JPH0455338B2 - - Google Patents
Info
- Publication number
- JPH0455338B2 JPH0455338B2 JP59155268A JP15526884A JPH0455338B2 JP H0455338 B2 JPH0455338 B2 JP H0455338B2 JP 59155268 A JP59155268 A JP 59155268A JP 15526884 A JP15526884 A JP 15526884A JP H0455338 B2 JPH0455338 B2 JP H0455338B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling fins
- fins
- fin
- cooling fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15526884A JPS6135526A (ja) | 1984-07-27 | 1984-07-27 | 半導体装置の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15526884A JPS6135526A (ja) | 1984-07-27 | 1984-07-27 | 半導体装置の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6135526A JPS6135526A (ja) | 1986-02-20 |
| JPH0455338B2 true JPH0455338B2 (pm) | 1992-09-03 |
Family
ID=15602193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15526884A Granted JPS6135526A (ja) | 1984-07-27 | 1984-07-27 | 半導体装置の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6135526A (pm) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4964458A (en) * | 1986-04-30 | 1990-10-23 | International Business Machines Corporation | Flexible finned heat exchanger |
| JP7188120B2 (ja) * | 2019-01-22 | 2022-12-13 | 株式会社デンソー | 車両用空調装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52159167U (pm) * | 1976-05-28 | 1977-12-02 | ||
| JPS55140255A (en) * | 1979-04-18 | 1980-11-01 | Nec Corp | Heat sink structure |
-
1984
- 1984-07-27 JP JP15526884A patent/JPS6135526A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6135526A (ja) | 1986-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |