JPH0455338B2 - - Google Patents

Info

Publication number
JPH0455338B2
JPH0455338B2 JP59155268A JP15526884A JPH0455338B2 JP H0455338 B2 JPH0455338 B2 JP H0455338B2 JP 59155268 A JP59155268 A JP 59155268A JP 15526884 A JP15526884 A JP 15526884A JP H0455338 B2 JPH0455338 B2 JP H0455338B2
Authority
JP
Japan
Prior art keywords
cooling
cooling fins
fins
fin
cooling fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59155268A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6135526A (ja
Inventor
Hitoshi Matsushima
Takehiko Yanagida
Hisashi Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15526884A priority Critical patent/JPS6135526A/ja
Publication of JPS6135526A publication Critical patent/JPS6135526A/ja
Publication of JPH0455338B2 publication Critical patent/JPH0455338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP15526884A 1984-07-27 1984-07-27 半導体装置の冷却装置 Granted JPS6135526A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15526884A JPS6135526A (ja) 1984-07-27 1984-07-27 半導体装置の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15526884A JPS6135526A (ja) 1984-07-27 1984-07-27 半導体装置の冷却装置

Publications (2)

Publication Number Publication Date
JPS6135526A JPS6135526A (ja) 1986-02-20
JPH0455338B2 true JPH0455338B2 (pm) 1992-09-03

Family

ID=15602193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15526884A Granted JPS6135526A (ja) 1984-07-27 1984-07-27 半導体装置の冷却装置

Country Status (1)

Country Link
JP (1) JPS6135526A (pm)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4964458A (en) * 1986-04-30 1990-10-23 International Business Machines Corporation Flexible finned heat exchanger
JP7188120B2 (ja) * 2019-01-22 2022-12-13 株式会社デンソー 車両用空調装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52159167U (pm) * 1976-05-28 1977-12-02
JPS55140255A (en) * 1979-04-18 1980-11-01 Nec Corp Heat sink structure

Also Published As

Publication number Publication date
JPS6135526A (ja) 1986-02-20

Similar Documents

Publication Publication Date Title
US5195576A (en) Lsi cooling apparatus and computer cooling apparatus
JP3158983B2 (ja) Lsiパッケージ冷却用コルゲート型放熱フィン
US6538888B1 (en) Radial base heatsink
US6260610B1 (en) Convoluted fin heat sinks with base topography for thermal enhancement
US6561267B2 (en) Heat sink and electronic circuit module including the same
JPS6138237Y2 (pm)
US6684501B2 (en) Foil heat sink and a method for fabricating same
US20050150637A1 (en) Heat sink and multi-directional passages thereof
US20050121172A1 (en) Composite heatsink for cooling of heat-generating element
JPH0455338B2 (pm)
JPH10125836A (ja) ヒートシンク冷却装置
JP3405900B2 (ja) ヒートシンク装置
JP3992953B2 (ja) ヒートシンク
JPS6219073B2 (pm)
JP3845038B2 (ja) ヒートシンクの製造方法
JPH0523593U (ja) 電子回路モジユール
JPS6211008Y2 (pm)
JPH11145349A (ja) 強制冷却用ヒートシンク
JPS6336691Y2 (pm)
JPH05218245A (ja) 半導体装置および半導体装置用ヒートシンク
JPH0396261A (ja) ヒートパイプ式冷却器
JP2004200542A (ja) ヒートシンクおよびその製造方法
JPS6331397Y2 (pm)
JPH06323773A (ja) 熱伝達装置
JP3358378B2 (ja) 発熱素子の冷却構造

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees