JPH0455675A - Immersion dc-dc converter cooler - Google Patents

Abstract

PURPOSE:To miniaturize a device, and make water extracting work and the like of a cold plate upon maintenance and/or replacement unnecessary by a method wherein heat generating parts are mounted on the inside of a sealed vessel of heat conductive material, a heat pipe for cooling refrigerant solution is fixed and the sealed vessel is cooled by a cold plate. CONSTITUTION:A heat transfer plate 2 is provided on one surface among flat surfaces constituting a sealed vessel 1 and a main transistor 13 as well as a secondary rectifying diode 14 are mounted on the heat transfer plate 2 while a heat pipe 3, cooling refrigerant solution 8, into which other heat generating parts are dipped, is embedded into the surface and a cold plate 12 is provided at the outside of the sealed vessel 1 whereby heat, transferred to the heat transfer plate 2, is transferred to refrigerant such as water and the like which circulates through the flow passage 11 in the cold plate 12 from a water inlet port 17 to a water outlet port 18 to cool the heat transfer plate 2 and, therefore, forced air cooling by a fan is not necessitated and the device can be miniaturized. On the other hand, the possibility of the short-circuit of internal parts is eliminated and the work of extracting of water in a cold plate 12 and the like upon maintenance or replacement can be unnecessitated.

Description

DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to an immersion DC-DCC type cooler, and more particularly to a method for cooling a DC-DC converter used in an electronic computer.

BACKGROUND ART Conventionally, a common method for cooling a DC-DC converter was to perform forced cooling using a fan provided at the bottom of a power supply.

On the other hand, in recent years, as the density of logic boards has increased, power consumption has increased, and power supplies with large capacity and small size have become necessary.

However, with forced air cooling, the heat sink becomes large, so miniaturization cannot be expected, and if the air volume is increased, noise regulations cannot be met, so a soundproof structure must be maintained, so a liquid cooling system is needed instead of forced air cooling. Become.

As shown in FIG. 2, this liquid cooling system uses a transformer 5, a choke coil 6, and a secondary rectifier diode 14.
A circuit board 21 equipped with a circuit board 21 is inserted into a connector 22 provided at the bottom of a metal or plastic sealed container 20, and a heat exchanger 23 is provided as a condenser between the refrigerant liquid 8 and the top of the sealed container 20. There is a method of cooling each component (heat generating component) on the circuit board 21 with water or other refrigerant injected into the heat exchanger 23.

Here, as the refrigerant liquid 8, various fluorocarbons, which are non-corrosive and non-dissociative solutions, are used.

In addition, as another cooling method, as shown in FIG. 3, there is an internal flow path (not shown) in which a refrigerant such as water is circulated by flowing in from the water inlet 26 and discharging the pressure from the water outlet 27. The secondary rectifier diode 14 and the like are mounted on a metal cold plate 25, and the cold plate 25 directly conducts conductive cooling of the secondary rectifier diode 14 and the like, and heat-generating components such as the transformer 5 and choke coil 6 are cooled by a fan (not shown). ) is a method of forced air cooling.

In such a conventional DC-DC converter cooling method, when each component (heat generating component) on the circuit board 21 is cooled by immersing it in the refrigerant liquid 8, the total calorific value of the heat generating components on the circuit board 21 is extremely low. Since the refrigerant liquid 8 is large in size, a large heat exchanger 23 is required to cool the refrigerant liquid 8, and there is a drawback that the device cannot be miniaturized.

In addition, 1. When heat-generating components such as secondary rectifier diodes 1-4 are directly conduction-cooled using the cold plate 25, since there are many types of heat-generating components and their shapes vary, they are mounted on the cold plate 25 for conductive cooling. There are some parts that cannot be cooled by being mounted on the cold plate 25, and there is a drawback that parts that cannot be cooled by being mounted on the cold plate 25 must be forcedly cooled by a fan.

Furthermore, by providing the heat exchanger 23 and cold plate 25 inside the DC-DC converter, there is a risk of short-circuiting of internal parts, and it is necessary to drain water from the cold plate during maintenance and replacement. There are drawbacks.

Purpose of the Invention The present invention has been made in order to eliminate the above-mentioned drawbacks of the conventional devices.There is no need for forced air cooling using a fan, the device can be made more compact, and the risk of short-circuiting of internal parts is eliminated. , Immersion D C-D, which eliminates the need for work such as draining water from the cold plate during maintenance and replacement.
The purpose is to provide a C converter cooler.

Structure of the Invention The immersion DC-DC converter cooler according to the present invention includes a sealed container filled with a refrigerant liquid and for cooling a DCDC Humbatater with the refrigerant liquid, and provided on one of the planes constituting the sealed container, a heat transfer member on which a heat generating component is mounted; a heat pipe fixed to the inside of the sealed container of the heat transfer member to cool the refrigerant liquid filled in the sealed container; and an outside of the sealed container of the heat transfer member. A cold plate is fixed to the heat transfer member and includes a flow path for circulating a refrigerant for cooling the heat generating component mounted on the heat transfer member.

Embodiment Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention. In the figure, parts such as a DC-DC converter, a transformer 5 and a choke coil 6, and a circuit board 7, which constitute a DC-DC converter, are housed in a sealed container 1, immersed in a refrigerant liquid 8.

Input/output current and signal input/output to each of these parts are as follows:
This is done via a sealed connector 9 and a busper 10.

The main transistor 13 and secondary rectifier diode 14 inside the sealed container 1 are provided with insulating materials 15a and 15b inside the sealed container 1 of the heat exchanger plate 2, which is one of the planes constituting the sealed container 1.
It is fixed by screws 16a to rollers C through.

In addition, a part of the heat pipe 3 which is a heat conduction element is embedded inside the sealed container of the heat transfer plate 2, and a cold plate 12 having a flow path 11 is provided outside the sealed container 1 of the heat transfer plate 2. It is fixed by screws 4a to 4c.

A flow path 11 within the cold plate 12 is connected to a water inlet 17 and a water outlet 18 .

Therefore, the heat generated by the main transistor 13 and the secondary rectifier diode 14 is transmitted to the heat transfer plate 2, and the heat generated by the transformer 5, choke coil 6, and circuit board 7 transmitted to the heat input part of the heat pipe 3 via the refrigerant liquid 8 is transmitted to the heat transfer plate 2. Heat generated by other heat generating components such as the above components is transmitted from the heat radiating portion of the heat pipe 3.

The heat transferred to the heat transfer plate 2 is transferred to the cold plate 12, and is therefore transferred to the refrigerant such as water circulating in the flow path 11 in the cold plate 12 from the water inlet 7 to the water outlet 18.

As a result, the heat generated by the main transistor 13 and the secondary rectifier diode]4 is transferred to the heat exchanger plate 2 and the cold plate 12.
Since the number of parts to be liquid-cooled by the refrigerant liquid 8 is reduced, and the amount of heat generated by cooling the immersion liquid is reduced, it is possible to make the heat pipe 3, which is a heat exchanger used for cooling the refrigerant liquid 8, smaller. This makes it possible to downsize the device.

Furthermore, since the transformer 5, choke coil 6, and various parts on the circuit board 7, which cannot be fixed to the heat exchanger plate 2, are cooled by immersion liquid, there is no need for forced air cooling using a fan.

Furthermore, by installing the cold plate] 2 outside the sealed container 1, refrigerant such as water is not introduced into the DC-DC converter, eliminating the risk of short circuits of internal parts. ] 2 can be removed, so there is no need to drain water from inside the cold plate 12 during maintenance or replacement.

In this way, the heat transfer plate 2 is provided on one of the planes constituting the sealed container 1, and the main transistor 13 is mounted on this heat transfer plate 2.
In addition to mounting a secondary rectifier diode 14, a heat pipe for cooling the refrigerant liquid 8 immersed in other heat generating parts is embedded, and the second heat transfer plate 2 is cooled by the cold plate 12. There is no need for forced air cooling, which allows the device to be made more compact, eliminates the risk of short-circuiting of internal parts, and eliminates the need to drain water from the cold plate 12 during maintenance and replacement. .

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, as described in detail, a heat transfer member is provided on one of the planes constituting the sealed container, a heat generating component is mounted on the inside of the sealed container of the heat transfer member, and the refrigerant liquid is cooled. By fixing the heat pipe and cooling the heat transfer member with a cold plate, there is no need for forced air cooling using a fan, the device can be made more compact, and the risk of short-circuiting of internal parts is eliminated. This has the effect of eliminating the need for work such as draining water from the cold plate during maintenance and replacement.

[Brief explanation of drawings]

FIG. 1 is a sectional view of one embodiment of the present invention, FIGS.
The figure shows a conventional example. Explanation of symbols of main parts 1... Sealed container 2... Heat exchanger plate 3... Heat pipe 8... Refrigerant liquid 11... Channel 12 ...Cold plate diagram 1

Claims (1)

[Claims] (1) The refrigerant liquid is filled, and the DC-DC
a sealed container for cooling the converter in liquid immersion; a heat transfer member provided on one of the planes constituting the sealed container and mounting a heat generating component; and a heat transfer member fixed to the inside of the sealed container of the heat transfer member, the sealed container a heat pipe that cools the refrigerant liquid filled therein; and a flow path that is fixed to the outside of the sealed container of the heat transfer member and that circulates a refrigerant that cools the heat generating components mounted on the heat transfer member. 1. A immersion DC-DC converter cooler comprising: a cold plate;