JPH0453615Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) The present invention relates to a manufacturing device for manufacturing a tape-type optical fiber core wire in which a plurality of strands are coated with a coating layer, and in particular, in such a device, The present invention relates to a die apparatus used to form a coating layer around a wire.

(Prior art) The optical fiber core wire of the above type has a structure in which a plurality of wires (wires in which the optical fiber body is covered with a primary coating layer) arranged on the same plane are covered with a synthetic resin coating layer. , and has a flat cross-sectional shape as a whole.

Such a coating layer is created by attaching uncured resin to an assembly of multiple wires, passing it through a die hole to mold the uncured resin into a predetermined shape, and then cross-linking the resin with an ultraviolet lamp device. The coating layer is completed by curing.

(Problem to be solved by the invention) In order to increase the manufacturing efficiency in the above type of manufacturing equipment, it is sufficient to increase the feeding speed of the strand assembly, but if the feeding speed is increased, the coating layer etc. In practice, it is difficult to increase the feed rate to sufficiently increase the production efficiency, since the quality of the feed rate decreases.

(Means for Solving the Problems) In order to solve the above problems, the present invention aims to simultaneously process two strand assemblies using one die device, thereby increasing manufacturing efficiency. Specifically, it is structured as follows.

In other words, the present invention provides a resin supply unit that supplies uncured resin around the strand assembly to a die device to which a strand assembly consisting of a plurality of strands arranged on the same plane is supplied downward, and a resin supply unit that supplies uncured resin around the strand assembly. A die located below the supply section and a nipple located below the resin supply section are provided, and two die holes elongated in the longitudinal direction of the cross section of the strand assembly are formed in the die parallel to each other and above the resin supply section. The nipples are formed adjacent to each other in a direction perpendicular to the longitudinal direction, and the nipples are provided with two elongated nipple holes in the same direction as the die holes, which are aligned approximately vertically with respect to the die holes. The distance between the centers of the holes is made smaller than the distance between the centers of the two nipple holes, and the distance between the die hole and the wire assembly 2 passing through the die hole is changed from the distance A on the inside of the two wire collections to the distance A on the outside. The wire assembly is configured to be larger than the gap B, and the strand assembly is passed through each nipple hole to position it in the horizontal direction, and the two strand assembly with uncured resin is passed through each die hole to uncured. It is characterized in that the resin is molded into a predetermined outer peripheral shape.

(Function) According to the above configuration, each of the two wire assemblies is positioned by the nipple hole, and
The uncured resin passes through the resin supply section and enters the die hole, and the uncured resin adhering to each wire assembly in the resin supply section is molded by the inner periphery of the die hole. An uncured resin adhesion molding process is performed.

(Example) In FIG. 1, tape-shaped fiber core wire 1
The wire assembly 2 includes a wire assembly 2 made up of a plurality of (for example, four) wires, and a coating layer 3 covering the wires.
Each strand has a circular cross section and is composed of an optical fiber body and a resin outer sheath, and in the strand assembly 2, such strands are arranged parallel to each other on the same plane and in contact with each other. . The cross section of the covering layer 3 has a flat oval shape.

Such a tape-shaped fiber core wire 1 is manufactured as follows. In FIG. 2, two wire assemblies 2 are fed from above to the die device 10 in a state parallel to each other and separated by a slight distance.
The die device 10 is for forming an uncured resin coating layer 3 around the wire assembly 2, and below it is a curing device (not shown) for curing the uncured resin coating layer 3. ) is provided. The resin is, for example, a polyurethane acrylate, epoxyurethane, or polybutadiene acrylate resin, and the curing device includes a UV (ultraviolet) lamp device for crosslinking and curing such resin.

The die device 10 is provided with a die 20, a nipple 21 located above the die 20, and a resin supply section 22 located between the two. Resin supply section 2
2 is formed of a kind of liquid resin reservoir, and the liquid resin is made to adhere to the surface of the wire assembly 2.

The die 20 is provided with two die holes 25. Each die hole 25 has an elongated shape that roughly corresponds to the cross-sectional shape of the core wire 1, and both die holes 25 have a narrow strip-shaped boundary with their long sides 26 (FIG. 1) being parallel to each other. They are adjacent to each other in the left-right direction (direction perpendicular to the long side 26) in FIG. 1 with the portion 27 in between. That is, both die holes 25 are arranged in two rows.

The nipple 21 is provided with two nipple holes 28. The dimensions and shape of each nipple hole 28 generally correspond to the dimensions and shape of the cross section of the strand assembly 2.
Both nipple holes 28 are arranged generally vertically with respect to the die hole 25, and both the nipple holes 28
They are formed in two rows in the same positional relationship as 5.

According to the above configuration, liquid resin is attached to the two wire assembly 2 in the resin supply section 22, and when the wire assembly 2 passes through the die hole 25 in this state, the outer periphery of the uncured resin is The inner surface of the die hole 25 is molded into a predetermined size and shape.

In this resin adhesion molding operation, the inner periphery of the nipple hole 28 contacts or approaches the outer periphery of the wire assembly 2, thereby preventing the position of the wire assembly 2 from shifting in the horizontal direction. Therefore, each wire assembly 2 passes through the die hole 25 in an accurately positioned state, and as a result, a resin coating layer 3 of uniform thickness is formed around the wire assembly 2.

In addition, in the above operation, the resin supply section 2 in FIG.
2, as described above, forms a kind of liquid resin pool and attaches the resin to the wire assembly 2, but within the resin pool, the area between the two flat wire assembly 2 is
It is relatively difficult for resin to flow into the space 30. Therefore, in each strand assembly 2, the amount of resin adhered to the surface on the side of the gap 30 is insufficient, and as a result, the thickness of a part of the completed coating layer 3 (the part facing the gap 30) There is a risk that there will be a shortage.

In consideration of this point, the present invention is configured as follows.

That is, A in FIG. 2 is the space between the boundary portion 27 and the wire assembly 2, and B is the space between the inner surface portion 31 of each die hole 25 opposite to the boundary portion 27 and the wire assembly 2. It is between 〓 between. In the illustrated embodiment, the center of each nipple hole 28 is slightly shifted toward the inner surface portion 31 with respect to the center of the die hole 25 below, and the gap A is slightly wider than the gap B. The position of the line assembly 2 is set.

Therefore, the resin passing through the gap A will pass through the die hole 25.
As a result, the gap 3 of the wire assembly 2 at the entrance of the die hole 25 is not removed much.
Even if the amount of resin adhered to the portion facing 0 is relatively small, the coating layer 3 having a substantially uniform thickness is formed around the entire periphery of the wire assembly 2 at the point where it passes through the die hole 25.

(Effects of the invention) As explained above, according to the invention, two strand aggregates 2 can be processed at the same time in the die device 10 for manufacturing the tape-shaped optical fiber core 1. Set the feed rate to a relatively low value (i.e., enough to ensure the desired product quality)
The processing rate, that is, the manufacturing rate of the core wire 1 can be doubled while maintaining the same. Furthermore, in the present invention, the distance between the centers of the two die holes 25 is made smaller than the distance between the centers of the two nipple holes 28.
5 and the wire assembly 2 passing through it.
The inner space A of the book strand assembly 2 and the outer space B
Since the structure is larger, the two die holes 25 are adjacent to each other, so that the space between the two strand aggregates 2 is small.
It is relatively difficult for the resin to flow into the gap 30, resulting in a low pressure, but since the gap A is larger than the gap B, the resin adheres sufficiently even in the gap A, and the strands are assembled when they pass through the die hole 25. A coating layer 3 having a substantially uniform thickness is formed around the entire circumference of the body 2.

[Brief explanation of the drawing]

FIG. 1 is a schematic horizontal sectional view of a die device employed in the apparatus of the embodiment, and FIG. 2 is a schematic vertical sectional view of the apparatus of the embodiment. DESCRIPTION OF SYMBOLS 1... Tape-shaped optical fiber core wire, 2... Wire assembly, 3... Covering layer, 10... Dice device, 2
0...Dice, 21...Nipple, 22...Resin supply part, 25...Dice hole, 28...Nipple hole.

Claims (1)

[Scope of utility model registration request] A die device to which a strand assembly consisting of a plurality of strands arranged on the same plane is fed downward, includes a resin supply section that supplies uncured resin around the strand assembly, and a resin supply section that supplies uncured resin to the periphery of the strand assembly. A die located below and a nipple located above the resin supply section are provided, and two die holes elongated in the longitudinal direction of the cross section of the strand assembly are formed in the die parallel to each other and perpendicular to the longitudinal direction. two elongated nipple holes in the same direction as the die hole are provided in the nipple in a positional relationship that is approximately vertically aligned with the die hole, and the center distance between the two die holes is is smaller than the center distance between the two nipple holes, and 〓 of the wire assembly 2 passing through the die hole and its inside.
The gap is on the inside of the two strands of wire assembly, and the gap is on the outside.
The wire assembly is configured to be larger than the gap B, and the strand assembly is passed through each nipple hole to position it in the horizontal direction.
A die device for producing an optical fiber core, characterized in that the uncured resin is molded into a predetermined outer peripheral shape by passing two wire aggregates to which uncured resin is adhered through each die hole.