JPH0173814U - - Google Patents
Info
- Publication number
- JPH0173814U JPH0173814U JP1987168397U JP16839787U JPH0173814U JP H0173814 U JPH0173814 U JP H0173814U JP 1987168397 U JP1987168397 U JP 1987168397U JP 16839787 U JP16839787 U JP 16839787U JP H0173814 U JPH0173814 U JP H0173814U
- Authority
- JP
- Japan
- Prior art keywords
- die
- strand assembly
- uncured resin
- nipple
- supply section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 210000002445 nipple Anatomy 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 3
- 239000010410 layer Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Description
第１図は実施例の装置に採用されるダイス装置
の水平断面略図、第２図は実施例の装置の垂直断
面略図、第３図は第２図の−断面拡大部分略
図である。
１……テープ形光フアイバー心線、２……素線
集合体、３……被覆層、１０……送出機構、１１
……ダイス装置、１２……硬化装置、１６……プ
ーリー、２０……ダイス、２１……ニツプル、２
２……樹脂供給部、２５……ダイス孔、２６……
ニツプル孔、３０……溝。
FIG. 1 is a schematic horizontal sectional view of a die device employed in the apparatus of the embodiment, FIG. 2 is a schematic vertical sectional view of the apparatus of the embodiment, and FIG. 3 is an enlarged partial schematic view of the minus cross section of FIG. DESCRIPTION OF SYMBOLS 1... Tape-shaped optical fiber core wire, 2... Wire assembly, 3... Covering layer, 10... Delivery mechanism, 11
...Dice device, 12...Curing device, 16...Pulley, 20...Dice, 21...Nipple, 2
2...Resin supply section, 25...Dice hole, 26...
Nipple hole, 30...groove.
Claims (1)
線集合体を下向きに送り出す送出機構と、送出機
構よりも下方において素線集合体の周囲に未硬化
樹脂の被覆層を形成するためのダイス装置と、ダ
イス装置の下方において上記未硬化樹脂の被覆層
を硬化させる硬化装置と、硬化装置の下方におい
て被覆層付き素線集合体を案内するプーリーとを
設け、上記ダイス装置に、素線集合体の周囲に未
硬化樹脂を供給する樹脂供給部と、樹脂供給部よ
りも下方に位置するダイスと、樹脂供給部よりも
上方に位置するニツプルとを設け、上記ダイスに
、未硬化樹脂の付着した素線集合体を通過させて
未硬化樹脂の外周形状を成形するためのダイス孔
を設け、上記ニツプルに、素線集合体が水平かつ
互いに直交する２方向に位置決めされながら通過
するニツプル孔を設け、上記プーリーの外周に、
被覆層付き素線集合体が嵌合して水平かつ互いに
直交する２方向に位置決めされる溝を設けたこと
を特徴とするテープ形光フアイバー心線の製造装
置。 A delivery mechanism that sends out a strand assembly consisting of a plurality of strands arranged on the same plane downward, and a die that forms a coating layer of uncured resin around the strand assembly below the delivery mechanism. a curing device for curing the coating layer of the uncured resin below the die device, and a pulley for guiding the strand assembly with the coating layer below the curing device; A resin supply section that supplies uncured resin around the body, a die located below the resin supply section, and a nipple located above the resin supply section are provided, and the uncured resin is attached to the die. A die hole is provided through which the strand assembly passed through to form the outer peripheral shape of the uncured resin, and a nipple hole is provided in the nipple through which the strand assembly passes through while being positioned horizontally and in two directions orthogonal to each other. provided, on the outer periphery of the above pulley,
1. An apparatus for manufacturing a tape-shaped optical fiber core, characterized in that a groove is provided in which a strand assembly with a covering layer is fitted and positioned in two horizontal and mutually orthogonal directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168397U JPH0173814U (en) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168397U JPH0173814U (en) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173814U true JPH0173814U (en) | 1989-05-18 |
Family
ID=31457537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168397U Pending JPH0173814U (en) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173814U (en) |
-
1987
- 1987-11-02 JP JP1987168397U patent/JPH0173814U/ja active Pending