JPH0459155U - - Google Patents
Info
- Publication number
- JPH0459155U JPH0459155U JP10014690U JP10014690U JPH0459155U JP H0459155 U JPH0459155 U JP H0459155U JP 10014690 U JP10014690 U JP 10014690U JP 10014690 U JP10014690 U JP 10014690U JP H0459155 U JPH0459155 U JP H0459155U
- Authority
- JP
- Japan
- Prior art keywords
- movable
- chuck plate
- movable piece
- center
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000000078 claw Anatomy 0.000 claims description 2
Landscapes
- Jigs For Machine Tools (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10014690U JPH0735395Y2 (ja) | 1990-09-27 | 1990-09-27 | スピンチャック |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10014690U JPH0735395Y2 (ja) | 1990-09-27 | 1990-09-27 | スピンチャック |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459155U true JPH0459155U (un) | 1992-05-21 |
| JPH0735395Y2 JPH0735395Y2 (ja) | 1995-08-09 |
Family
ID=31842569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10014690U Expired - Fee Related JPH0735395Y2 (ja) | 1990-09-27 | 1990-09-27 | スピンチャック |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735395Y2 (un) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223194A (ja) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | 枚葉式基板洗浄装置および基板洗浄システム |
| JP2001223195A (ja) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | 枚葉式基板洗浄方法、枚葉式基板洗浄装置および基板洗浄システム |
| JP2002164318A (ja) * | 2000-11-27 | 2002-06-07 | Ishii Hyoki Corp | 基板スピン装置 |
| JP2002319613A (ja) * | 2001-04-23 | 2002-10-31 | Topcon Corp | ウェーハ保持装置 |
| JP2006128359A (ja) * | 2004-10-28 | 2006-05-18 | Disco Abrasive Syst Ltd | スピンナー洗浄装置及びダイシング装置 |
| JP2008060579A (ja) * | 2006-08-30 | 2008-03-13 | Semes Co Ltd | スピンヘッド、及びこれを利用する基板処理方法 |
| JP2008258484A (ja) * | 2007-04-06 | 2008-10-23 | Tatsumo Kk | ウェハクランプ装置 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9130002B2 (en) * | 2010-05-07 | 2015-09-08 | Lam Research Ag | Device for holding wafer shaped articles |
| CN107393855B (zh) * | 2016-05-17 | 2020-10-09 | 上海新昇半导体科技有限公司 | 一种晶圆定位装置及方法 |
-
1990
- 1990-09-27 JP JP10014690U patent/JPH0735395Y2/ja not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001223194A (ja) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | 枚葉式基板洗浄装置および基板洗浄システム |
| JP2001223195A (ja) * | 1999-12-01 | 2001-08-17 | Ses Co Ltd | 枚葉式基板洗浄方法、枚葉式基板洗浄装置および基板洗浄システム |
| JP2002164318A (ja) * | 2000-11-27 | 2002-06-07 | Ishii Hyoki Corp | 基板スピン装置 |
| JP2002319613A (ja) * | 2001-04-23 | 2002-10-31 | Topcon Corp | ウェーハ保持装置 |
| JP4488646B2 (ja) * | 2001-04-23 | 2010-06-23 | 株式会社トプコン | ウェーハ保持装置 |
| JP2006128359A (ja) * | 2004-10-28 | 2006-05-18 | Disco Abrasive Syst Ltd | スピンナー洗浄装置及びダイシング装置 |
| JP4502260B2 (ja) * | 2004-10-28 | 2010-07-14 | 株式会社ディスコ | スピンナー洗浄装置及びダイシング装置 |
| JP2008060579A (ja) * | 2006-08-30 | 2008-03-13 | Semes Co Ltd | スピンヘッド、及びこれを利用する基板処理方法 |
| JP2008258484A (ja) * | 2007-04-06 | 2008-10-23 | Tatsumo Kk | ウェハクランプ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0735395Y2 (ja) | 1995-08-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |