JPH0459132U - - Google Patents
Info
- Publication number
- JPH0459132U JPH0459132U JP10063490U JP10063490U JPH0459132U JP H0459132 U JPH0459132 U JP H0459132U JP 10063490 U JP10063490 U JP 10063490U JP 10063490 U JP10063490 U JP 10063490U JP H0459132 U JPH0459132 U JP H0459132U
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- treatment plate
- cover
- plate
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
Description
図面は本考案に係る基板の熱処理装置の実施例
を示し、第１図は熱処理状態を示す縦断側面図、
第２図は基板給排状態を示す縦断側面図、第３図
は平面図、第４図および第５図は昇降駆動部の正
面図、第６図は要部の斜視図である。
１……ホツトプレート、２……チヤンバー、３
……カバー、４……基板支持ピン、８……支持ア
ーム（昇降体）、１７……エアーシリンダ、３０
……基板給排用開口、３１……シヤツター。
The drawings show an embodiment of the substrate heat treatment apparatus according to the present invention, and FIG. 1 is a vertical side view showing the heat treatment state;
FIG. 2 is a longitudinal sectional side view showing the substrate feeding/discharging state, FIG. 3 is a plan view, FIGS. 4 and 5 are front views of the elevating drive section, and FIG. 6 is a perspective view of the main parts. 1...hot plate, 2...chamber, 3
... Cover, 4 ... Board support pin, 8 ... Support arm (elevating body), 17 ... Air cylinder, 30
...Opening for supplying and discharging circuit boards, 31...Shutter.
Claims (1)
覆う昇降自在なチヤンバーと、熱処理プレートを
外囲するカバーと、カバーの周部に形成された基
板給排用開口を開閉する昇降式のシヤツターと、
熱処理プレートを貫通してプレート上面に出退す
る基板支持ピンと、熱処理プレートの側方に配置
され昇降する昇降体とを備え、 前記チヤンバー、シヤツター、および基板支持
ピンを共通の昇降体に連動連結してそれぞれを同
方向に昇降駆動するように構成したことを特徴と
する基板の熱処理装置。[Claims for Utility Model Registration] A heat treatment plate, a chamber that can be raised and lowered to cover the heat treatment plate from above, a cover that surrounds the heat treatment plate, and an elevator that opens and closes an opening for supplying and discharging substrates formed around the cover. The expression shutter and
The device includes a substrate support pin that penetrates the heat treatment plate and moves up and down to the upper surface of the plate, and an elevating body that is arranged on the side of the heat treatment plate and moves up and down, and the chamber, the shutter, and the substrate support pin are interlocked and connected to the common elevating body. 1. A heat treatment apparatus for a substrate, characterized in that the apparatus is configured to move the substrates up and down in the same direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10063490U JP2523690Y2 (en) | 1990-09-25 | 1990-09-25 | Substrate heat treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10063490U JP2523690Y2 (en) | 1990-09-25 | 1990-09-25 | Substrate heat treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459132U true JPH0459132U (en) | 1992-05-21 |
| JP2523690Y2 JP2523690Y2 (en) | 1997-01-29 |
Family
ID=31843420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10063490U Expired - Lifetime JP2523690Y2 (en) | 1990-09-25 | 1990-09-25 | Substrate heat treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523690Y2 (en) |
-
1990
- 1990-09-25 JP JP10063490U patent/JP2523690Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2523690Y2 (en) | 1997-01-29 |
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