal expansion, and also has good water resistance.
なお熱膨張係数及び軟化点は、各ガラスを５φＸ ２０
ｍｍのロッド状に成形した試料を用いて平均線熱膨張係
数測定器によって測定した。また熱処理温度は、ヘッド
チップの固定に必要な流動性が得られる温度、即ちガラ
スの粘度が１０’ポアズを示す時の温度を高温粘性測定
器により測定した。さらに耐水性は、各ガラスを１０．
ＯＸ ２．５ Ｘ ３．Ｏｍｍの短冊状に成形した試料
を、純水中に浸漬して３０分間煮沸した後、その表面を
目視によって観察したものであり、表面状態が変わらな
い場合は良、白濁を生じたものは不良とした。The thermal expansion coefficient and softening point of each glass are 5φX 20
The average linear thermal expansion coefficient was measured using an average linear thermal expansion coefficient measuring device using a sample molded into a rod shape of mm. The heat treatment temperature was measured using a high-temperature viscosity measuring device at a temperature at which fluidity necessary for fixing the head chip was obtained, that is, a temperature at which the viscosity of the glass was 10' poise. Furthermore, the water resistance of each glass is 10.
OX2.5X3. A sample formed into a rectangular shape of 0 mm was immersed in pure water and boiled for 30 minutes, and then the surface was visually observed. If the surface condition did not change, it was considered good, and if it became cloudy, it was considered bad. And so.
［効果］
以上説明したように、本発明の低融点ガラスは、フェラ
イトにあった熱膨張係数を有し、−次ガラスの屈伏点以
下で熱処理することができ、しかも耐水性が良好である
ため、コンポジットタイプの磁気ヘッドのヘッドチップ
を固定する二次ガラスとして好適である。[Effects] As explained above, the low melting point glass of the present invention has a coefficient of thermal expansion matching that of ferrite, can be heat treated at a temperature below the yield point of -order glass, and has good water resistance. It is suitable as a secondary glass for fixing the head chip of a composite type magnetic head.
第１図はギャップ部が一次ガラスによって封着されたヘ
ッドチップの斜視図、第２図はセラミックススライター
の斜視図、第３図は二次カラスによってセラミックスス
ライダーの切り込み部にヘッドチップが固定された状態
を示す説明図である。
３・・・ヘッドチップ
４・・・セラミックススライダー
５・・・切り込み部 ６・・・二次ガラス特許出願人
日本電気硝子株式会社
代表者 岸 １）清 作
区
ｉつ
第
図Figure 1 is a perspective view of the head chip with the gap sealed by the primary glass, Figure 2 is a perspective view of the ceramic slitter, and Figure 3 is the head chip fixed to the notch of the ceramic slider by the secondary glass. FIG. 3...Head chip 4...Ceramics slider 5...Notch part 6...Secondary glass patent applicant Representative of Nippon Electric Glass Co., Ltd. Kishi 1) Kiyoshi Sakuku Itsu diagram
Claims (1)
１５〜２５％、Ｂ＿２Ｏ＿３２〜６％、ＴｅＯ＿２０．
５〜１０％、ＺｎＯ０〜４％、Ｎａ＿２Ｏ０〜５％、Ｓ
ｒＯ０〜５％、ＢａＯ０〜５％、Ｂｉ＿２Ｏ＿３０〜１
０％からなることを特徴とする低融点ガラス。(1) In weight percentage, PbO60-75%, SiO_2
15-25%, B_2O_32-6%, TeO_20.
5-10%, ZnO0-4%, Na_2O0-5%, S
rO0~5%, BaO0~5%, Bi_2O_30~1
A low melting point glass characterized by consisting of 0%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17244190A JPH0459637A (en) | 1990-06-28 | 1990-06-28 | Low-melting glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17244190A JPH0459637A (en) | 1990-06-28 | 1990-06-28 | Low-melting glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459637A true JPH0459637A (en) | 1992-02-26 |
Family
ID=15942045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17244190A Pending JPH0459637A (en) | 1990-06-28 | 1990-06-28 | Low-melting glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459637A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6163106A (en) * | 1997-09-09 | 2000-12-19 | Asahi Glass Company Ltd. | Color cathode ray tube and water resistant glass frit |
| EP1178019A1 (en) * | 1999-11-30 | 2002-02-06 | Kabushiki Kaisha Ohara | Optical glass |
-
1990
- 1990-06-28 JP JP17244190A patent/JPH0459637A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6163106A (en) * | 1997-09-09 | 2000-12-19 | Asahi Glass Company Ltd. | Color cathode ray tube and water resistant glass frit |
| EP1178019A1 (en) * | 1999-11-30 | 2002-02-06 | Kabushiki Kaisha Ohara | Optical glass |
| EP1178019A4 (en) * | 1999-11-30 | 2006-04-05 | Ohara Kk | Optical glass |
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