JPH0455418Y2 - - Google Patents
Info
- Publication number
- JPH0455418Y2 JPH0455418Y2 JP1987049117U JP4911787U JPH0455418Y2 JP H0455418 Y2 JPH0455418 Y2 JP H0455418Y2 JP 1987049117 U JP1987049117 U JP 1987049117U JP 4911787 U JP4911787 U JP 4911787U JP H0455418 Y2 JPH0455418 Y2 JP H0455418Y2
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- solder
- circuit board
- hole
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 24
- 238000005476 soldering Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 239000006071 cream Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987049117U JPH0455418Y2 (US20080293856A1-20081127-C00127.png) | 1987-04-01 | 1987-04-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987049117U JPH0455418Y2 (US20080293856A1-20081127-C00127.png) | 1987-04-01 | 1987-04-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63157166U JPS63157166U (US20080293856A1-20081127-C00127.png) | 1988-10-14 |
| JPH0455418Y2 true JPH0455418Y2 (US20080293856A1-20081127-C00127.png) | 1992-12-25 |
Family
ID=30871269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987049117U Expired JPH0455418Y2 (US20080293856A1-20081127-C00127.png) | 1987-04-01 | 1987-04-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0455418Y2 (US20080293856A1-20081127-C00127.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511181U (US20080293856A1-20081127-C00127.png) * | 1978-07-10 | 1980-01-24 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49137088U (US20080293856A1-20081127-C00127.png) * | 1973-03-28 | 1974-11-26 | ||
| JPS5931016Y2 (ja) * | 1978-10-05 | 1984-09-03 | 宇呂電子工業株式会社 | ア−ス接続装置 |
-
1987
- 1987-04-01 JP JP1987049117U patent/JPH0455418Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5511181U (US20080293856A1-20081127-C00127.png) * | 1978-07-10 | 1980-01-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63157166U (US20080293856A1-20081127-C00127.png) | 1988-10-14 |
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