JPH0456299A - Lead joining device for ic component - Google Patents

Abstract

PURPOSE:To enhance a joint between a lead and an electrode for higher reliability by a method wherein a lead presser which presses the lead of an electronic component against the electrode is formed of material which transmits a laser beam. CONSTITUTION:A mounting head 7 is made to descend, and an IC component 1 is mounted on a board 3. Furthermore, the mounting head 7 is made to descend and stop when lead pressers 13 are made to recede into recessed grooves 12 of the mounting head 7 by a prescribed distance resisting the energizing force of a compressed coil spring 18, and leads 1a of the IC component 1 are pressed against electrode 3a of the board 3. Then, a laser beam radiation means 37 enables a laser beam to impinge vertically on a laser beam incidence plane 13a of the lead presser 13, the laser beam is applied to the lead 1a in contact with the lead pressing plane 13b to fuse a joining metal layer 41 by heating to join the lead 1a to the electrode 3a, penetrating through the lower end of the lead presser 13.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is an I
This relates to a lead bonding device for C components.

Conventional technology I proposed by the present applicant in Japanese Patent Application No. 2-12959
As shown in FIG. 8, the C component lead bonding device includes a lead pressurizing section that presses the lead C of an IC component mounted at a predetermined position on a substrate a to an electrode e on which a bonding metal layer d is disposed. f
The lead pressurizing part r is provided with a laser light passage hole for allowing the laser light g to pass through and irradiate the lead C portion.

According to this prior art, it is possible to reliably press the tip and base of the portion of each lead C in contact with the electrode e, so that the lead is simply placed on the electrode via the bonding metal layer. A highly reliable bonded state can be obtained compared to the conventional method in which the bonding metal layer is heated and melted while the bonding metal layer is placed to bond the two.

Problems to be Solved by the Invention However, in the above-mentioned prior art, although it is possible to pressurize the tip and base of the lead, it is possible to pressurize the intermediate portion between the tip and the base of the lead, that is, the portion that is irradiated with laser light. Since pressure cannot be applied, there is a drawback that the bond between the lead and the electrode is insufficient.

In view of the above-mentioned problems of the prior art, the present invention provides an IC component lead bonding device that can pressurize the laser beam irradiated part of the lead and further improve the reliability of the bond between the lead and the electrode. With the goal.

Means for Solving the Problems In order to achieve the above object, the first invention of the present application provides an IC equipped with a laser beam irradiation means for irradiating a laser beam to a lead portion of an IC component mounted at a predetermined position on a substrate. A lead bonding device for components, characterized in that a lead pressure section is arranged to press the leads of the IC component toward the electrodes on the substrate, and the lead pressure section is formed of a laser beam transmitting material. In addition, in the second invention of the present application, in order to reduce the amount of deviation in the irradiation position due to refraction of the laser beam at the lead pressing part in the first invention, the laser beam incident surface of the lead pressing part is set to the laser beam. It is characterized by being approximately vertical.

Furthermore, in the third invention of the present application, in order to avoid variations in the pressing force of the lead pressing part to the leads in the first invention, the lead pressing part is divided into a plurality of parts along the direction in which the leads are arranged,
Further, the present invention is characterized in that a biasing means for biasing each lead pressure section in the pressure direction is provided.

According to the first aspect of the present invention, the lead pressurizing part that presses the lead of the IC component toward the electrode is formed of a laser light transmitting material, so that the laser light irradiation part of the lead is not affected by the laser light irradiation. Since it is possible to pressurize without
The entire portion of the lead to be joined to the electrode can be pressurized toward the electrode. Thereby, the connection between the lead and the electrode can be ensured.

In the first invention, if the passage path of the laser beam is bent by the lead pressurizing portion, the laser beam may not be irradiated onto a predetermined portion of the lead and the bonding metal layer may not be sufficiently heated and melted. On the other hand, according to the second invention, by making the laser beam incident surface of the lead pressurizing part approximately perpendicular to the laser beam, the passage path of the laser beam can be made approximately straight, so that the laser beam It is possible to avoid deviation of the lead from the predetermined irradiation portion of the lead, and it is possible to reliably heat and melt the predetermined bonding metal layer.

In the first aspect of the invention, if there is variation in the thickness of the bonding metal layer on the electrode, it is necessary to apply a large load to the entire lead pressurizing section in order to absorb this variation. On the other hand, according to the third invention, the lead pressure section is divided into a plurality of parts along the direction in which the leads are lined up, and each lead pressure section is biased in the pressure direction by the biasing means, thereby reducing the light load. Variations in the thickness of the bonded metal layer can be absorbed by applying pressure. Furthermore, if the lead pressurizing section is divided into widths that are approximately the same as the beam diameter of the laser beam used, it is possible to pressurize the lead portion for each laser beam irradiation range, so that the bond between the electrode and the electrode can be pressurized. This is preferable because pressure can be efficiently applied with a small pressure force to each lead in which the metal layer is heated and molten.

Embodiments FIGS. 1 to 5 show how the present invention is applied to each IC component 1 from a carrier film 2 in which a plurality of IC components 1 are integrally formed.
This figure shows a first embodiment applied to an IC component mounting machine that cuts and separates the IC components and mounts them on a printed circuit board 3.

In FIG. 3 showing the overall configuration of the IC component mounting machine, a board transport means 5 for transporting and positioning the printed circuit board 3 to a predetermined position is mounted on the front part of the top surface of the mounting machine main body 4, and a tape-shaped board is mounted on the rear part of the top surface. Cutting means 6 for cutting and separating the IC components 1 from the carrier film 2 are respectively provided. Between the substrate transport means 5 and the cutting means 6, a mounting head 7 capable of holding the IC component 1 is horizontally moved between the cutting means 6 and an arbitrary position on the positioned substrate 3. A robot 8 is installed. Further, at the rear of the mounting machine main body 4, a component supply means 9 for feeding and supplying the carrier film 2 to the cutting means 6 is arranged.

A plurality of IC components 1 are integrally formed on the carrier film 2 at appropriate intervals in the longitudinal direction thereof. In other words, the carrier film 2 has an inner lead and an outer lead (
By mounting the IC chip on the carrier film 2 and integrally sealing the bumps and the inner leads with resin, the IC component can be assembled as shown in FIG. 4. One main body 1b is formed, and one door 1a is formed protruding from the main body 1b in all directions. The carrier film 2 is notched at the lead 1a. The device head 7 is made of stainless steel and has a substantially rectangular cross-sectional shape, and has a suction hole 1 at the axial center position as shown in FIG.
0 is formed, and the main body 1b of the IC component 1 is formed on the lower end surface.
An accommodation recess 11 for accommodating the suction hole 10 is connected to the lower end opening of the suction hole 10. As shown in FIG.
A book quartz lead pressing section 13 is arranged to be movable up and down. Dimensions in the arrangement direction of the lead pressurizing part 13 in this embodiment! is set to be approximately the same size as the beam diameter of the laser beam used in this mounting machine.

The upper part of the groove part 12 is attached to the mounting head 7 with two screws 14.
The lead pressurizing section 13 is covered with a cover 15 attached thereto, and accommodates the upper part of the lead pressurizing section 13. Further, a regulating recess 16 is formed in the lower portion of the groove 12 to receive the bent portion of the lead presser 13 toward the mounting head 7 and to restrict the vertical movement range of the lead presser 13. A compression coil spring (biasing means) 18 is provided between the upper wall surface of the groove portion 12 and a holding recess 17 formed at the upper end of the lead pressing portion 13 to constantly urge the lead pressing portion 13 downward. It has been intervened.

The outer inclined surface of the lower end of the lead pressurizing section 13 serves as a laser light incident surface 13a perpendicular to the laser light irradiation direction. The inner surface of the lower end of the lead pressurizing part 13 is attached to the mounting pad 7.
The lead pressing surface 13b comes into pressure contact with the lead 1a of the IC component 1 held by suction. This lead pressure surface 13b projects slightly downward from the lower end surface of the mounting head 7 when the lead pressure section 13 is at the lowest position with respect to the mounting head 7. A ceramic sprayed film 19 is formed on the outer surface of the lower end of the lead pressurizing portion 13 to prevent the laser light incident from the laser light incident surface 13a from being emitted to the outside from the lower end surface. Also, the adjacent lead pressurizing section 1
By providing notches 13c on the side surfaces of the lower ends of the leads 3 to exhaust flux smoke generated during lead joining, both lead pressurizing parts 13 are prevented from becoming stuck due to the flux smoke.

As shown in FIG. 5, the mounting head 7 is supported at its upper end by the elevating body 20 so as to be rotatable around a vertical axis, and is connected to a rotary positioning motor 21 installed on the elevating body 20. There is. This elevating body 20 is configured to be movable up and down relative to the movable part 8a of the XY robot 8 by means of a feed screw mechanism 22 and an elevating motor 23 installed on the movable part 8a of the XY robot 8.

A bracket 25 having a through-cylindrical portion 24 through which the mounting head 7 passes in the vertical direction is fixed to the lower part of the movable portion 8a. A pulley 26 is provided on the lower outer periphery of the through cylinder portion 24.
is rotatably attached to the through-tube portion 24 via a bearing 27 around a vertical axis. This pulley 26 and a rotation motor 28 disposed on the lower surface side of the bracket 25
A toothed belt 3o is wound between the drive pulley 29 and the drive pulley 29.

Further, a movable body 32 is attached to a rotary frame 31 fixed to the lower surface of the pulley 26 via a slide bearing 33, and is movable in a straight line in a horizontal plane with respect to the rotary frame 31. This movable body 32 is driven by a moving motor 34 fixed to the upper surface of the rotating frame 31 and a rack and pinion mechanism 35 disposed between the two.

Further, on the lower surface side of the movable body 32, a guide member 1 is guided and supported by the movable body 32 so as to be able to move toward and away from the axis of the mounting head 7 in a direction orthogonal to the moving direction of the movable body 32 in a horizontal plane. A pair of spacing adjusters 36a and 36b are provided. Laser light irradiation means 37 for irradiating laser light onto the laser light incident surface 13a of the lead pressurizing section 13 is attached to each of these space adjustment bodies 36a and 36b.
The distance between the two laser beam irradiation means 37, 37 can be adjusted by moving them toward and away from each other. These spacing adjustment bodies 36a,
A feed screw shaft 38, which is disposed horizontally and has opposite threads to each other around the axial center position of the mounting head 7, is screwed into one side of the 36b. This feed screw shaft 38 is rotationally driven by an interval adjustment motor 39 fixedly provided on the lower surface side of the movable body 32. A suction means 40 is disposed near the lower end of the laser beam irradiation means 37 for sucking and exhausting fumes generated when the bonding metal layer 41 on the substrate electrode 3a is melted by laser beam irradiation. established).

In the above configuration, the component supply means 9 supplies the carrier film 2 to the cutting means 6, and at the same time the mounting head 7
is positioned directly above the cutting means 6 and then lowered, thereby cutting and separating the IC component 1 from the carrier film 2 between the mounting head 7 and the cutting means 6, and cutting and separating the IC component 1 from the carrier film 2.
is held by suction with its main body 1b fitted into the holding recess 11 of the mounting head 7.

In this state, the mounting head 7 is raised and moved in the X-Y direction by the X-Y robot 8, and is positioned directly above the mounting position of the board 3 which has been positioned at a predetermined position by the board transport means 5. As shown in FIG. 2, a bonding metal layer 41 is previously formed on the electrode 3a of the substrate 3 to which the lead 1a of the IC component 1 is to be bonded. This bonding metal layer 41 is formed by applying a cream solder paste flow, solder plating, solder dipping, or the like.

Next, the mounting head 7 descends to mount the IC component 1 onto the substrate 3. Note that the mounting posture of the IC component 1 can be adjusted by rotating the mounting head 7 around its axis. Further, in the mounting head 7, each lead pressurizing portion 13 resists the biasing force of the respective compression coil spring 18 and presses the concave groove portion 12 of the mounting head 7.
It descends to a position where it retracts a predetermined amount inside and stops. Due to the biasing force, the lead pressing surfaces 13b of each lead pressing section 13 press the leads 1a of the IC component 1 toward the electrodes 3a of the substrate 3, respectively.

Next, a laser beam is made perpendicularly incident on the laser beam incident surface 13a of each lead pressurizing section 13 from the laser beam irradiation means 37, and the laser beam is transmitted through the lower end of the lead pressurizing section 13 to By irradiating the portion of the lead 18 in contact with the pressure surface 13b, the bonding metal layer 41 can be heated and melted to bond the lead 1a and the electrode 3a. At the time of this bonding, the entire portion of the lead la in contact with the electrode 3a is pressurized toward the electrode 3a, so the lead 1
It is possible to prevent floating and positional deviation of a, and it is possible to reliably join the two.

This laser beam irradiation is performed by scanning the laser beam along two mutually parallel sides of the IC component 1 by moving the moving body 32 in a straight line in a horizontal plane while irradiating laser beams from both laser beam irradiation means 37 respectively. It will be done. Therefore, 1 of the moving body 32
By the linear movement twice, the two opposing sides of the IC component 1 are joined together. Next, the rotation frame 31 is rotated 90 degrees in the horizontal plane.
After rotating the position of the laser beam irradiation means 37 by rotating the moving body 32, the movable body 32 linearly moves in a horizontal plane in a direction perpendicular to the direction of the linear movement while irradiating the laser beam.

Thereby, the remaining two sides of the IC component 1 can be joined together.

The present invention can be configured in various ways other than those shown in the above embodiments. For example, in the above embodiment, the lead pressure section is provided integrally with the mounting head, but it may be provided separately from the mounting head.

Further, as in the second embodiment of the present invention shown in FIG. 6, laser beam transmission holes 7a are formed in the laser beam transmission portion of the mounting head 7, and each laser beam transmission hole 7a is provided with a laser beam transmission hole 7a. The lead pressure section 13 made of a member is fitted and fixed, and a biasing means (
(not shown) can be attached between the mounting member and a support member (not shown) that guides and supports the ladder 7 so as to be movable up and down.

Furthermore, as in the third embodiment of the present invention shown in FIG. 7, at least the entire upper end of the mounting head 7 is made of a member that can transmit laser light, so that the lower end constitutes the lead pressing section 13. be able to.

Effects of the Invention According to the first invention of the present application, since the laser beam irradiated portion of the lead can be pressed toward the electrode on the substrate, the lead and the electrode can be reliably joined.

According to the second invention of the present application, since the passage path of the laser beam can be made substantially straight, it is possible to avoid deviation of the laser beam from a predetermined irradiation area of the lead, and the metal layer bonded by the laser beam can be avoided. can be reliably heated and melted.

According to the third aspect of the present application, variations in the thickness of the bonding metal layer can be absorbed by applying a light load.

[Brief explanation of the drawing]

FIG. 1 is a partial longitudinal sectional side view of the main part of the first embodiment of the present invention;
Figure 2 is a side view thereof, Figure 3 is a perspective view showing the overall configuration of the IC component mounter, Figure 4 is a perspective view of the IC component, and Figure 5 is a partial longitudinal sectional side view of the main parts of the IC component mounter. , FIG. 6 is a longitudinal sectional side view of the main part of the second embodiment of the present invention, FIG. 7 is a longitudinal sectional side view of the main part of the third embodiment of the invention, and FIG. 8 is a longitudinal sectional view of the main part of the prior art. FIG.

Claims (3)

[Claims] (1) In an IC component lead bonding device equipped with a laser beam irradiation means for irradiating a laser beam to the lead portion of an IC component mounted at a predetermined position on a substrate, the lead of the IC component is connected to an electrode on the substrate. 1. A lead bonding device for IC components, characterized in that a lead pressure section for pressurizing the leads is arranged, and the lead pressure section is formed of a laser beam transmitting material. (2) The IC according to claim 1, wherein the laser beam incident surface of the lead pressurizing portion is substantially perpendicular to the laser beam.
Parts lead joining equipment. (3) The lead pressing section is divided into a plurality of parts along the direction in which the leads are lined up, and a biasing means for urging each lead pressing section in the pressing direction is provided. Lead joining equipment for IC parts.