JPH0456826A - Transfer device for fine pattern - Google Patents

Abstract

PURPOSE:To perform accurate and clear transfer by using an alignment mechanism in which a holder part for a substance to be processed and the chuck board part of a fine pattern supporting base plate oppositely provided in parallel with the holder part are made to closely contact after aligning them. CONSTITUTION:This device is provided with the holder part 11 allowing the base plate to be processed 7 be vacuum-sucked, the chuck board part 2 which is oppositely provided in parallel with the part 11 and makes the supporting base plate 11 in which the fine pattern is formed to be vacuum-sucked, the alignment mechanism 3 allowing both the supporting base plate 11 and the base plate to be processed 7 closely contact after aligning them in a state that both of them are made to have a gap, a press-contacting mechanism 4 constituted of a pressure contact system or a vacuum contact system to press-contact the supporting base plate 11 and the substance to be processed 7 which are made to closely contact to each other for a specified time, and a mechanism 5 to peel the supporting substrate 11 and the substance to be processed 7 after press-contacting. Thus, the fine pattern for the transfer can accurately, clearly and also effectively be transferred and formed from the supporting base plate 11 to the substance to be processed 7 at a low price.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a fine pattern transfer device, and more specifically, to the production of thin film transistors, thin film diodes, solar cells, thin film sensors, various semiconductor devices, printed circuit boards, etc. The present invention relates to a transfer device that can be used when forming a fine pattern applied in a process using a transfer means, and is suitable for mass-producing the transfer of the fine pattern with high precision.

[Conventional technology and the problem to be solved by the invention]

Color liquid crystal display using thin film transistors (T
In recent years, PT-LCD (PT-LCD) has been incorporated into pocket TVs and portable TVs, and has just entered the stage of practical use.

Development aimed at display devices is already gaining momentum. Due to these trends, 20 inch, 40 inch, 70 inch
There began to be a demand for manufacturing large TPTs such as inch diameter TPTs. For this reason, the pattern of thin film transistors to be formed has been forced to become smaller and the size of the substrate has become larger, and mass production has become necessary. In response to such production requirements, the current photolithography method has major problems, such as the development of large-scale exposure equipment such as steppers and capital investment, and the fact that there is a limit to the applicable size of the photomask. ing.

On the other hand, instead of the process up to development of the resist film in the photolithography method, a method is also known in which a resist film is directly printed in a desired pattern on the workpiece using a printing method and a fine pattern is formed by etching. ing.

Although the above-mentioned processing method in which the resist film is formed by printing means does not have any major restrictions and can be easily applied to pattern formation due to the increase in the size of products such as TPT of 40 to 70 inches, it has the following problems. There is.

That is, as the above-mentioned printing means, intaglio offset printing method, lithographic offset printing method, side-by-side printing method, screen printing method, etc. are typically applied, but all of these printing methods
Although it is suitable for printing a resist pattern with a relatively large line width (200 μm or more), it is not suitable for printing a fine pattern with a smaller line width. Among them, in the case of the intaglio offset printing method, if a harder ink is used,
Although it is possible to print thin line patterns of about 90 um, the transfer of ink to the workpiece becomes poor, and similarly to other printing methods, when attempting to print thinner line patterns, the coating film thickness becomes thinner. As a result, it was unsuitable for forming resist patterns that required corrosion resistance. Another disadvantage is that the printed resist pattern is deformed due to the influence of the fluidity of the ink, the pressure of the plate, and some of the ink remains on the plate without being transferred, resulting in poor reproducibility of the printed pattern. There was also. Furthermore, the line width, film thickness, etc. of the resist film to be printed may differ depending on the surface condition B of the workpiece (presence or absence of irregularities, etc.), or there may be problems in that it is not possible to print on concave areas. Depending on the type of ink, there is also the problem that good printing cannot be performed due to poor adhesion with ink. Moreover, since the resist film is directly printed on the surface of the workpiece, undesirable impurities (such as Na ions) contained in the printing resist ink may remain in the resist film, and other problems may occur on the workpiece. Depending on the type of paper, there is a problem of contamination caused by printing. Generally, the resist ink used in the above-mentioned printing method has a high viscosity, so it has been impossible to purify it to remove the above-mentioned impurities.

As mentioned above, processing methods using photolithography and printing methods both have advantages and disadvantages, and as a result, mass production is becoming more difficult, especially with the trend of miniaturization of processing patterns of workpieces and enlargement of processing substrates as mentioned above. There was a need for a method that could adequately accommodate trends.

(Means for Solving the Problems) Therefore, as a result of repeated research in order to overcome the various problems of the above-mentioned conventional techniques, the present inventor has developed a method for forming a pattern on a support material separately, instead of using a photomask in the photolithography method. The ultraviolet-blocking electrodeposited layer is transferred onto a workpiece coated with a photoresist, and the resist film is exposed and developed using the ultraviolet-blocking electrodeposited layer, thereby creating a particularly fine pattern of the resist film. can be carried out extremely cheaply and efficiently without sacrificing accuracy compared to conventional methods. Therefore, the desired fine pattern can be processed with high precision, efficiently, and inexpensively through etching processing. Based on the above findings, the present inventors have further conducted research to find a processing method suitable for transferring a fine pattern such as the ultraviolet-blocking electrodeposited layer formed on the above-mentioned support material to the workpiece side. The present invention was completed by developing a transfer device based on the above-mentioned technology.

That is, the fine pattern transfer device of the present invention transfers a fine pattern for transfer of a desired shape formed on a support substrate from the substrate to a workpiece via an adhesive layer coated on the substrate side or the workpiece side. The transfer device includes a holder part that vacuum-chucks a workpiece, a chuck base part that is installed parallel to and opposite to the holder part and vacuum-chucks a support substrate on which a fine pattern has been formed, and the support substrate and the workpiece. An alignment mechanism that brings the workpiece into close contact with the workpiece after aligning them with a gap; A pressure bonding mechanism that uses a pressure bonding method or a vacuum bonding method to press the supported substrate and the workpiece in close contact for a predetermined period; and crimping. This method is characterized by being equipped with a mechanism for separating the workpiece from the subsequent support substrate.

Further, in the apparatus of the present invention, the alignment mechanism moves an image detection unit consisting of a video camera, a microscope, an epi-illumination device, an electronic line generator, and a television monitor, and a chuck table in the front and back, left and right, and rotational directions using a pulse motor. It can be a device consisting of a drive unit for use. Further, the alignment mechanism may be a device that performs positioning using alignment marks provided in advance on the support substrate and the workpiece.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a schematic diagram showing an example of the transfer apparatus of the present invention. As shown in the figure, the apparatus of the present invention basically comprises a holder part 1, a chuck base part 2, an alignment mechanism 3, a pressure bonding mechanism 4, and a peeling mechanism 5.

The holder section 1 includes a holder main body 6 fixed to an apparatus frame 30 or the like, and an air control section 8a for vacuum-adsorbing the workpiece 7 to the lower surface side of the holder main body 6 during the transfer operation. The chuck base 2 includes a chuck base 9 consisting of a surface plate installed parallel to and facing the holder body 6, and a support substrate 11 on which a fine transfer pattern 10 is formed on the chuck base 9. It consists of a control section 8b.

In the figure, reference numeral 12 denotes suction grooves connected to the air control units 8a and 8b through piping, respectively. The workpiece and the supporting substrate are vacuum-suctioned in the suction groove 12 by the operation of the air control unit 8, and are suctioned onto the holder body 6 and the chuck table 9, respectively.

The alignment mechanism 3 includes an image detection section 13 for detecting the positional state of the support substrate and the workpiece using an image, and the detection section 1
Chunk stand 9 (i.e. support substrate 11
) for displacing the alignment drive unit 14. The image detection unit 13 uses a video camera (C
CD camera) 15, a microscope 16 attached to the camera 15
, an epi-illumination device 17 that illuminates the photographing spot, an electronic line generator (CCU) 18 that performs image processing, and a television monitor 19. The driving unit 14 is also powered by a stepping motor 21. which can move the chuck table 9 by a predetermined amount in the front-rear direction (arrow X in the figure) and left-right direction (arrow Y in the figure) on a horizontal plane via a drive transmission mechanism 20. ．． 21. , similarly consists of a stepping motor 21θ that can be moved by a predetermined amount in the rotational direction (the same arrow θ direction) via a drive transmission mechanism 22. It can be activated by and about ±3III11 in both the left and right directions, and about ±3° in the rotational direction.Furthermore, the alignment mechanism 3 is used to bring the support substrate and workpiece into close contact with each other without misalignment after the alignment is completed. , for example, is provided with a close contact mechanism section 23 consisting of a close contact cylinder or the like that can move the chuck stand 9 toward the holder main body 6.

In this embodiment, the alignment mechanism 3 employs the above-mentioned imaging means and is configured to perform positioning using a drive unit consisting of a stepping motor or the like.
This alignment mechanism 3 can be used with any other mechanical structure as long as it can accurately align the supporting substrate and the workpiece with a fixed distance gap (#). May be adopted. The separation distance between the substrate and the workpiece during alignment is selected as appropriate, but it is usually about 15 m.

The crimping mechanism section 4 crimps the support substrate and the workpiece that have been brought into close contact with each other by the alignment mechanism 3 for a predetermined period of time, and employs either a pressure contact method or a vacuum contact method. The crimping mechanism 4 in this embodiment is of a pressure contact type, and is equipped with a pressure cylinder that presses the chuck base 9 by moving it toward the fixed holder body 6. When the crimping mechanism section 4 is of a vacuum contact type, which may also be used as the lifting cylinder 24 of 9, the holder main body 6 and the chuck base 9 come into contact to form a sealed space, although not particularly shown. Configure it like this,
The support substrate and the workpiece are crimped together by evacuating the chamber, which is a closed space, using an air controller. The crimping mechanism 4 may have a structure that uses both of the above methods in combination, if necessary.

The peeling mechanism 5 is not particularly limited as long as it has a drive system structure that can separate the chuck table 9 from the holder body 6 and lower it. It can also be used as a drive unit. When the pressure bonding mechanism 4 is of a vacuum bonding type, this mechanism 5 is equipped with a blow mechanism that blows compressed air into the chamber to cause separation.

Next, the operation of the device of the present invention will be explained.

First, as shown in FIG. 3(a), a fine pattern 1 for transfer is formed.
The support substrate 11 on which 0 has been formed is placed on the chuck stand 9 and vacuum-adsorbed, and the workpiece TyJ7 is placed on the holder body 6.
vacuum adsorption. Note that an adhesive layer 25 is coated on the surface of the support substrate 11 on which the fine pattern 10 is formed. This adhesive layer 25 is for easily and reliably transferring the fine pattern by the apparatus of the present invention, and does not necessarily need to be provided on the substrate side, and may be formed by coating on the workpiece 7 side.

Next, the lifting cylinder 24 is operated so that the distance between the workpiece 7 and the support substrate 11 is approximately 15+mW, and the carriage 9 is stopped from rising. Thereafter, while monitoring the positional relationship between the workpiece 7 and the support substrate 11 using the image detection section 13, the operation panel is operated to operate a predetermined stepping motor of the drive section 14 to move the chuck table 9 back and forth, left and right, or The workpiece is moved slightly in the rotational direction to align the workpiece and the support substrate. Alignment can be performed based on any index as shown in Figure 2, but usually alignment marks are formed on the workpiece and the supporting substrate in advance, and these marks are aligned. conduct.

After the alignment is completed, the chuck table 9 is raised by the close contact cylinder 23 of the alignment mechanism, and the support substrate 1 is
1 is brought into close contact with the workpiece 7.

Next, the lifting cylinder 24, which also serves as a pressurizing cylinder of the crimping mechanism 4, is operated to press the chunk table 9 toward the holder body 6, and support the workpiece 7 as shown in FIG. 3(b). The substrate 11 is pressed for a predetermined period of time.

If this pressure bonding is performed using a pressure bonding mechanism that also uses a vacuum bonding method, better and more stable transfer can be achieved.

After the crimping is completed, Wil, which also serves as the driving part of the peeling mechanism 5,
1 cylinder 24 is lowered to lower the support board 11 from the workpiece 7 (FIG. 3(C)). As a result of this peeling, the transfer fine pattern 1O is peeled off from the support substrate 11 and transferred to the workpiece 7. Finally, the workpiece 7 onto which the fine pattern 10 has been transferred is removed from the holder main body 6 by vacuum suction, thereby completing the transfer of the fine pattern by the apparatus of the present invention.

By repeating the above process operations, the apparatus of the present invention can transfer fine patterns in a mass-produced manner with high precision.

The following materials were used as the support substrate 11 on which the fine pattern 10 described above was formed and the workpiece 7. First, as the supporting substrate, a water-soluble photosensitive solution containing PVA/ammonium dichromate as the main ingredients is applied to a 0.2 m thick stainless steel supporting sheet, and then exposed and developed using a mask of a predetermined shape. After forming an insulating layer 26 consisting of a pattern with a line width of 10 μm and a film thickness of 1.0 μm (FIG. 3(a)), and further performing a burning process to strengthen the water resistance and electrical insulation properties of the insulating layer, an Nl plate was formed. Electrodeposition was carried out using the bath as an anode and the support sheet as a cathode and the electrodeposition conditions as shown below to form a nickel electrodeposition layer with a thickness of 1.2 μm on the exposed stainless steel surface of the support sheet, and this electrodeposition layer was transferred. A support substrate having a fine pattern 10 was used. Prior to vacuum attachment to the chuck table, a vinyl acetate-based adhesive solution was applied to the entire surface of the support substrate on the pattern-forming side so that the film thickness was 1.2 μm.

Sole for silkworms/Ninkel sulfate 250g/j!・Nickel chloride 45g/l ・Boric acid 30g/l! Single-row production...PH: 4.5, temperature: 50°C2 current density: 5A/dI11" On the other hand, as a workpiece, a silicon workpiece base material with a thickness of 0
．． A 1 μm a-3i film was used, and a photoresist (0FPR manufactured by Tokyo Ohka Chemical Co., Ltd.) was applied to the film-formed side to a thickness of 1.5 μm for the etching process described below. did. The film-formed part of the workpiece is finally processed, and when it is adsorbed onto the holder main body, the film-formed surface thereof faces downward.

After the transfer by the apparatus of the present invention described above is completed, the workpiece is irradiated with ultraviolet rays from the side of the electrodeposited layer, which is a fine pattern. After the resist film is developed and the development is complete, dry etching is performed using CF4 gas containing 5% oxygen, and finally the resist film, adhesive layer, and electrodeposited layer can be removed and processed using a conventional method. . As a result, a line pattern with a line width of 10 μm corresponding to the fine pattern for transfer is formed on the workpiece.

〔Effect of the invention〕

As explained above, since the apparatus of the present invention has the above-described configuration, it is possible to accurately and clearly transfer and form a fine pattern for transfer from a support substrate to a workpiece, efficiently and at low cost. Furthermore, according to the apparatus of the present invention, since the fine pattern for transfer (in other words, the supporting substrate) and the workpiece are transferred in a parallel state, the pattern is accurately restored on the workpiece after the transfer, and thereby the pattern can be accurately restored. A clear and accurate transfer is made. When attempting to form a fine pattern such as the one described above on a workpiece using printing means, in conventional printing methods, inking on the printing plate is done by rubbing viscous ink onto the image area. Physical forces such as pressure force, sliding force, and tensile force act on the ink, which is a viscous material, in a complex manner, making it impossible to ink the printed area accurately and, as a result, unable to print a faithful fine pattern.

Therefore, the inventor of the present invention has focused on the fact that the condition for performing faithful inking on the image area is to eliminate the above-mentioned physical force and perform completely static inking. By arranging the transfer so that the pattern and the workpiece are arranged in parallel, it is possible to transfer and form a fine pattern with high precision.

Furthermore, in the case where the alignment mechanism is composed of the image detection section and the alignment drive section as described above, the apparatus of the present invention can accurately and reliably position the workpiece by operating the drive section while monitoring the positional relationship between the support substrate and the workpiece. Furthermore, by using the alignment mark, it is possible to transfer a fine pattern with even more accuracy and precision.

As described above, the apparatus of the present invention is capable of transferring fine patterns in mass production with high precision.
Although it is most suitable for use in transferring and forming fine patterns on functional workpieces such as printed circuit boards, it can also be fully utilized in other fields such as color filter micromachining.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram showing an example of the transfer device of the present invention, Fig. 2 is an explanatory diagram of the main part showing the state of the alignment process by the device of the present invention, and Figs. 3 (a) to (C) are transfer by the device of the present invention. It is a schematic sectional view for explaining a process. 1...Holder part 2...Chunk base part 3
...Alignment mechanism 4...Crimp mechanism 5...
Peeling mechanism 7...Workpiece lO...Fine pattern for transfer 13...Image detection unit 16...Microscope 18...Electron line generator 21, . 21. ．． 21θ...Station 25...Adhesive layer 11...Support substrate 15...Video camera 17...Epi-illumination device 19...TV monitor soaping motor 10...Fine pattern for transfer 16... ·microscope

Claims (3)

[Claims] (1) A transfer device that transfers a fine transfer pattern of a desired shape formed on a support substrate from the substrate to a workpiece via an adhesive layer coated on the substrate side or the workpiece side, A holder part that vacuum-chucks the workpiece, a chuck base part that is installed parallel to and opposite to the holder part and vacuum-chucks a support substrate on which a fine pattern has been formed, and a gap between the support substrate and the workpiece. an alignment mechanism that brings the two into close contact after alignment in a state where the support substrate and the workpiece are in close contact with each other; a pressure bonding mechanism that uses a pressure contact method or a vacuum contact method that presses the support substrate and the workpiece in close contact for a predetermined period of time; A fine pattern transfer device characterized by being equipped with a mechanism for peeling off objects. (2) The alignment mechanism includes an image detection unit consisting of a video camera, a microscope, an epi-illumination device, an electronic line generator, and a television monitor, and an alignment drive unit that moves the chuck table back and forth, left and right, and in rotational directions using a pulse motor. 2. The fine pattern transfer device according to claim 1, comprising: (3) The fine pattern transfer method according to claim 1 or 2, wherein the alignment mechanism is a mechanism that performs positioning using alignment marks provided in advance on the support substrate and the workpiece.